Optical reflective structures and method for making

ABSTRACT

A method of constructing an electronic circuit assembly comprising forming at least one electrode on a substrate; forming a layer of undercladding material upon the substrate and over the electrode; and forming a wave guide core layer on the layer of cladding material. The wave guide layer is patterned to produce at least one optical wave guide and exposed undercladding material. The method of constructing further includes forming a layer of overcladding material upon the exposed undercladding material and over the optical wave guide; forming at least one via aperture through the overcladding material and the undercladding material; and disposing a conductive material in the via aperture to produce an electronic circuit assembly.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is continuation-in-part application of copendingapplication having Ser. No. 09/574,422, filed May 19, 2000, and entitled“Three-Dimensional-Opto-Electronic Modules with Electrical and OpticalInterconnections and Methods for Making.”

Application Ser. No. 09/574,422 is a continuation-in-part of U.S. Pat.application Ser. No. 09/295,628 filed Apr. 20, 1999, entitled“Opto-Electronic Substrates With Electrical And Optical InterconnectionsAnd Methods For Making” and commonly assigned, and which claimed thebenefit of U.S. Provisional Application No. 60/103,726 filed Oct. 9,1998.

Application Ser. No. 09/574,422 is also a continuation-in-part of U.S.Pat. application Ser. No. 09/295,813 filed Apr. 20, 1999, entitled“Systems Based On Opto-Electronic Substrates With Electrical And OpticalInterconnections And Methods For Making,” and commonly assigned, andwhich claimed the benefits of U.S. Provisional Application No.60/103,726 filed Oct. 9, 1998.

Application Ser. No. 09/574,422 is also continuation-in-part of U.S.Pat. application Ser. No. 09/295,431, filed Apr. 20, 1999, entitled“Multi-Layer Opto-Electronic Substrates With Electrical And OpticalInterconnections And Methods For Making,” and commonly assigned, andwhich claimed the benefits of U.S. Provisional Application No.60/103,726 filed Oct. 9, 1998.

Benefit of all earlier filing dates is claimed with respect to commonsubject matter.

FIELD OF THE INVENTION

The present invention relates to opto-electronic substrates that may beused to connect digital and/or analog electronic systems, and methodsfor making such systems. More specifically, the present inventionrelates to opto-electronic substrates that have both electrical andoptical interconnections, and methods for making such substrates. Thepresent invention may be applied to multichip modules (MCMs) and thelike.

BACKGROUND OF THE INVENTION

With the increase in clock rates and I/O counts of processing systemsimplemented on interconnection substrates, the problems ofinterconnection bottlenecks, noise, signal attenuation, heat generation,and maintaining synchronizable connection lengths in the electricalconnections of such systems are appearing. An optical interconnect hasthe advantage of low RC delay, low signal attenuation, predictabledelay, low power, low noise and high tolerance to opens and shorts.However, there is a large barrier which prevents opticalinterconnections from being used in high-speed digital/analog systems.Thus far, bulky driver chips and amplifier chips have been required toprovide the conversions between the optical signals in the opticalinterconnects and the electrical signals which are generated and used bythe electronic chips. Each electrical signal that is to be conveyedoptically over a long distance requires a light emitting device, adriver chip to generate the electrical power for switching thelight-emitting device at one end of the optical connection. At thereceiving end of the optical connection, a photo-detector device and anamplifier is required to convert the optical signal to electrical form.The amplifier is needed because the light power becomes small at thephoto-detector device due to considerable loss in conventional opticalpaths. The driver and amplifier components require space on the circuitsubstrate, and therefore represent barriers to using large numbers ofoptical connections in a substrate, like a multichip module. In fact,the area needs of these components, as well as the area needs for theemitter devices and photo-detector devices, would increase the size ofthe module substrates to be larger than module substrates with pureelectrical connections. These excess components and their assemblingincrease manufacturing costs. Furthermore, the conventional opticalconnections have longer delay due to EO and OE conversions, which wouldnot provide significant speed benefits over pure electrical modules.

The present application is directed to providing optical connectionconfigurations and methods for manufacturing the optical connectionssuch that the above problems may be overcome.

SUMMARY OF THE INVENTION

One aspect of the present application eliminates the need for the bulkydrivers and amplifiers, which significantly reduces area requirements.In the place of a light-emitting source, the combination of an externallight-source and an optical switch device (e.g., modulator) is used. Theoptical switch device is responsive to an output of an IC chip, and doesnot require a driver chip for operation. In contrast to light emittingsource cases, the power of optical signals in implementations usinglight modulators can be greatly increased by increasing the size andpower of the external light source. The external light source can beeasily increased in this manner since it does not need to be modulated.For example, it can be implemented as a simple continuous wave (CW) orpulse trains source of optical power. In addition, losses in the opticalconnection are reduced. Therefore, the power at the photo-detectors isincreased, which enables the amplifiers to be eliminated. The losses arereduced by integrally forming polymeric waveguides with the opticalswitches and the photo-detectors, which increases optical couplingefficiency. Additionally, the construction methods of the presentinvention enable short optical connections to be made. Optical power tothe photo-detector device is increased by using the external opticalpower. In addition, optical waveguide integration methods of the presentinvention enable highly efficient optical connections to be made toVGSEL and laser-diode (LD) emitter devices, which enables these devicesto be used as sources of optical power in addition to external sources.

Another aspect of the present application realizes device and/ormaterial integration into an “opto-electronic (OE) layer”, whichincreases room for chip-mounting, and reduces the total system cost byeliminating the difficulty of optical alignment between OE devices andoptical waveguides. OE devices can be embedded into waveguide layers byusing wafer processing techniques according to the present invention.Methods according to the present invention enable opto-electronicdevices (e.g., modulators, VCSELs, photo-detectors, optical switches,laser-diode(LD), driver chips, amplifier chips, etc.) to be integratedwith optical waveguides in ultra thin polymer layers on the order of 1μm to 250 μm.

Another aspect of the present application provides OE substrates bystacking the above-described OE layers on top of one another and byjoining them together, such as by lamination or by a build-upfabrication process. The OE layers can then be overlaid upon the surfaceof a conventional electrical substrate without requiring extra room forthe photo-detectors, optical-switches, light-emitting components, driverchips, amplifier chips, etc. in fact, multiple OE layers can be stackedupon one another to provide all the required photo-detectors,optical-switches, light-emitting devices, driver chips, amplifier chips,etc. The present application provides several construction methods forforming these OE layers, and also provides several substrateconfigurations.

Another aspect of the present application is a method to stack two ormore OE films, permitting an increase in the functionality of thestacked structure compared to a single OE film. Each OE film maycomprise a single-layer structure or be build-up-of multiple-layerstructures, including electrical layers by a Z-connection method. The OElayers and electrical layers on each OE film may be optimizedseparately. Preferred embodiments of stacked OE films include flexibleinterconnections, OE Interposers, film OE-MCM, both-side packaging,back-side connection, and a Film Optical Link Module (FOLM).Additionally, stacked films permit the use of a greater variety offabrication processes compared to a single film. In particular, astacked film enables both-side processing by permitting processed layersto be inverted upside-down.

On embodiment of the invention provides a method of constructing anelectronic circuit assembly comprising the steps of:

a) forming at least one electrode on a substrate;

b) forming a layer of undercladding material upon the substrate and overthe electrode;

c) forming a wave guide core layer on the layer of cladding material;

d) patterning the wave guide layer to produce at least one optical waveguide and exposed undercladding material;

e) forming a layer of overcladding material upon the exposedundercladding material and over the optical wave guide;

f) forming at least one via aperture through the overcladding materialand the undercladding material; and

g) disposing a conductive material in the via aperture to produce anelectronic circuit assembly.

In the immediate foregoing method, the disposing step (g) additionallycomprises disposing a partial layer of the conductive material over theovercladding material. Preferably, a patterned resist is preferablyformed on the overcladding material prior to the disposing step (g). Thevia aperture may terminate in the electrode. The forming step (f)additionally comprises removing a portion of the optical wave guide Theforming step (f) further additionally comprises forming the via apertureto have opposed via walls such that a portion of the optical wave guideis generally centrically disposed in the via aperture between the viawalls. Disposing step (g) may additionally comprise disposing conductivematerial on the opposed via walls and against the portion of the opticalwave guide.

Another embodiment of the invention provides a method of constructing anelectronic circuit assembly comprising the steps of:

a) forming at least one electrode on a substrate;

b) disposing an electro-optic device on the substrate;

c) forming a layer of undercladding material upon the substrate and overthe electrode and the electro-optic device;

d) disposing a second electrode on the layer of undercladding material;

e) disposing an intermediate layer of cladding material over exposedportions of the layer of undercladding material and over the secondelectrode;

f) forming a wave guide core layer on the layer of cladding material;

g) patterning the wave guide layer to produce at least one optical waveguide and exposed undercladding material;

h) forming a layer of overcladding material upon the exposedundercladding material and over the optical wave guide;

i) forming at least one via aperture through the overcladding materialand the undercladding material; and

j) disposing a conductive material in the via aperture to produce anelectronic circuit assembly.

The immediate foregoing method may additionally comprise polishing thelayer of the cladding material prior to disposing step (d) until a topof the electrode is aligned with the cladding material; and forming,prior to disposing step (d), an opening in the layer of undercladdingmaterial to expose a portion of the electro-optic device; and disposingconductive material in the opening and in contact with the electro-opticdevice. The disposing step (j) may additionally comprise disposing apartial layer of the conductive material over the overcladding material.A patterned resist may be formed on the overcladding material prior tothe disposing step (j). The forming step (i) may additionally compriseremoving a portion of the optical wave guide and/or forming a forty-fivedegree sidewall in the optical wave guide for receiving an opticalreflective surface. The forming step (i) may also additionally compriseforming the via aperture to have opposed via walls such that a portionof the optical wave guide is generally centrically disposed in the viaaperture between the via walls. Disposing step (j) may additionallycomprise disposing conductive material on the opposed via walls andagainst the portion of the optical wave guide.

Embodiments of the present invention also provide a method ofconstructing an electronic circuit assembly comprising the steps of:

a) forming a layer of undercladding material upon a first substrate;

b) forming a wave guide core layer on the layer of cladding material;

c) patterning the wave guide layer to produce at least one optical waveguide and exposed undercladding material;

d) forming a layer of overcladding material upon the exposedundercladding material;

e) forming at least one via aperture through the overcladding materialand the undercladding material;

f) disposing a conductive material in the via aperture leaving a firstportion of the conductive material exposed; and

g) coupling the first portion of the conductive material to a secondsubstrate to produce an electronic circuit.

The immediate foregoing method additionally comprises removing the firstsubstrate to expose a second portion of the conductive material, anddisposing at least one electrode on the exposed second portion of theconductive material, and coupling the disposed electrode to anotherelectronic circuit assembly. The second substrate may be removed toexpose the first portion of the conductive material.

Further embodiments of the present invention provide a method ofconstructing an electronic circuit assembly comprising the steps of:

a) forming a layer of undercladding material upon a first substrate;

b) forming a wave guide core layer on the layer of cladding material;

c) patterning the wave guide layer to produce at least one optical waveguide and exposed undercladding material;

d) forming a layer of overcladding material upon the exposedundercladding material and over the optical wave guide;

e) disposing an electrode on the layer of overcladding material;

f) disposing an electro-optic device on the layer of overcladdingmaterial;

g) depositing an intermediate layer of cladding material over exposedovercladding material and over the electrode and the electro-opticdevice;

h) removing a portion of the intermediate layer of cladding material anda portion of a top of the electrode until a plane along the top of theelectro-optic device registers with a residual electrode surface and aresidual cladding surface respectively remaining after removal of theportion of the top of the electrode and the portion of the intermediatelayer of cladding material;

i) disposing a second electrode on the residual electrode surface;

j) coupling the second electrode to a second substrate;

k) removing the first substrate to expose the undercladding material;

l) forming at least one via aperture through the overcladding materialand the undercladding material; and

m) disposing a conductive material in the via aperture to produce anelectronic circuit assembly.

Another aspect of the present application is to providethree-dimensional opto-electrical modules, and methods for making, whichprovide for Z-direction waveguides formed perpendicular to the plane ofa stack of OE, waveguide, and chip layers, and which interconnectionsbetween the Z-direction waveguides and waveguides in the stack oflayers.

These features provide the advantageous effect of enabling large-scaleoptical interconnections to be added to electrical substrates withoutincreasing area requires of the substrate. These features also enablethe optical coupling efficiencies of optical interconnections to beincreased. These features are also applicable to optical-parallel-linkmodules.

In the present application, examples of multichip modules areprincipally shown. However, the same features and aspects of the presentinvention are applicable to electrical backplanes, printed-circuitboards (PCBs), chip size packages (CSPs), and other substrates.

DESCRIPTION OF DRAWINGS

FIG. 1 is a first embodiment of an optical-electrical multichip-modulesubstrate according to the present invention.

FIGS. 2 and 3 are a first embodiment of an optical switch according tothe present invention.

FIGS. 4-1 and 5-1 are a first embodiment of a photo-detector deviceaccording to the present invention.

FIGS. 4-2 and 5-2 are a second embodiment of a photo-detector deviceaccording to the present invention.

FIGS. 4-3 and 5-3 are a third embodiment of a photo-detector deviceaccording to the present invention.

FIG. 6 is a second embodiment of an optical-electrical multichip-modulesubstrate according to the present invention.

FIGS. 7 and 8 are a first embodiment of a lateral emitter deviceaccording to the present invention.

FIGS. 9 and 10 a first embodiment of a vertical emitter device accordingto the present invention.

FIGS. 11-20 illustrate construction methods according to the presentinvention.

FIGS. 21-26 are views of a first multichip module system according tothe present invention.

FIGS. 27-30 illustrate construction methods for making selectedcomponents used in the system of FIGS. 21-26 and other systems accordingto the present invention.

FIGS. 31, 32, and 32-1 are views of a second multichip module systemaccording to the present invention.

FIGS. 33-36, and 37-1 through 37-4 illustrate further embodiments of theoptical-electrical multichip-module substrates according to the presentinvention.

FIGS. 38-68 illustrate further construction methods for theoptical-electrical multichip-module substrates according to the presentinvention.

FIGS. 69-70 illustrate a free-space MCM system according to the presentinvention.

FIGS. 71-73 illustrate three-dimensional MCM systems according to thepresent invention.

FIGS. 74-81 show schematic views of an exemplary thin film with integraldevices and waveguides as being fabricated according to another processaccording to the present inventions.

FIGS. 82-89 show schematic views of another exemplary thin film withintegral devices and waveguides as being fabricated according to anotherprocess according to the present inventions.

FIGS. 90-104 show perspective views of an exemplary waveguide layerbeing processed according to exemplary methods for forming vertical andhorizontal optical couplers according to the present invention.

FIGS. 105 and 106 are top plan and cross-sectional views, respectively,of an exemplary corner turning mirror according to the presentinventions.

FIGS. 107 and 108 are top plan and cross-sectional views, respectively,of another embodiment of a waveguide coupler with a waveguide mirroraccording to the present inventions.

FIGS. 109-111 show schematic side views of additional three-dimensionalOE stack configurations according to the present inventions.

FIG. 112 shows schematic side views of additional exemplary stackingconfigurations of OE films using Z-connections according to the presentinventions.

FIGS. 113-116 show schematic side views of various exemplary OE filmsaccording to the present inventions.

FIGS. 117-120 show schematic side views of exemplary film optical linkmodules (FOLM) embodiments according to the present invention.

FIG. 121 shows a schematic top view of an OE film of an FOLM structureaccording to the present inventions.

FIGS. 122 and 123 are schematic top and side views, respectively of afurther embodiment of a FOLM OE film according to the presentinventions.

FIGS. 124 is schematic perspective view of a further embodiment of aFOLM OE film according to the present inventions.

FIG. 125 is a schematic side view of another FOLM embodiment accordingto the present invention.

FIG. 126 shows a schematic side view of a exemplary Film Optical LinkModule (FOLM) embodiment according to the present invention.

FIG. 127 shows a top plan view of the embodiment shown in FIGS. 126.

FIG. 128 shows a schematic side view of a portion of the FOLM embodimentof FIG. 126 according to the present invention.

FIG. 129 shows a top plan view of the polymer layer in the embodiment ofFIG. 128 which has an opto-electronic device embedded therein accordingto the present invention.

FIG. 130 shows an opto-electronic interposer (OE-IP) embodiment suitablefor chips, chip size packages (CSPs), and multichip modules (MCMs)according to the present inventions.

FIG. 131 shows another OE-IP embodiment suitable for multichip modules(MCMs) according to the present inventions.

FIGS. 132-134 show additional OE-IP embodiments suitable for multichipmodules (MCMs) according to the present inventions.

FIG. 135 shows an another OE-IP embodiment with optical interconnectionsto chips/MCMs mounted to both sides of the OE-IPs according to thepresent inventions.

FIGS. 136-137 show OE-IP embodiments with external and flexibleinterconnections according to the present inventions.

FIG. 138 shows an OE-IP embodiment where the optical interconnections ofthe interposer are on the opposite side of the chip/CSP/MCM according tothe present inventions.

FIG. 139 shows an embodiment having an OE-IP film and MCM according tothe present inventions.

FIG. 140 shows an OE-film-MGM embodiment according to the presentinventions.

FIGS. 141-142 show smart pixel embodiments according to the presentinventions.

FIG. 143 shows an opto-electric (OE) printed circuit board/mother boardembodiment according to the present inventions.

FIGS. 144-146 show respective OE film embodiments useful for bothintra-MCM and inter-MCM optical connections according to the presentinvention.

FIGS. 147-153 show schematic side views of an exemplary structure beingfabricated by an exemplary process to fabricate an OE film with embeddeddevices according to the present inventions.

FIGS. 154-158 illustrate an additional embodiment of thethree-dimensional electro-optical systems according to the presentinvention.

FIGS. 159 and 160 illustrate two methods for constructing holding blocksof the three-dimensional electro-optical systems according to thepresent invention.

FIGS. 161-169 illustrate additional, but related, embodiments of thethree-dimensional electro-optical systems according to the presentinvention.

FIGS. 170-176 illustrate an additional method of constructingopto-electronic/chip layers and opto-electronic waveguide layers forthree-dimensional modules according to the present invention;

FIGS. 177-180 illustrate yet an additional method of constructingopto-electronic/chip layers and opto-electronic waveguide layers forthree-dimensional modules according to the present invention;

FIG. 181 is a side elevational view of a substrate supportingelectrodes;

FIG. 182 is a side elevational view of the structure of FIG. 181;

FIG. 183 is a side elevational view of the electrode structure of FIG.181 after a cladding layer has been disposed thereon;

FIG. 184 is an end elevational view of the electrode structure of FIG.183;

FIG. 185 is a side elevational view of the electrode structure of FIG.183 after a waveguide layer has been disposed thereon;

FIG. 186 is an end elevational view of the electrode structure of FIG.185;

FIG. 187 is the electrode structure of FIG. 185 including waveguidelayer portions represented as dotted lines which are to be etched orotherwise removed and with the solid waveguide portions representingwaveguides which are to remain;

FIG. 188 is an end elevational view of the electrode structure of FIG.187;

FIG. 189 is the electrode structure of FIG. 187 after the waveguidelayer portions which were represented by dotted lines were removed;

FIG. 190 is an end elevational view of the electrode structure of FIG.189;

FIG. 191 is a side elevational view of the electrode structure of FIG.189 after a cladding material layer has been disposed over the waveguidelayer;

FIG. 192 is an end elevational view of the electrode structure of FIG.191;

FIG. 193 is the side elevational view of the electrode structure of FIG.191 after a resist mask has been disposed on the structure and after aplurality of vias or apertures were produced in the structure to exposethe lower waveguide layer;

FIG. 194 is an end sectional view of the electrode structure of FIG.193;

FIG. 195 is a side elevational view of the electrode structure of FIG.193 after conductive material was deposited in the vias;

FIG. 196 is an end vertical sectional view of the electrode structure ofFIG. 195;

FIG. 197 is a side elevational view of the electrode structure of FIG.206 after the mask was removed;

FIG. 198 is an end sectional view of the electrode structure of FIG.197;

FIG. 199 is a side elevational view of the electrode assembly of FIG.197 after the lower substrate has been removed;

FIG. 200 is an end sectional view through the electrode assembly of FIG.199;

FIG. 201 is a side elevational view of the electrode assembly of FIG.199 after the upper substrate was coupled by Z-connection to theelectrode assembly of FIG. 199;

FIG. 202 is an end sectional view through the electrode structure ofFIG. 201;

FIGS. 203-232 represent essentially identical process steps of FIGS.181-202 except an optical light emitter (e.g. a VCSEL) was disposed onthe substrate and another layer of electrodes was disposed on theinitial layer of electrodes;

FIGS. 233-258 represent another embodiment of the process stepsrepresented by FIGS. 181-202 except the upper substrate is coupled tothe electrode assembly before the lower substrate is removed;

FIGS. 259-282 represent another embodiment of the process stepsrepresented by FIGS. 181-202;

FIGS. 283-316 represent another embodiment of process steps representedby FIGS. 181-202.

DETAILED DESCRIPTION OF THE PRESENT INVENTION

FIG. 1 shows an expanded perspective view of a first embodiment of anopto-electronic (optical-electronic) interconnect substrate according tothe present invention at reference number 10. The interconnect substrate10 takes the form of an opto-electronic multichip module (OE-MCM)substrate that interconnects signal from a plurality of I.C. chips 1 a-1d, including both inter-chip and intra-chip connections, by both opticallinks and electrical traces. Substrate 10 comprises a base substrate 12and an active layer 20. The active layer comprises optical waveguides 24a-24 h, opto-electronic switching devices 26 a-26 c, photo-detectordevices 28 a-28 c, electrical traces 30, and electrical connection pads32 for the I.C. chips 1. The LC. chips are flip-chip assembled to activelayer 20 and are electrically coupled to the connection pads 32 of layer20 by a plurality of any type of conventional connectors 2. For theexample, as shown in FIG. 1, connectors 2 may comprise solder bumps. Theoptical waveguides 24 and the opto-electronic devices 26 and 28 areincorporated into active layer 20, and are preferably embedded thereinsuch that the top surface of layer 20 is substantially flat (e.g.,having a surface uniformity that is within ±10 μm over a 1 cm squarearea, except for small holes, grooves, bumps, etc.).

Signals between the chips may be conveyed electrically by traces 30 oroptically by waveguides 24. When the signals are conveyed by light(i.e., optically) on waveguides 24, the opto-electronic devices 26 and28 provide the conversions between light and electrical representationsof the signals. As one example of how light may be used to convey asignal, a light power source is brought to OE-MCM substrate 10 byoptical fiber 4 and is coupled to optical waveguide 24 a. (A light powersource may provide a continuous source of light energy during theoperation of the circuit or system formed by chips 1, or it may providea pulse train of light pulses.) The coupling between fiber 4 andwaveguide 24 a may be accomplished by a standard V-groove connector 14,whose construction is well known to the optical-fiber communication art.It is also possible to connect optical fibers to the waveguides at thelayer's surface by incorporating 45° mirrors, gratings, etc., within thecore material of the layer and by positioning each fiber so that itscore is aligned to a mirror or grating. The light source propagatesalong waveguide 24 a and is divided among two waveguides 24 b and 24 cby a conventional Y-branch divider in a pre-selected ratio (such as50%—50% if the light is not divided in further stages, or if the lightin each branch is divided again in further stages, or such as 33%-67% ifthe light in one branch is divided again in a further stage). The lightin waveguide 24 b is routed to an opto-electronic switch 26 a, whichselectively routes the light onto waveguide 24 d depending upon theelectrical signal provided to the switch. The electrical signal isprovided to switch 26 a by two connection pads 32, which in turn arecoupled to circuitry on chip la through solder-bump connectors 2. Inthis manner, an electrical output signal from circuitry on chip 1 a isconverted to an optical representation on waveguide 24 d by switch 26 a.

From switch 26 a, waveguide 24 d is routed to a secondelectrical-optical switch 26 b, which has an electrical input which iscoupled to circuitry in chip Id by similar pads 32 and connectors 2.Switch 26 b has one optical input, which is coupled to waveguide 24 d,and one electrical input, which is coupled to circuitry on chip 1 d.Switch 26 b also has two optical outputs, which are coupled towaveguides 24 e and 24 f, respectively. Depending upon the electricalinput to switch 26 b, switch 26 b will either route the light at itsoptical input to one of its optical outputs or the other. An exemplaryconstruction for switch 26 b is described below with reference to FIGS.2 and 3. The optical signals on waveguides 24 e and 24 f are provided totwo photo-detector devices 28 b and 28 c, respectively. Photo-detectordevices 28 b and 28 c convert their respective light signals tocorresponding electrical representations, and provide theirrepresentations to input circuits on I.C. chips 1 c and 1 d,respectively, through corresponding connection pads 32 and connectors 2.Switch 26 b is not always used or necessary in this situation. In such acase, the substrate does not contain the routing switch and the outputof waveguide 24 d may be directly connected to receiver 28 b or 28 c, orto both receivers.

In a similar manner, the light power source on waveguide 24 c is routedto an opto-electronic switch 26 c, which is controlled by an electricaloutput signal from I.C. chip 1 b. From the optical output of switch 26c, the modulated light output is routed onto waveguide 24 h, whichterminates in an optical fiber 5, to be transported off of OE-MCMsubstrate 10. A conventional V-groove connector 15 is used to coupledfiber 5 to waveguide 24 h. As indicated above, it is also possible toconnect optical fibers to the waveguides at the layer's surface byincorporating 45° mirrors, gratings, etc., within the core area (wherethe waveguide mode propagates) of the layer and by positioning eachfiber so that its core is aligned to a mirror or grating. Referring backto waveguide 24 c, which provides the input to switch 26 c, it will benoticed that it crosses at a near right angle with waveguide 24 d. Thecrossing is a conventional optical waveguide intersection, and resultsis a minimal amount of light crossing over from waveguide 24 c towaveguide 24 d, and vice versa.

Photo-detector devices may also be used to receive optical signals fromoutside of OE-MCM substrate 10. An example is shown with photo-detector28 a, which receives a light signal from an optical fiber 3 throughwaveguide 24 g. A conventional V-groove connector 13 is used to couplefiber 3 to waveguide 24 g. As indicated above, a 45° mirror, grating,etc., may also be used. The electrical output of photo-detector device28 a is provided to input circuitry on I.C. chip 1 c through connectionpads 32 and connectors 2.

Although it is not shown in the figure, the optical waveguides can berouted from one terminal of a chip to another terminal of the same chip,thereby providing intra-chip optical interconnection.

The number of waveguides 24, devices 26 and 28 electrical traces 30,interconnection pads 32, fibers 3-5, and chips 1 shown in FIG. 1 hasbeen kept to a low number for the sake of visual simplicity. With thepossible exception of chips and fibers, a typical OE-MCM substrate 10has many more of these components than shown. Also, the size of thecomponents has been exaggerated for the sake of visual clarity. Typicalwidths of waveguides 24 can be on the order of 1 μm to 50 μm, andtypical dimensions of I.C. chips are 1 cm to 4 cm on a side. Typicalwidths of devices 26 and 28 can be on the order of 1 μm to 50 μm (thewidth is the shorter of the two horizontal surface dimensions). Typicallengths of devices 26 and 28 can be on the order of 1 μm to 5,000 μm(the length is the longer of the two horizontal surface dimensions).Typical thickness' (the vertical dimension) of devices 26 and 28 areless than 30 μm, and can be in the range of 1 μm to 20 μm. Typically,the larger sized devices are used in free-space optical connectionapplications. Although FIG. 1 shows that each device 26 and 28 isprovided with two electrical connections from a corresponding I.C. chip,it may be appreciated that active layer 20 may comprise a ground plane(or power plane) within it, and that a device 26 or 28 may have one ofits electrical terminals connected to this plane and its otherelectrical terminal coupled to an output or an input of a correspondingI.C. Instead of fibers 3-5, array fibers, film waveguides, or imagingguides can be used.

FIG. 2 shows a partial cross-sectional view of active layer 20 in thevicinity of opto-electronic switch 26 c, and FIG. 3 shows a top planview of switch 26 c in relation to waveguides 24 c and 24 h. Referringto FIG. 2, active layer 20 comprises a patterned layer 24 of corematerial approximately 5 μm thick, from which the individual waveguides24 a-24 g are formed, such as waveguides 24 c and 24 h. The waveguidelayer is formed above an optional cladding layer 21 (if base substrate12 is not suitable as a cladding layer), and is covered over by a secondcladding layer 23. Cladding layer 23 extends over the sides ofwaveguides 24 as well as the tops of waveguides. As is known in the art,optical waveguides can be made from two types of materials having twodifferent indices of refraction (n₁ and n₂), which are called the corematerial and the cladding material. The core material has the higherindex of refraction. Cladding layers 21 and 23 may have differentindices of refraction, as long as they are both less than the index ofrefraction of core layer 24. The cladding layer may comprise, forexample, Hitachi's fluorinated polyimide OPI-N1005 (Hitachi ChemicalCo.) and the core layer may comprise, for example, Hitachi's fluorinatedpolyimide OPI-N3405 (Hitachi Chemical Co.). If base layer can functionas a suitable cladding layer, then cladding layer 21 may be omitted.

Switch 26 c is embedded in active layer 20, with its bottom surfaceagainst the top surface of base substrate 12. There are a number ofdifferent types of opto-electronic switch devices that can be used. Suchexamples are an internal total-reflection switch, a Mach-Zehndermodular, a digital switch, grating-type switch, electro-absorption (EA)light modulator, semiconductor optical gate switch, etc. The exemplaryswitch device shown in FIG. 2 is an internal total-reflection switch,and it comprises a body of electro-optical (EO) material 626 whichchanges its refractive index when an electric field is applied acrossit. Referring to FIG. 3, the body of EO material 626 is formed in aY-shaped body having a through section between waveguide 24 c and asecond output waveguide 24 i, and a branch section from this throughsection to output waveguide 24 h. Material 626 is placed in the pathbetween input waveguide 24 c and output waveguides 24 h and 24 i, and ispositioned between cladding layers 21 and 23. The field is applied bytwo opposing electrodes 27, which also serve as the electrical terminalsof the device. Short electrical traces, which are not present in thecross-sectional plane of FIG. 2, connect electrodes 27 to respectiveconnection pads 32, which are not present in the cross-sectional planeof FIG. 2 but whose locations in back of the plane are shown by dashedlines. When no potential is applied across electrodes 27, light travelsalong the through section from waveguide 24 c to waveguide 24 i. When anelectrical potential difference is applied between electrodes 27, aportion of the EO material 626 undergoes a change in its index ofrefraction, which in turn changes the propagation direction of the lightso a major portion of the light goes into the output waveguide 24 h.More specifically, the light encounters a lower index of refraction atthe section of EO material 626 located between electrodes 27, and isreflected to the branch section. EO material 626 may comprise organicmaterials, including electro-optic polymers, such as those disclosed inU.S. Pat. No. 5,444,811, assigned to the assignee of the presentapplication and incorporated herein by reference. EO material 626 mayalso comprise multiple quantum well devices and quantum dots made fromexemplary III-V compounds, such as Al_(x)Ga_(1−x)As/Al_(y)Ga_(1−y)As.When applying a reverse voltage bias, these devices are able to changetheir indices of refraction as a function of the applied bias.

In general, active layer 201s formed by a built up technology. As usedin this application, a build-up technology refers to any combination offilm layer deposition steps, waveguide patterning steps, embedding of EOdevices, and formation of vias and contact layers to form a film withembedded waveguides and/or embedded EO devices. As one example, claddinglayer 21 is first formed over base substrate 12, followed by theformation and patterning of optical core layer 24, followed by theformation of cladding layer 23, and then followed by the formation ofelectrical traces 30 and interconnect pads 32. The opto-electronicdevices 26 and 28 may be formed individually and then incorporated intoactive layer 20 after or while cladding layer 21 is formed, and beforecore layer 24 is formed. In some cases, the devices can be formed whilethe layers 21-24 are being formed. For example, the bottom electrode ofswitch 26 c (see FIG. 2) may be formed before cladding layer 21 isformed. After cladding layer 21 is formed, a square of EO material isformed where switch 26 c is to be located. Thereafter, the surface maybe over-coated with core material for layer 24 and cured. The surface isthen planarized to expose the top of the square of EQ material 626. Boththe core layer and the square of EO material 626 are then patterned(such as by conventional patterning of a photoresist layer, or a masklayer, followed by etching) to form the pattern of the waveguides 24 cand 24 h and the final Y-branch shape of BC material 626. Cladding layer23 and a metal layer for top electrode 27 and pads 32 are then formed.

Referring now to FIGS. 4-1, 5-1, 4-2,5-2, 4-3 and 5-3, FIGS. 4-1 shows apartial cross-sectional view of active layer 20 in the vicinity ofphoto-detector device 28 c, and FIGS. 5-1 shows a top plan view ofdevice 28 c in relation to waveguide 24 f. Like switch 26 c,photo-detector device 28 c is embedded in active layer 20, with itsbottom surface against the top surface of base substrate 12. There are anumber of different types of photo-detector devices that can be used.The exemplary detector device shown in FIGS. 4-1 and 5-1 comprises abody 628, or mini-chip, of semiconductor material and two electrodes 27formed at the top surface of body. For visual simplicity, two simplestraight electrodes are shown in the figures. Typical MSM photo-detectordevices used by the present application have interdigitated electrodesfor increasing hole-electron collection effciency. The exemplary device28 c is independently constructed and then placed on top of claddinglayer 21 and adhered thereto prior to forming waveguides 24 a-24 i. Thematerial of body 628 is capable of generating a voltage across itselectrodes 27, and/or a current across its electrodes 27, and/or achange in conductivity across its electrodes 27. For example, body 628may comprise a semiconductor material with a p-n junction formed in thematerial, with the p-type doped region electrically coupled to oneelectrode 27 and the n-type doped region electrically coupled to theother electrode 27. The p-n junction generates a current when exposed tolight, and this current may be detected by conventional detectioncircuitry known to the photo-detection art. As another example, body 628may comprise a semiconductor material that has a p-i-n junction or ann-i-p junction formed in the material, with the doped regionselectrically coupled to respective electrodes 27. When the intrinsic (i)semiconductor region is exposed to light, the concentration of electronsand holes is increased, and the conductivity of the region is increased.This changes the conductivity between electrodes 27, which can bedetected by conventional detection circuitry known to thephoto-detection art. Also, a simple body of intrinsic (i) semiconductor,with two ohmic contacts to it, maybe used. More complex devices, such asbipolar photo-transistors and field-effect photo-transistors, may beused. The construction of these devices are well known to the art, andcan be adapted in view of the present application to position thephoton-collection areas to one or more sides of the mini-chip ofsemiconductor material. In FIGS. 4-1, the thickness of thephoto-detector layer is shown as being almost the same as that of thecore layer thickness of the waveguide. However, more generally it ispreferably to make the thickness of the photo-detector larger than thatof the core layer thickness in order to achieve efficient lightabsorption in the photo-detector.

As previously indicated, the exemplary device 28 c is independentlyconstructed and then placed on top of cladding layer 21 and adheredthereto prior to forming waveguides 24 a-24 i. In the case that claddinglayer 21 comprises a polymeric material that is initially dispensed inliquid form and then cured, device 28 c may be set into layer 21 whilelayer 21 is in a liquid or tacky state, and then may be firmly adheredto layer 21 during the curing process. If cladding layer 21 comprises alaminated layer, or otherwise cured or non-adhesive layer, a body ofpolymeric adhesive may be applied to the back of device 28 c beforeplacement, and then cured to adhere device 28 c to layer 21. After beingset in place, the waveguides 24 a-24 i and top cladding layer 23 areformed in sequence, with vias being formed to electrodes 27 of device 28c. A top metalization layer is formed for providing traces 30 and pads32, as shown in solid lines in FIG. 5-1.

The device of FIG. 4-1 can have fingered electrodes, such as those foundin interdigitated electrodes. One of the fingered electrodes may beformed on the bottom surface of the device's chip. In this case, acontact to the bottom electrode is made by diffusion bonding a portionof the electrode to a electrical trace formed on the surface of the basesubstrate (or formed on a cured layer 21). AuSn bonding, AuSnIn bonding,AuIn bonding, and Pd bonding can also be used. High temperatureunderfill material is then preferably dispensed to fill the air pocketsunderneath the component that has been diffusion bonded. Cure materialcan also be used to fill the air pockets.

The photodetectors used in the present application are not restricted tobeing interdigitated types. For example, a sandwich-type electrodeconfiguration is possible. Also, the detector's bottom surface (thesurface in which light enters the detector) may have an electrode with awindow to receive light, and may have a second electrode located at thedetector's top surface.

FIGS. 4-2, 5-2, 4-3, and 5-3 show two additional preferredphoto-detector embodiments at reference numbers 28 c′ and 28 c″,respectively. Although these examples are for vertical-typephotodetectors, the arrangements and considerations apply tolateral-type photodetectors as well. As is well-known, a load resistoris required to output voltage signals from a photo-detector. As shown inFIGS. 4-2 and 5-2, a load resistor 29 is integrated into the ELOphotodetector 628. Alternately, a preamplifier may be integrated intothe ELO detector 628, such as at the location of resistor 29. FIGS. 4-3and 5-3 show an alternate load resistor 29′ comprised of a serpentineNiCr film with, for example, a thickness of 300 nm, a width of 3microns, and a total length of 500 microns. While photo-detectors areone example where an appropriate impedance matching electrical circuitsuch as an amplifier or load resistor is required for proper deviceoperation, more generally an appropriate resistor, capacitor, driver, orother circuit may be required to couple other electrical oropto-electronic devices, such as a laser diode, to the power supply (orto ground or other electrical and/or opto-electronic devices). In theillustrations of the present invention shown in the figures, only twoelectrodes per device are shown. However, more generally, each devicemay have a plurality of power and/or signal electrodes in a similarmanner to non-embedded devices.

FIG. 6 shows an expanded perspective view of a second embodiment of anopto-electronic interconnect substrate according to the presentinvention at reference number 10′. The interconnect substrate 10′ issimilar to substrate 10 shown in FIG. 1, and takes the form of anopto-electronic multichip module (OE-MCM) substrate that interconnectssignal from one or a plurality of I.C. chips 1 a-1 d by both opticallinks and electrical traces. Common reference numbers have been used todesignate common elements of substrates 10′ and 10. As one difference,substrate 10′ uses light emitting devices 36 a and 36 b in place of theopto-electronic switch devices 26 a and 26 b of substrate 10. The lightemitting devices 36 do not need an outside source of light, such asprovided by optical fiber 4 of substrate 10, and thus substrate 10′ doesnot require optical fiber 4. Device 36 may comprise a light-emittingdiode (LED), a laser diode (LD), a vertical cavity surface emittinglaser (VCSEL), quantum-well or quantum-dot devices (under forward bias),or other light-emitting devices.

FIG. 7 shows a partial cross-sectional view of an exemplarylight-emitter device 36 b, and FIG. 8 shows a top plan view of device 36b in relation to waveguide 24 h. Like switch 26 c, light-emitter device36 b is embedded in active layer 20, with its bottom surface against thetop surface of base substrate 12. Light emitter device 36 b comprises abody 636, or mini-chip, of light-emitting material, such assemiconductor, and two electrodes 27 t and 27 b formed at the top andbottom surfaces of body 636. Device 36 b, emits light from one or moreof its sides, and may comprise a light-emitting diode or laser diodeformed in semiconductor material. The exemplary device 36 b isindependently constructed and then placed on top of an electrodedisposed on or in cladding layer 21 and adhered thereto prior to formingwaveguides 24 a-24 i, such as by the adhesion steps described above,including solder or metal-diffusion processes. The construction of thesedevices is well known to the art, and can be adapted in view of thepresent application to position the photon-emission areas to one side ofthe mini-chip of semiconductor material. The region of layer 20 whichdoes not serve as a waveguide is denoted by reference numeral 24 x inFIGS. 7 and 9.

During construction, the placement of device 36 b on cladding layer 21and the patterning of waveguide 24 h are performed with the use ofalignment marks on base substrate 12. Dining fabrication, there may besome misalignment of device 36 b or the pattern for optical waveguide 24h with respect to these marks, and consequently there may be somemisalignment between the optical output of device 36 b and the opticalinput of waveguide 24 h. To account for any such misalignment, theoptical input of waveguide 24 h may be flared, or tapered outward, asshown in FIG. 8. If there is mis-alignment, the taper ensures that thelight from device 36 b directed into the optical waveguide.

This potential for misalignment is also of concern for making the viacontacts from traces 30 to electrodes 27. This may be addressed bydesigning additional tolerances into the via dimensions (e.g., usinglarger dimensions than the minimum dimensions imposed by the lithographyand etching steps employed). One may also elongate the shapes of traces30 and electrodes 27 in the via area, and arrange the elongated shapesto intersect at 90° angle.

FIG. 9 shows a partial cross-sectional view of a second exemplarylight-emitter device 36 b′, and FIG. 10 shows a top plan view of device36 b′ in relation to waveguide 24 h. Device 36 b′ comprises a verticalcavity surface emitting laser (VCSEL) 638 formed on a semiconductormini-chip (or die) 636. The VCSEL element 638 generates light which isdirected perpendicular to the top surface of mini-chip 636, which isdifferent from the previous example where the light was generated at aside of the mini-chip. Substrate 636 lies below core layer 24, and amirror 639 is positioned in front of VCSEL element 638 to reflect thevertical light beam of element 638 into waveguide 24 h, and therebyalong a horizontal direction. The surface of mirror 639 is preferably ata 45° angle to the element's light beam. One end of optical waveguide 24h is located over VCSEL element 638 and is beveled at an angle(preferably at a 45° angle) with respect to the normal vector of thesubstrate surface. (The normal vector is the vector which isperpendicular to the top surface of base substrate 12). The beveling maybe accomplished by laser abrasion using a laser that is tilted at a 45°angle with respect to the normal vector of the substrate surface.Reactive ion etching (RIE) methods may also be used. If photosensitivematerials are used, tilted lithographic exposures may be used. Mirror639 is built upon the beveled surface, such as by depositing areflective metal or reflective material over this area. Exemplaryreflective metals include silver (Ag), aluminum (Al), gold (Au), copper(Cu), chromium (Cr), tungsten (W), titanium (Ti), etc., and exemplaryreflective materials include multilayer dielectric coatings comprisingsuch materials as titanium dioxide (TiO₂), silicon dioxide (SiO₂),alumina (aluminum oxide Al₂O₃), zinc oxide (ZnO), chromium oxide(Cr₂O₃). The angle of mirror 639 may vary from a value of 45° by smallamounts, depending upon the difference in the index of refraction of thecore and cladding layers. If the difference in the indices of refractionis Δn=0.02, then a maximum angle deviation of ±3° can be tolerated.Given the value of Δn, it is well within the skill of the art to computethe maximum angle deviation. As used herein, a 45° angle or an angle ofapproximately 45° compasses all angles within the angle tolerance forthe corresponding value of Δn; thus angles from 42° to 48° areencompassed for a Δn of 0.02, which has the above angle tolerance of±3°. Instead of mirror 639, an optical grating may be used. An opticalgrating may comprise a sequence of material layers having alternatingindices of refraction n₁ and n₂ and being formed at a 45° angle to thesubstrate normal vector. Such an optical grating may be constructed byforming a set of spaced cuts in the end of waveguide 24 h, and thenfilling the cuts with an optical material having a different index ofrefraction. The set of 45° angle cuts is most readily obtained by usinga photosensitive optical material and passing the exposure radiationthrough a optical device which generates an interference pattern whichhas closely spaced, alternating regions of high and low intensity light.The interference pattern is tilted at an approximate 45° angle to thenormal vector of the substrate and focused on the region where thegrating is to be formed. As in the mirror case, small angle deviationscan be tolerated, and the tolerance can be computed from the indices ofrefraction by those of ordinary skill in the optics art. The gratingsmay also be formed by anisotropic etching methods which are described ingreater detail below with reference to the devices illustrated in FIGS.22-25.

As shown in FIG. 9, device 36 b′ is embedded in a material layer 25 b,which underlies cladding layer 21. To ensure that device 36 b′ isattached to base substrate 12, an adhesive layer 25 a may be formed overbase substrate 12 prior to forming material layer 25 b. Layers 25 a and25 b may comprise any suitable polymeric material, including thematerial of cladding layer 21 or core layer 24, as well as conventionalpolyimide materials. The layers preferably comprise the same material,but they can be different. The electrodes 27 of device 36 b′, as well asother component devices, may be located on the bottom surface of thedevice, or on both surfaces (so called opposing electrodes). In thiscase, the bottom electrodes can be diffusion bonded to electrical tracesformed on the surface of the base substrate (or formed on a cured layer25 a). High temperature underfill material is then preferably dispensedto fill the air pockets underneath the component that has been diffusionbonded. Also, the material of layer 25 b can be used to fill the airgap. When a VCSEL is used, a vertical-type photodetector may be embeddedusing a similar process and having a configuration similar to that shownin FIGS. 9-10.

Referring now to FIGS. 11-20, exemplary methods for constructing activesubstrate 20 for substrates 10 and 10′ are described with respect toFIGS. 11-18, which show cross-sections of the layers of active substrate20 during construction. In the cross-sections shown, a anopto-electronic switch device 26 and a photo-detector device 28 will beformed adjacent to one another with an optical waveguide being routedfrom an optical output of device 26 to an Optical input of device 28, asfinally shown in FIG. 18.

Referring to FIG. 11, a bottom electrode 27 of switch device 26 isformed on the top surface of base substrate 12 by conventionaldeposition and photo-lithographic steps that are well known to the art.In addition to forming electrode 27, alignment marks for furtherprocessing steps may be formed, or these alignment marks may be etchedin the surface of base substrate 12 prior to forming electrode 27. Asthe next step, cladding layer 21 is formed, such as by spin-coating afluidized polymer over base substrate 12. In order to attach components28, a material for layer 21 is selected which has adhesive capabilities,such as Hitachi's fluorinated polyimide OPI-N1005 or a solvent-free(non-gaseous) epoxy materials. The thickness of layer 21 may rangebetween 1 μm and 20 μm, after any shrinkage from a subsequent curingstep.

Individual optical-electric components, such as device 28, are placed ontop of layer 21 and adhered thereto, preferably before the fluidizingsolvent of layer 21 is completely evaporated away from layer 21.Non-solvent based materials may also be used for layer 21, such as epoxymaterials. (In general, epoxy materials decompose as at a lowertemperature than polyimide materials, which should be taken into accountwhen choosing the material for subsequent layers). Layer 21 is thensoft-baked to remove the fluidizing solvent (if it is present) and toperform some optional partial cross-linking of the polymeric material.Layer 21 is then cured by steps that are appropriate for its materialcomposition, such as by exposure to beat, radiation, time, or acombination thereof. The evaporation of the, solvent is performedgradually to accommodate the lateral diffusion of the solvent whichunderlies the individual components (28). With some cladding materials,one can perform a partial soft-bake step to make the surface of layer 21tacky before the individual components are placed. The partialsoft-baked reduces the time required to laterally diffuse out thefluidizing solvent that is under the set components (e.g., 28).

The back side of each placed component (e.g., 28) maybe coated withchromium prior to the adhesion step in order to improve adhesion of thecomponents to the polymeric material of layer 21. In some cases, thechromium film may be patterned to form bottom electrodes of thecomponent. Commercially available surface mounting equipment, flip-chipbonding equipment, or a custom purpose aligner may be used to positionthe components. Alignment marks may be included on the individualcomponents (e.g., 28) and/or base substrate 12 for this purpose. Insteadof making alignment marks on individual components, it is also possibleto make marks on several components or on several points of thesubstrate portion on which the components are disposed. Surface mountequipment, flip chip equipment or a custom purpose aligner can placecomponents to within ±2 μm to ±5 μm.

As indicated above, the thickness of the individual components (e.g.,28) is preferably relatively thin, such as on the order of 1 μm to 20μm. Such thin O/E components can be manufactured using the vapor phaseepitaxial liftoff process described by Yablonovitch, “Vapor PhaseEpitaxial Liftoff Process of GaAs”, the Fall 1997 Materials ResearchSymposium. Other processes, such as liquid phase epitaxial liftoff orpolishing may also be used as well. The epitaxial lift-off (BLO) processtakes advantage of the very large difference in etch rate between GaAs(Gallium Arsenide) and AlAs (Aluminum Arsenide), or between GaAs andAl_(x)Ga_(1−x)AS (Aluminum Gallium Arsenide) with large x, inhydrofluoric acid. Starting with a GaAs substrate, a layer of AlAs isformed over the top surface by epitaxial growth (e.g. MBE, OMVPE, etc.).Layers of GaAs and Al_(x)Ga_(1−x)As are then formed over the AlAs layer,also by epitaxial growth. Opto-electronic devices are then formed in thetop GaAs layer, including electrodes and a top passivation layer. (northe present invention, a polish-stop layer is formed on top of thepassivation layer and electrodes, as described below). Deep trenches arethen formed in the top GaAs layer to separate the devices intoindividual components or individual array chips (which are chipscontaining multiple devices). (Such array chips are usefully inimplementing optical buses where multiple signals are grouped togetherand routed from a bank of optical switch devices (or emitters) to a bankof photo-detectors.) As a supporting substrate, a polymer film, such asMylar, or glass, quartz, is then laminated to the top surface of theGaAs components, including the array chips. The entire substrate is thenexposed to a hydrofluoric acid etch, which etches the AlAs layerlaterally and results in the release of the GaAs and Al_(x)Ga_(1−x)Ascomponents (e.g., mini-chips) from the GaAs substrate while still beingattached to the polymer film (when a polymer is used for the supportingsubstrate). The components may then be cut from the polymer film, orthey may be held by the film until used. In the latter case, layer 21 issoft-baked to a point where it has more tacky adhesion force than thelaminated polymer film; when the component is pressed in the tacky layer21, it is retained on layer 21 when the laminated polymer film is pulledaway, and it separates from the polymer film. As another option, one maydeposit metal on the exposed bottom surfaces of the epitaxial deviceswhile they are still attached to the carrier film. Corresponding metalpads may be formed on a cured layer 21, and the epitaxial devices maythen be attached to the corresponding metal pads by diffusion bonding,AuSn bonding, AuInSn bonding, AuIn bonding, Pd bonding, or other similarbonding processes. Dimensional stability is improved if rigidsubstrates, like glass, are used for the supporting substrate.

It is believed by the authors that a similar epitaxial lift-off processmay be developed for a silicon (Si) substrate using an intermediate SiGe(Silicon Germanium) layer in place of the AlAs layer, and by using anetchant which differentiates between SiGe and silicon (Si). This wouldenable a high-yield ELO process to be performed for silicon chips.

In subsequent processing steps, a layer of core material will be formedover the individual components (e.g. 28), and the resulting surface willbe exposed to a polishing step to make the surface more planar. Inpreferred construction implementations, the polishing step will removeparts of the core material which overlay the electrodes 27 of theindividual components (e.g., 28) and expose the top surfaces of theelectrodes 27. For this purpose, the electrodes 27 preferably have aninitial height which is greater than normally required, and they arethen ground down by the polishing step. In addition, the electrodes 27preferably have a composite structure of two or more metal sub-layers,with one of the sub-layers comprising a polish-stop material, such astungsten. An example is shown in FIG. 11, where electrodes 27 comprise abottom sub-layer 27 x of copper, a middle sub-layer 27 y of tungsten,and a top sub-layer 27 z of copper. The tungsten sub-layer 27 y may havea thickness in the range of 0.1 μm to 1 μm, and copper layers 27 x and27 z may have thicknesses of 2 μm to 20 μm. To reduce copper diffusionduring polymer curing, the top surface of the copper can be capped by adiffusion barrier layer (e.g., titanium or nickel layer). Other metals,such as Au, may be used instead of Cu. In a slurry having aluminaparticles as the abrasive, copper polishes at a faster rate thantungsten.

After layer 21 is cured, or between the time layer 21 is soft-baked andcured, layer 21 may be patterned to form vias to bottom electrode 27.This is most easily accomplished by laser drilling the via apertures andthen filling the apertures with conductive materials, such as forexample copper. The location of the via is indicated in FIG. 11 by theterm “via”. In place of laser drilling, the via apertures may be formedby etching through a thick photoresist layer which has beenphoto-lithographically patterned with apertures which correspond tothose to be formed in layer 21. If layer 21 has been cured, then dryetching is preferred; wet etching is usually best used with a soft-bakedand uncured layer 21. As indicated below, the via in layer 21 may alsobe formed at a later step.

The via apertures in layer 21 may be filled with conductive material bya number of conventional deposition methods, including sputteringconductive material (e.g., copper), chemical vapor deposition (CVD), andplating conductive material. Electroless plating, direct plating(electroplating), and CVD may be used to fill the via apertures withoutdepositing material over the entire substrate. Electroless plating is,however, relatively slow. Other methods deposit conductive material overthe entire surface and then etch away the material in those areas whereit is not wanted. Before performing such a blanket deposition ofmaterial, it is advisable to cover the placed components (e.g., 28) witha protective patch of photoresist material so that the subsequentetching operation does not harm these components, particularly theirmetal electrodes. If electro-plating is used, a conductive seed layer isfirst sputtered over layer 21 to provide a conductive path for theplating current. The seed layer usually comprises a thin chromiumadhesion layer (e.g., 200A) followed by a thicker copper layer (e.g., 2μm). The excess conductive material is removed by conventional chemicaletching using masking caps over the filled via apertures The maskingcaps can be easily formed by coating a layer of photoresist over thenewly deposited copper layer, and thereafter pattern exposing anddeveloping the photoresist layer. After the excess copper (and any seedlayer) is etched away, the masking caps are removed by a suitablestripper or solvent. The above described via formation steps may be usedto form vias in other dielectric and polymeric layers described herein.

Referring to FIG. 12, a layer EO material 626 for switch device 26 isformed over layer 21 and the individual components (e.g., 28). The layerof EO material 626 is then patterned to leave a portion (or body) of thematerial in the location where switch device 26 is being formed. Theportion left is typically a course portion of the material and is not inthe final pattern of the body of EO material 626 which will be used fordevice 26. For example, it may be a generally rectangular portion (asviewed from the top surface of base substrate 12) which encompasses thebody of EO material 626 that will actually be used for switch 26 (seeFIG. 19). A subsequent step will typically do the final patterning ofthis portion of EO material 626 (see FIG. 20). This course patterning ofthe layer of EO material 626 may be done by any number of conventionalpatterning techniques. If EO material 626 is photo-imageable, it may bepatterned exposed to actinic radiation and thereafter developed. If itis not, a photoresist layer may be formed over the layer of EO material626, and the photoresist may be patterned to leave an etch mask whichcovers the course portion of EO material 626 which is to be retained.Both wet and dry etching steps may be used to remove the unwantedportions, with dry etching being preferred as these etching processesare anisotropic and provide sharper vertical walls. Plasma dry etchingtechniques may be used, and the photoresist layer may be sacrificedduring the dry etching process as long as a portion of its thicknessremains by the end of the etching process.

In FIG. 12, a further embodiment of these possible patterning methods ispreferably used. Specifically, a tungsten layer having a thickness of0.1 μm to 1 μm is formed over the layer of EO material 626, and thistungsten layer is patterned to leave tungsten etch masks 627 forportions of EO material 626 that are to be retained. The patterning maybe done by forming a photoresist layer over tungsten layer 627,patterning and developing the photoresist to expose the unwantedtungsten, and then etching the unwanted tungsten, such as by a hydrogenperoxide solution. FIG. 13 shows the result of the pattern etching ofthe layer of EO material 626. The tungsten etch mask 627 will be used ina subsequent polishing step as a polish-stop layer for protecting theretained portions of EO material 626, and thus it will serve twopurposes. It may be appreciated that other materials may be used inplace of tungsten, and that the construction methods of the presentinvention are not limited to using tungsten. For example, other metals,deposited silicon dioxide, and deposited silicon nitride may be used.The etch mask can, if necessary, be used as a poling electrode toenhance the electro-optic coefficient of the EO material.

Instead of forming the portions of EO material 626 by spin-coating, CVD,or MLD, one can place chips of semiconductor material which haveelectrical-optic properties or electro-absorption properties. Forexample, multiple quantum-well devices comprising alternating layersAlGaAs and GaAs (or InGaAlAs (Indium-Gallium-Aluminum-Arsenide) orInGaAsP (Indium-Gallium-Arsenide-Phosphorus), etc.), change their indexof refraction (or electro-absorption properties) as a function ofapplied potential difference. These chips may be made by the epitaxialliftoff process described above, and they may be placed down onto layer21 at the same time that components 28 are placed down onto layer 21(either with simultaneous placement or sequential placement). Thispossibility is shown by the dashed chip of material 626′ in FIG. 11. Inthis case, the step of coating the layer of polymeric EO material 626exemplified by FIG. 12 may be omitted, as well as the steps of definingand curing the coated material 626 (unless of course one wants to useboth materials 626 and 626′ in the same active substrate 10). Apolish-stop layer 627 is preferably formed over the chip 626′,preferably before placement. Layer 627 may then be patterned to definethe final shape of chip 626′, and the semiconductor chip can then beetched to removed those portions of semiconductor which are notunderneath the patterned layer 627, before the core layer is formed. Theprocessing of chip 626′ is thereafter the same for those stepsexemplified in FIGS. 13-20.

Referring to FIG. 14, the next step is to form a layer 24 of opticalcore material over cladding layer 21, the individual components (e.g.,28), and the portions of EO (or EA) material 626. For this purpose, aspin coat step may be used, where the core material comprises a polymermaterial which has been fluidized (i.e., made into a viscous fluid) witha solvent. In this regard, and as mentioned above, the fluidized corematerial may comprise, for example, Hitachi's fluorinated polyimideOPI-N3405 (Hitachi Chemical Co.). Layer 24 is then exposed to asoftbaking step to remove the fluidizing solvent, and then to a curingstep which is appropriate for its material composition, such as byexposure to heat, radiation, time, or a combination thereof Guidelinesfor the softbaking and curing of core materials, cladding materials, andelectro-optical materials are provided by the manufacturers. Thethickness of layer 24 is preferably greater than 90% of the thickness ofthe component mini-chips (e.g., 628) or the thickness of the portions ofEO material 626, whichever is less, and is more preferably thicker thanthe mini-chips and the portions of EO material 626. Typical thicknessesof the initially-formed and cured layer 24 are less than 30 μm, and moretypically in the range of 3 μm to 20 μm.

Referring to FIG. 15, the surface of the substrate is polished to makeit more planar. The polishing step removes the portions of layer 24 thatoverlie the opto-electronic components 26 and 28, but maintains thematerial in the low-lying regions where the optical waveguides will bedefined. The polishing step often reduces the thickness of layer 24 inthe low lying areas, particular when the thickness of theinitially-formed and cured layer is greater than the thicknesses of theopto-electronic devices.

Planarity is defined with respect to a flat (or sometimes graduallybowed) geometrical plane which spans a localized area and which goesthrough the median height, or average height, of the surface topology inthat area. Planarity is a measurement of variance of the surfacetopology from the geometric plane. The measurement may be mathematicallydefined in a number of ways, the most typical (and easiest) measurementis the maximum height variation from the geometric plane within thelocalized area. Sometimes the underlying base substrate 12 may have aslightly bowed surface, and therefore will not be perfectly flat. Inthis case, the notion of planarity may still be applied by using ageometric plane which has a bowed surface which follows the contour ofthe underlying substrate in the localized area of interest. In thepresent invention, one generally seeks to achieve a maximum heightvariation of not more than 0.5 μm from the geometric plane over asurface area of 2 cm on a side (i.e., 4 cm²)

To achieve good local planarity, one may use a soft polishing pads or adual pad structure comprising a hard outer pad and a softer underlyingpad. The selection of polishing pads is well within the ordinary skillin the art. As mentioned above, tungsten polish-stop layers are usedover various components to protect them. In this regard, theeffectiveness of tungsten as a polish-stop layer may be increased byadding phosphoric acid to the slurry, which will not significantlyaffect the polishing rates of copper and most polymeric materials. Touse phosphoric acid for this purpose, it is added in an amount whichlowers the pH of the slurry to a value which is between 2 and 4. As afinal note on the polishing step, several “dummy” portions of EOmaterial 626, with the overlying polish-stop layer 627, may bedistributed over the surface of base substrate 12 in areas where thereare no optical waveguides or opto-electronic devices located. (Such adummy portion is shown in the lower left corner of FIG. 20). The dummyportions are never used as active components, but serve to reduce the“dishing” phenomenon of the polishing step by increasing the aggregatesurface area of polish-stop layer 627. (“Dishing” is where localizedhollows are fanned in the surface by the polishing action due to thelack of nearby polish-stop regions or high spots, the dishing effect isgreater for soft pads than fox hard pads.)

As the next fabrication step, and as shown in FIG. 15, vias are formedthrough layer 24 to the vias previously made to the bottom electrodes 27through layer 21. The via may be formed by etching a via aperture, suchas by laser or by plasma etch, and thereafter filling the aperture withconductive material using any of the filling steps described above withrespect to the formation of the vias in layer 21. It may be appreciatedthat the previous formation of the vias in layer 21 may be delayed untilthe vias in layer 24 are formed, and that the vias in layers 21 and 24may be formed at the same time by a single via-formation process. It isalso possible to form the vias in layer 24 before layer 24 is polished,or before layer 24 is cured.

Referring to FIG. 16, the next step is optional and comprises a secondpolishing step which remove excess conductive material from the top ofthe vias formed in layer 24. This polishing step is relatively brief,and need not remove all of the excess. As the next step, the polish-stoplayer 627, and optionally polish-stop layer 27 y, are removed byexposing the layers to a suitable etchant. Tungsten polish-stop layersmay be readily removed by hydrogen peroxide, which does not damagecopper vias or most polymeric layers. As the next step, the opticalwaveguides are defined in layer 24. This may be done by removingportions 624 of layer 24 which run along each side of each waveguide,and which border on sides of the opto-electronic devices which are notused as optical inputs. FIG. 19 shows a top plan view of the activesubstrate 20 before portions 624 of core layer 24 are removed, and FIG.20 shows a top plan view after the portions 624 are removed to definethree optical waveguides 24 j-24 l shown in the FIG. 20. Portions oflayer 21 which underlie the removed portions of layer 24 are seen inFIG. 20. As part of this step, the sections of EO material 626 arepatterned a second time to provide the final Y-branch shape for switchdevice 26. The patterning of layer 24 and the portions of EO material626 may be done simultaneously with a dry etch process which uses apatterned etch mask disposed over the portions of layer 24 and EOmaterial 626 which are to be retained. Wet etching may also be used. Ingeneral, the widths of the EO waveguide section 626 and those of thewaveguide 24 j-24 l are not always the same. If the index of refractionof the EO waveguide section 626 is greater than that of core layer 24 bya substantial amount, as can be the case when a chip of III-V compound,such as gallium-arsenide (GaAs) material, is used for section 626, thenit is advisable to make the width of the EO waveguide section larger, orsmaller, and to taper its dimensions at those locations where it meetswaveguides 24 i-24 l. This action keeps the beam width of thepropagating light properly dimensioned in the two materials of differentrefractive index, and thereby reduces reflections at the boundariesbetween the two different materials.

As the next step, layer 23 of cladding material is formed over layer 24and the exposed regions of bottom cladding layer 21. This causes thesides of the optical waveguides 24 j-24 l to be covered with claddingmaterial. The result of this operation is shown in FIG. 17. The claddingmaterial filled the removed portions 624 substantially all of the way tothe top, but not completely. There will be small depressions in thesurface of layer 23 which overlie the removed portions 624 of layer 24.These depressions are usually gradual and smooth enough that metal linesmay be formed across them without breakage. If one wishes to reduce thesize of the depressions or eliminate them, the following steps may beundertaken. Referring back to FIGS. 15 and 16, the polish-stop layersare kept in place during the removal of portions 624, and are kept inplace when a first layer 23 of cladding material is formed over thesurface. This first layer is then polished to planarize it and to exposethe polish-stop layers. The polish-stop layers are then removed and asecond layer 23 of cladding material is formed over the substrate.

It may be appreciated that the following further variations in the stepsof defining the optical waveguides may be practiced. As a firstvariation, one may dispense with performing the second patterning stepof the portions of EO material 626 if the first patterning of EOmaterial 626 uses the final patterned image for the material. Thedimensions of the Y-branch shape may be enlarged to account for thepossibility of misalignment. The advantage of using the two steps ofpatterning is that one may achieve perfect alignment between theY-branch shape of switch device 26 and the optical waveguides 24 j-24 lby using the second etch step to pattern both EO material 626 and layer24.

As a second variation, which may be used with the first variation, onemay use a core material that is photo-definable (also called“photo-refractive”). Such materials have an initial index of refractionwhich may be changed upon exposure actinic radiation, which is usuallylight having a wavelength in the range of 365 nm to 400 nm. Suchmaterials usually increase their indices of refraction when exposed tothe actinic radiation. In this case, the material is initially depositedwith a low index of refraction, and thereby initially acts as a claddinglayer. The layer is then pattern exposed to the radiation to define theoptical waveguides by raising the index of refraction in those areaswhere the waveguides are to be located. The pattern exposureautomatically results in the sides of the waveguides being surrounded bycladding material. When active substrate 20 is completed and is in useas an interconnection device, the optical waveguides usually carry lighthaving a longer wavelength (generally in the range of 600 nm to 1.6 μm)than that used to define them. The use of a photo-definable corematerial for layer 24 is easily implemented when EQ material 626 hasbeen patterned in its final shape before layer 24 is formed. However,extra processing steps may be added to pattern EO material 626 after thewaveguides have been photo-defined. It is also possible that some EOmaterials may have their compositions modified to provide them withphoto-definable characteristics. Examples of photo-definable EOmaterials are disclosed in U.S. Pat. No. 5,541,039 to McFarland, et al.,entitled “Method for Forming Optically Active Waveguides”. In general,making a material photo-definable can be accomplished by finding a wayto change its index of refraction in response to exposure to actinicradiation. The changes may be accomplished by causing chemical changesand/or density changes in the material in response to being exposed tothe actinic radiation.

In the core layer coating step shown in FIG. 14, an optional clad layercan be coated on the core layer. After the core layer is cured(partially or fully), the optional cladding layer is coated followed bysoft and full curing. If the core layer thickness is a little bitthinner than OE device height (including top electrode), the polishedsurface can be in the cladding layer. In this case, the optionalcladding layer is formed over core layer 24 before the polishing step ispreformed. This two-layer approach may improve the interface flatnessbetween core and clad layers, resulting in reduced optical losses. Also,the optical field intensity is slightly lower in the cladding layer,further reducing any interface scattering losses compared to forming aCMP surface at the core/cladding interface. The thickness of the corelayer may be selected to be close to or less than the OE device/materialheight excluding the top metal. In this case, by adjusting the top metalthickness, the optional clad layer thickness can be adjusted. Anotherapproach is to not perform CMP processing on either the core layer orthe top cladding layer. This results in a non-planar surface, which canbe planarized, if needed, by forming a planarizing layer over the topcladding layer and then performing CMP processing on the planarizinglayer. The planarity of the core layer may also be improved using CVD,MLD, evaporation polymerization, or other vapor phase deposition methodsfor the polymer layer formation.

When using a photo-sensitive material, which is hardened by lightexposure, CMP is not always necessary. After the step shown in FIG. 14,waveguide patterning can simply be carried out by patterned lightexposure if the core layer was coated in an appropriate thickness, thatis, close to or less than the OE device/material height excluding thetop metal. Further planarization layers and processing steps may beapplied after the overcladding layer is formed, if necessary.

Referring to FIG. 18, the last steps are to form vias through claddinglayer 23, and to form the top electrodes 27 for switches 26, electricaltraces 30, and interconnection pads 32. Via apertures may be formed inlayer 23 in any number of conventional ways, either before or afterlayer 23 is cured (if it requires curing). Such methods include laserdrilling and wet or dry etching using a photo-lithographical definedetch mask. Once the via apertures are formed, the vias may be filledwith conductive material by any of the convention filling methodsdescribed above. Metals are preferred for the conductive materials, withcopper being one of the more preferred metals. In order to reduceprocessing steps, it is preferred to use sputter deposition or blanketelectroplating (with a sputtered seed layer) so as to cover the wholesurface of layer 23 with conductive material. By performing a blanketcoating, one can then use a subsequent etching step to define theelectrical traces 30 and pads 32 by an etching step using aphoto-lithographically defined etch mask. The etch mask covers the viasto protect them during the etching step. As an alternative, one cansputter a seed layer over the entire surface of layer 23 and the viaapertures. By conventional photo-lithographic steps, one can then form aplating mask over those areas where vias, traces, and pads are not to beformed. As a result, the exposed portion of the seed layer overlies thelocations of the vias, traces, and pads, and these exposed portions maythen be plated to form the vias, traces, and pads. After plating, theplating mask is removed and a brief blanket etch is performed to removethe portions of the seed layer which were previously covered by theplating mask. As is known in the art, whenever one forms a metal layerover a polymeric layer, it is advisable to first sputter an adhesionlayer over the polymeric layer before forming the metal layer. A 200 Ato 400 A thick layer of chromium may be used for this purpose. Theadhesion layer bonds well to both the metal and the polymeric material.

With a few additional processing steps, one may incorporate a VGSELdevice 36 b′ shown in FIG. 9 in the above fabrication step. First,before cladding layer 21 is formed, adhesion layer 25 a is formed overbase substrate 12, and the VCSEL device is adhere to layer 25 a. Beforebeing adhered to layer 25 a, the top surface of the VCSEL device withELO is coated with a polish-stop layer, such as 0.1μ to 1 μm oftungsten. Layer 25 a is soft-baked, and then cured. (Instead of adheringthe device to layer 25 a, and as previously described, a metal layer maybe deposited on the bottom surface of the VCSEL device and the devicemay be adhered to a metal pad formed on the surface of substrate 12 byvarious metal bonding processes.) Material layer 25 b is then farmedover layer 25 a. If material layer 25 b comprises a fluidized polymericmaterial, it is soft-baked and then cured. The process substrate is thenpolished to remove the portion of layer 25 b that overlies the VCSELdevice. The (tungsten) polish-stop layer protects the VCSEL deviceduring ibis polishing step. After the polishing step, the polish-stoplayer is removed. The manufacturing steps then proceed as indicatedabove, starting with the formation of cladding layer 21. Mirror 639(FIG. 9) may be formed any time after layer 24 is formed, and is usuallyformed after layer 23 is formed. As indicated above in greater detail,the mirror is formed by making a 45° angle cut through layer 24 inregion overlying the emitting element 638, and then forming a layer ofreflective metal or reflective material. Since the same basic processingsteps used to integrate VCSELs and mirrors may also be used to fabricatevertical-type photodetectors, it is preferable to also fabricatevertical-type photodetectors in the above-described example.

In the above construction examples, the individual components have beenadhered to cladding layer 21 (or layer 25 a for a VCSEL device) in theface up-position. However, these individual components may be placed inthe face down position with the following modifications. In the case ofcomponent 28, layer 27 may be patterned to include connection pads formcomponent 28, and component 28 may have its electrode connected to thesepads by metal diffusion bonding. Prior to this, cladding layer 21 wouldbe patterned to expose these contacts in bottom layer 27. Once component28 has been so joined, a high-temperature underfill material may bedispensed under it to prevent air pockets. Vias are then made to thetraces in layer 27 to complete the electrical connection of component28. The formation of such vias was previously described above.

Placing the component 28 face down onto the substrate has the followingadvantage when component 28 has been formed by the above describedepitaxial lift-off process: that is the AlGaAs etch step used to removedthe components from the GaAs wafer may be delayed until the componentsare placed faced down on cladding layer 21. After placement on substrate412, the AlAs etch step is performed to separate the bulk GaAs substratefrom the epitaxial layer which contains the components. Thus, one doesnot need a polymer film, glass substrate, or other substrates to supportthe opto-electronic components during the placement steps since the GaAsbulk substrate provides this function. It may be appreciated that awhole GaAs wafer may be placed face down on cladding layer 21, or thatthe GaAs substrate may be first diced to separate the individualcomponents from one another. For VCSEL devices, these steps areperformed with layer 25 a and a metal layer formed underneath layer 25b.

Another process for the integration of thin film device integration withwaveguides is shown in FIGS. 74-81. As shown in FIG. 74, an epitaxialwaveguide OE layer is grown on a GaAs substrate, metallized andpatterned to define a plurality of OE devices 620. The GaAs waveguidecore layer may comprise a p-i-n waveguide core layer with abrupt indexchanges but preferably has a tapered refractive index (e.g. core shapedalong the light propagation direction) such as that used for a spot-sizeconversion laser diode. The epitaxial films can be electro-absorption(BA) light modulator, Electro-Optic (EO) light modulator, photodetector,optical gate device, optical switching wavelength filter, tunablefilter, wavelength filter, wavelength converters etc., by using multiplequantum well or quantum dot structures. A metal contact layer isdeposited on the surface, along with a Au contact film and, ifnecessary, a surface film of tungsten to stop CMP in later processingsteps. The top electrodes and epitaxial layer are then patterned usingconventional patterning techniques.

As shown in FIG. 75, the epitaxial thin-films with devices 620 aretransferred to a supporting transfer substrate (glass, quartz, mylar, orany other substrates) by epitaxial liftoff (ELO). The adhesion betweenthe ELO films and the supporting substrate can be made by, for example,Vaseline or black wax or an adhesive such as epoxy, polyimide, bondingsheet, thermo-plastics, underfill material, or conductive adhesive.

As shown in FIG. 76, after the semiconductor substrate is lifted off,the ELO devices 620 are transferred onto an under-clad layer 21 disposedon a substrate 12 which may comprise glass, quartz, Si, Al, AlN, or avariety of other substrate materials. The ELO devices 620 can beattached to the underclad layer 21 by several well-known mechanisms,including Van der Waals forces and adhesives bonding. If metal pads areformed on the cladding layer, diffusion bonding, solder bonding,transient liquid bonding (TLB), wire interconnect technology (WIT) canbe used for attaching the ELO devices 620. In this case, the ELO devicesurfaces may also be coated by metal also, such as shown in an exampledescribed below with respect to FIGS. 82-89.

In order to form a three-dimensional waveguide that is optically coupledto the p-i-n waveguide of the ELO segments, core layer 24 and clad layer23 are successively fanned using the above-described liquid polymercoating steps, as shown in FIG. 77. It is desirable to adjust the corethickness to be close to or less than the p-i-n semiconductor filmthickness so that there is strong optical coupling to the p-i-n corelayer. However, slight non-uniformities and/or perturbation in corethickness near the edge of the ELO segments will not significantlydegrade the efficiency of light propagation. By using vapor phasedeposition such as CVD, MLD, evaporation polymerization, theperturbation strength (i.e., non-uniformities) can also be reduced. Ifnecessary, the surface of the deposited core layer 24 is planarized byCMY to improve its smoothness and uniformity. The CMP can beautomatically stopped by a tungsten (W) film on the top of the ELOdevices 620.

As indicated in FIG. 77, an upper cladding layer 23 can also be coatedon the core layer 24. This has several benefits. One benefit is that itpermits the core layer to be equal to or even slightly thinner than theOE device height, permitting greater design freedom. Additionally, itmay result in lower waveguide losses because the cladding layer 23 canbe polished to a surface that has a more uniform interface with reducedoptical scattering losses (e.g., a comparatively thick cladding layerdeposited over a core layer 24 may be readily polished back to anoptically smooth surface. Moreover, since the optical field strength istypically lower in the cladding layer 23 than in the core layer 24,optical losses at a polished surface in the cladding layer may bereduced compared to the case that the CMP polish surface is at thecore/cladding interface). After the core layer 24 is cured, the optionalupper cladding layer 23 is coated followed by soft and fall curing. Apartial cure of the core layer 24 is desirable because it can increasethe adhesion strength between the core and clad layer.

As shown in FIG. 78, the core layer 24 is patterned into longitudinalwaveguides and then another cladding layer 23 is formed around thelongitudinal waveguides, as shown in FIG. 79. Vias and electrodes 27 areformed to the EO devices 620, as shown in FIG. 80, followed by removalof the undercladding substrate 12 and back-side processing is applied tomake bottom electrodes 27 and vias, as shown in FIG. 81. However, ifmetallization of the substrate and under clad layer 21 is done beforethe thin-film device attachment, the substrate removal and back-sideprocessing is not necessary. The active layer can be attached to anotherlayer or substrate before removing the substrate. This is preferably fordimensional stability. If necessary, a buffer polymer layer 613 can beinserted between the substrate and cladding layer, and the metallizationcan be applied onto the buffer layer 613 and to the cladding layer, asis done in the embodiment shown by FIGS. 82-89 below. Device dividing isperformed after ELO and metal coating.

FIGS. 82-89 show another variation in which the core layer thickness isthinner than the device thickness to reduce light scattering by theelectrodes of the device, The ELO devices 620′ are attached on padsformed on substrate 12, as shown in FIG. 84, which in turn are formed ona buffer layer 613 and dielectric spacing layer 614. Then, the claddinglayer 21 is formed with the devices 620′ in place, and then the corelayer 24 is formed. The resulting structure is shown in FIG. 85. Somedistortion may result in the core layer 24 in a short region disposedaround the edge of each ELO device 620′. however, while this may causesome optical losses, the total optical losses will be small because ofthe short scattering length. To address this, CVD, MLD, evaporationpolymerization, or other vapor phase deposition methods may be used inthe embodiment of FIGS. 82-89 prior to forming the core to improve thesmoothness of the core layer.

Next, as shown in FIG. 86, the core layer 24 is patterned using any ofthe methods described above, followed by the over-coating of clad layer23, as shown in FIG. 87. Vias and electrodes are formed as describedabove, which are shown in FIG. 88 The device is removed from substrate12 and attached to an appropriate component, as shown in FIG. 89.

As indicated in the discussion of FIGS. 74-81 and 82-89, the corethickness of the active device ELO segment is preferably thinner thanthat of other portions. This permits a high electric field strength tobe obtained at a low operating voltage. Furthermore, by reducing the ELOoptical core width, as shown in FIG. 67, the capacitance is reduced.This facilitates high-speed device operation.

While FIGS. 81 and 89 show vias connected to ELO electrodes, otherconnection methods may also be used. In particular, direct formation ofelectrodes connected to the E/O electrodes is another possibility.

There are many potential variations of the above described process.Referring back to FIGS. 77-79, when photo-sensitive material, which ishardened by light exposure, is used, CMP is not always necessary.Consequently, after coating the core layer, waveguide patterning cansimply be carried out by light pattern exposure if the core layer wascoated in an appropriate thickness. Planarization may be applied afterovercladding layer is formed, if necessary. The metallization sequencemay also be varied. For example, by depositing a ˜3000 A thick W film onthe clad surface before CMP, CMP can be performed using the W film as aCMP stop layer. In this case, the W film on the Au is unnecessary.

While one ELO technique has been discussed in detail, the presentinvention may be applied to any optical material or device which may beselectively lifted off from the substrate upon which it was deposited orformed. ELO can be done by GaAs substrate etching with Al_(1−x)Ga_(x)Asetch-stop, or using AlAs etchable layer. However, the Semiconductorsubstrate is not restricted to GaAs. InGaAsP-related epitaxial films canalso be used for wavelength of ˜1.3 um and ˜1.5 um applications. Othermaterials may also be lifted off. For example, a large refractive indexfilm, like TiO₂, WO₃, SiN_(x), Si etc. film can be deposited onsubstrates, such as Si, metal, or polymer, which may be selectivelyetched away, permitting these film to be embedded in the manner of thepresent invention. Thus, the teachings of the present invention may beapplied to a wide variety of thin-film materials and devices. As oneexample, if a rare-metal-doped glass film is embedded, then it may actas an optical amplifier. Organic or inorganic functional films such asluminescent films, photo-refractive films, or nonlinear optical filmsmay also be embedded. Optical delay lines comprised of high refractiveindex materials may similarly be embedded. The present invention thusprovides a versatile way to optically integrate a variety of opticalcomponents. For example, resistors, capacitors, amplifier chips, driverchips may also be embedded. In the case of electronic elementsfabricated on a silicon chip, polishing may be effective to reduce thethickness of the chip instead of ELO. The attachment of the ELO film mayalso include a variety of materials and processes, such as metaldiffusion, AuSn bonding, Pd bonding, or solder process, WIT, TLB etc. aswell as adhesive process.

All the processes and structures mentioned in the present disclosure canbe applied to matrix optical switches, including wavelength switching,for XBAR switching by connecting a plurality of switch parts oftransferred thin-films by polymer waveguides in a network configuration.The switching elements may comprise: internal total reflection switches,Mach-Zehnder switches, digital switches, directional couplers, andoptical gate devices based on semiconductor optical amplifier,wavelength filter, or tunable filter. The method of the presentinvention may thus be used to realize an active substrate with a matrixoptical switch function.

Referring now to FIGS 21-26 the above active-substrate construction maybe extended in many ways to construct more complex optical-electricalinterconnect systems. For example, as shown in FIG. 21, the activesubstrates 20 described above may be horizontally attached to abackplane (or motherboard) 100, which comprises its own opticalsubstrate 120, which is similar in construction to active substrate 20,and which may be constructed by the previously described steps. Asanother example, the active substrates 20 described above may bevertically attached to a backplane (or motherboard) 210, as shown inFIGS. 31-32, As yet another approach, the active substrates may bestacked upon on another with interleaving “layer” of integrated circuitchips between them, as shown in FIGS. 34-36, 71, and 109-111.

Referring to FIG. 21, the horizontal attachment of the active substrates20 to a backplane (or motherboard) 100 is first described. Backplane(motherboard) 100 comprises an active substrate layer 120 having aplurality of optical waveguides 124 a-124 h formed therein using abottom cladding layer 121, a patterned defined core layer 124, and a topcladding layer 123, which can be seen in FIG. 22. For the purposes ofillustration, and without loss of generality, backplane (motherboard)100 houses four identical MCM-type active substrates 20, each of whichhouses four IC chips. In order to show the routing of the opticalwaveguides 124, two of the four active substrates 20 shown in FIG. 21have been detached and are not shown in the figure. Backplane(motherboard) 100 comprises a plurality of vertical optical couplers(154, 156, 160) for transmitting and receiving optical signals to theMCM active substrates 20, and each of the MCM active substrates 20previously described have been modified to replace their V-grooveoptical connectors 13-15 with corresponding vertical optical couplers 44and 48. These modifications are described below after a generaldescription of backplane (or motherboard) 100 has been given.

The positions of the waveguides and vertical couplers underneath theupper-left and upper-right MCM substrates 20 are the same as thoseunderneath the lower-left and lower right MCM substrates 20. This isdone to give the reader a view of backplane (motherboard) 100 in thecases when the substrates 20 are mounted (upper-left and upper-rightpositions) and when they are not mounted (lower-left and lower-rightpositions).

A source of light for backplane (motherboard) 100 is generated by anemitter device 136, which may be any of the light emitting devices 136described above and illustrated in FIGS. 6-10. The output of emitterdevice 136 is coupled to waveguide 124 a, which is routed to up to alocation which adjacent to the upper-left MCM substrate 20. From thispoint, waveguide 124 a is gradually bent in a 90° angle and is routedunderneath the upper-left MCM substrate 20, and extended to passunderneath the upper right MCM substrate 20. Between emitter device 136and the upper left MCM substrate 20, waveguide 124 a passed through ahorizontal beam splitter 164, which divides off a portion of the light(e.g., 50%) to waveguide 124 b, which meets waveguide 124 a at a rightangle. The construction of horizontal beam splitter 164 is describedbelow in greater detail after the general description of backplane(motherboard) 100. Waveguide 124 b is routed to the location where thelower-left MCM substrate 20 will be placed, and further over to thelocation where the lower-right MCM substrate 20 will be placed. Undereach location for the MCM substrates, waveguide 124 b passed through avertical beam-splitter 154, which directs a portion of the light upwardtoward the MCM substrate 20, where it is coupled into a waveguide 24 aby a receiving vertical coupler 44 (shown in FIG. 22). The constructionsof vertical beam splitter 154 and receiving vertical coupler 44 aredescribed below in greater detail after the general description ofbackplane (motherboard) 100.

Waveguide 124 c conveys an optical signal between the lower-left MCMsubstrate 20 and the lower-right MCM substrate 20. To receive theoptical signal from the lower-left MCM substrate, backplane(motherboard) 100 comprises a receiving vertical coupler 160 under theterminal end of the waveguide 24 h of the MCM substrate. The lightsignal from the lower-left MCM substrate 20 is transmitted verticallytoward the surface of backplane (motherboard) 100 by a transmittingvertical coupler 48. This light is received by a receiving verticalcoupler 160 of backplane (motherboard) 100, which bends the light by 90°and directs it into waveguide 124 c. Waveguide 124 c conveys the opticalsignal to a transmitting vertical coupler 156, which is positionedunderneath the lower-right MCM substrate 20. Coupler 156 bends theoptical signal by 90° and directs it vertically upward into a receivingvertical coupler 44 of the lower-right MCM substrate 20. Coupler 44receives the light, bends it 90° and directs it horizontally intowaveguide 24 g of substrate 20. The constructions of vertical couplers44, 48, 156 and 160 are described below in greater detail after thegeneral description of backplane (motherboard) 100. Waveguide 124 e isconfigured similarly to waveguide 124 c and it conveys an optical signalfrom the upper-left MCM substrate 20 to the upper-right MCM substrate 20in a similar manner using a similar configuration of vertical couplers.

Waveguide 124 d is coupled to an optical fiber 102 at one of its ends bya conventional V-groove connector 112, and receives an optical signal onfiber 102 from an outside source. Waveguide 124 d is coupled to a secondreceiving vertical coupler 156 at its other end, and the second verticalcoupler 156 directs the optical signal upward into a receiving verticalcoupler 44 of the lower-left MCM substrate 20. This vertical coupler 44directs the optical signal into waveguide 24 g of the lower-left MCMsubstrate 20. Optical waveguide 124 f is similarly coupled to an opticalfiber 103 by a V-groove connector 113 at one of its ends, and a thirdvertical coupler 156 at its other end. Waveguide 124 f receives anoutside signal from an optical fiber 103.

Waveguide 124 g is coupled to a second receiving vertical coupler 160 atone of its ends. This receiving vertical coupler 160 receives an opticalsignal from the lower-right MCM substrate 20 and directs it intowaveguide 124 g. The other end of waveguide 124 g is coupled to anoptical fiber 104 by a conventional V-groove connector 114, and theoptical signal in waveguide 124 g is conveyed as an output signal ofbackplane (motherboard) 100. Optical waveguide 124 h is similarlycoupled to a third receiving vertical coupler 160 (not shown in FIG. 21but underneath the upper-right MCM substrate 20) and an optical fiber105 through a V-groove connector 115. Waveguide 124 h conveys an outputsignal from the upper-right MCM substrate to optical fiber 105.

Power supply voltages may be conveyed from backplane (motherboard) 100to the MCM active substrates 20 by conductive pads 151 and 152, as shownin FIG. 21. The power may be distributed in backplane (motherboard) 100by conductive layers within active substrate 120. Active MCM substrates20 are augmented to have corresponding power pads for coupling to pads151 and 152. Backplane (motherboard) 100 may have electrical traces forconveying electrical signals between MCM modules. These electricaltraces may be formed in dielectrically-isolated conductive layers withvias being formed to respective connection pads.

Instead of using optical fibers to convey optical signals to and fromthe MCM module or backplane (motherboard), one may use what we call“film waveguide arrays” or simply “waveguide arrays”. Such a waveguidecomprises a thin flexible sheet of polymer material having plurality ofoptical waveguides surrounded by cladding material, and usually havingvertical couplers at one or both ends of the waveguides. One edge of thewaveguide array is adhered to an area of the active layer 120 in such away that its vertical couplers in its edge are aligned withcorresponding vertical couplers in layer 120. Fiber array or imagingguides are also useful. The optical power supply 136 may be placed onthe OE-MCM side, or it may be supplied by an external light source. Inthe latter case, the active substrate of backplane 120 may only havewaveguides, mirrors, and grating reflectors and no OE devices.

Having generally described the structure of backplane (motherboard) 100,the constructions of the beam splitters and vertical couplers ofbackplane (motherboard) 100 and MCM substrates 20 are now described withreference to FIGS. 22-26. In reviewing these figures, it will be seenthat the underlying base substrates 12 has been removed from activesubstrates 20, which enables better optical coupling of the opticalsignals between backplane (motherboard) 100 and active substrates 20.Base substrate 12 may comprise aluminum or silicon, quartz, glass orother removable substrate materials, for example, and may be removed byetching or other removal methods. Other etchable metals and materialsmay be used. In this case, a protective etch stop layer may be disposedbetween base substrate 12 and active substrate 20. In addition,substrate release techniques, such as those described in U.S. Pat. No.5,258,236 to Arjavalingam et al., may be used to separate base substrate12 from active substrate 20. These methods typically use a transparentsubstrate, a polymeric release layer that can be ablated by a laser beamdirected through the transparent substrate, and a reflective metal layerformed over the polymeric release layer to protect active substrate 20from the laser beam. Another approach is to use a silicon wafer with athick aluminum top layer as substrate 12, and then laterally etch thealuminum layer from the sides of the wafer (with a protective coating onthe top surface of active substrate 20) to separate active substrate 20from the silicon wafer.

FIG. 22 shows a cross-sectional view of backplane (motherboard) 100 andthe upper-left MCM substrate 20 in the region of vertical beam splitter154 of backplane (motherboard) 100 and receiving vertical coupler 44 ofsubstrate 20. Backplane (motherboard) 100 comprises a base substrate 12,a conductive layer 151 for providing one potential of the power supply(V_(C) or ground), a bottom cladding layer 121, a core layer 124, a topcladding layer 123, and a second conductive layer 152 for providing asecond potential of the power supply (ground or V_(C)). Layers 121, 123,and 124 may comprise the same materials as layers 21, 23, and 24,respectively, as previously described above. Also, in some cases,materials which have lower thermal stability (e.g., cannot withstandhigh processing temperatures like epoxy, acrylate, etc.) but which havelower optical propagation losses compared to layers 21, 23, and 24 maybe used for layers 121, 123, and 124. Vertical beam splitter 154 isformed in the path of waveguide 124 b, and comprises an optical gratingstructure 155, which may have a variety of configurations, as is wellknown in the art. Grating 155 comprises a periodic structure of opticalmaterial having an index of refraction which is different from that ofwaveguide 124 b (either higher or lower). When incident light strikesthe material of grating 155, a portion of the light is reflected fromthe surface of grating 155 to a vertical direction and a portion istransmitted through grating 155, with the ratio of the reflected andtransmitted portions being dependent upon the difference between theindices of refraction of the materials of grating 155 and the corematerial 124, and upon the number of periods in the grating. To achievea 90° angle between the incident light and the reflect light, at least aportion of surface of grating 155 is angled at or near 45° with respectto the path of optical waveguide 124 b. The gratings 155 are spaced suchthat the reflections from their surfaces are nearly in phase so that thereflections from the individual gratings constructively add to build thelight beam that is transmitted to active substrate 20. (The spacing isusually on the order of one wavelength of light, as measured in thematerials 124 and 155). U.S. Pat. No. 5,116,461 to Lebby, et. al.discloses a method for etching 45° angle trenches in polymeric materialfor the purpose of fabricating such grating structures. Once formed, theetched structures may be filled with material having a different indexof refraction. The fractional amount of light that is reflected upwardsis a function of the number of gratings and the difference in theindices of refraction, and can be computed using optical analysis knownto those of ordinary skill in the art.

Any number of the known grating structures may be used, and the gratings155 do not need to extend through the entire height of waveguide 124 b.If waveguide 124 b is formed from a photosensitive core material,potions of it corresponding to grating portions 155 may be removed byphoto exposure using an interference pattern, such as that generated byholographic means. In a similar manner, such an exposure may be usedwith a photo-refractive core material. In addition, other types ofperiodic grating structures may be used, such as that described by U.S.Pat. No. 4,806,454. Alternately, instead of using a grating asemi-transparent mirror (e.g., a metal mirror whose thickness and/orcomposition is selected to achieve a controlled reflectivity) or amulti-layer dielectric filter may also be used instead of a grating toperform the same function of vertically reflecting a fraction of thelight upwards.

The portion of light reflected vertically from grating 155 passes thougha ball of optical “glue” material 153 to substrate 20. The optical gluehas an index of refraction which is relatively close to that of corematerials 124 and 24 (e.g., much closer the indices of the waveguidesthan the index of air, n=1). The optical glue improves transmissionefficiency between backplane (motherboard) 100 and active substrate 20by reducing the magnitudes of reflected waves. Exemplary glues aredisclosed by Norio Murata in an article entitled “Adhesives for OpticalDevices”, the 48^(th) conference of the Electronic Components andTechnology Conference (ECTC, May 1998). Polyimide material can also beused. One may also form photo-refractive glues based on thephoto-refractive compositions disclosed in Japanese published patentapplications JP 9-157352, JTP 9-090153, JP 8-320422, 7-077637 andEuropean patent publication EP-689,067-A, which are assigned to theassignee of the present application. The self-focusing beam effect(SOLNET) described in our European patent application EP-689,067 may beused to form a vertical waveguide in the body of optical “glue” disposedbetween the substrates. In this process, the portion of material throughwhich a light beam is first passed through has its index of refractionraised by the light beam, which then causes this material to be a corematerial while the remainder of the material serves as a claddingmaterial. This creates a self-aligned vertical optical waveguide. Theinitial beam of light may be provided through one of the waveguides, orit may be provided by an external application of a writing light beamdirected from one side of the optical joint. In addition, it iseffective to provide light from both waveguides, or beams from bothsides of the optical junction.

In addition to these possibilities, one may use many conventionalbonding sheets or underfill materials to improve the optical coupling(over the case where there is no material between substrates) sincethese materials will have indices of refraction which are relativelyclose to that of the waveguides.

Vertical coupler 44 of active substrate 20 is constricted in a similarway as the optical waveguide which is coupled to the output of a VCSELdevice previously described and illustrated with respect to FIG. 9. Anoptical via 45 is fanned through layers 25 a, 23 b and cladding layer 21by forming an aperture in these layers by laser drilling, laserablation, or plasma etching (preferably after they have been cured), andthen filling them with core material, usually when layer 24 is formed.Then, mirror structure is formed by forming a bevel surface on thewaveguide as previously described, and thereafter forming a layer ofreflective metal or reflective material over the beveled surface in somecases, the optical vias are not needed, such as when the opticalabsorption coefficients of layers 25 a and 25 b are sufficiently low. Ananti-reflection (AR) coating maybe deposited on the surfaces of thesubstrate to reduce reflection of light.

FIG. 23 shows a cross-sectional view of backplane (motherboard) 100 andthe upper-right MCM active substrate 20 in the region of where opticalwaveguide 124 e meets a vertical coupler 156. The vertical coupler 156comprises a layer 158 of reflective metal formed on a beveled edge of aportion 157 of a material layer. The bevel may be formed by laserablation (with the laser at a 45° angle tilt to the material layer), bylaser assisted plasma etching (again with the laser as a 45° angle tilt,see for example U.S. Pat. No. 5,116,461), by plasma etching with atilted substrate, ordinary plasma etching with a tapered mask, or tiltedlithographic exposure (see for example Japanese patent JP 96-262265). Apreferred laser ablation method for forming beveled cuts is described ingreater detail below with respect to FIGS. 90-101.

Vertical coupler 156 can be formed in-situ and can be incorporated inthe processing steps for forming active substrate 20 previouslydescribed above and illustrated in FIGS. 11-18. Such exemplary steps areprovided below after the other optical couplers are described.

FIG. 24 shows a cross-sectional view of backplane (motherboard) 100 andthe upper-left MCM active substrate 20 in the region of where opticalwaveguide 24 h of the active substrate 20 terminates in a transmittingvertical coupler 48, which is over a receiving vertical coupler 160 ofbackplane (motherboard) 100. Transmitting vertical coupler 48 has thesame construction as receiving vertical coupler 44 shown in FIG. 23,except for the orientation of the mirror layer 46. Receiving verticalcoupler 160 has the same construction as transmitting vertical coupler156 shown in FIG. 23, except for the orientation of mirror layer 160. Itis also noted that instead of using couplers 156 and 158 on thebackplane (motherboard) side, one may use couplers 44 and 48 on thebackplane (motherboard) 100.

It is noted that the grating structure of vertical beam-splitter 154 maybe used in place of any of vertical couplers 156, 160, 44, and 48, withan appropriate orientation of the gratings 155. In these structures, thereflected light may be increased over the transmitted light by selectingmaterials that have a large difference in their indices of refraction.Alternately, to achieve complete reflection, a mirror can be usedinstead of beam-splitter 154.

FIG. 25 shows a top plan view of horizontal beam-splitter 164, and FIG.26 shows a cross-sectional view thereof. Its construction is similar tothat of vertical beam-splitter 154 except that the gratings are placedin a different orientation, as shown at 165. Gratings 165 are easier toform than gratings 155 since gratings 165 are not tilted with respect tothe surface of core layer 124. A simple anisotropic plasma etch or laserablation of core layer 124 using a metal or photoresist mask (plasmaetch only) or dielectric multilayer mirror (laser ablation only) may beused to form the apertures for gratings 165.

Referring now to FIGS. 90-108, a preferred laser ablation method forforming a beveled cut using a laser tilted at a 45° tilt angle impingingupon a shadow mask is shown in FIGS. 90-101. The preferred bevel cutmethod permits beveled mirrors to be fabricated which may be aligned toany preferred waveguide orientation. Moreover, the preferred bevel cutmethod permits different bevel cut orientations to be patterned on thesame wafer.

In a first step, as shown in FIG. 90, a metal or dielectric ablationmask layer 810 is deposited on a polymer waveguide substrate 20 havingcladding and core sub-layers, and optionally other components describedherein. The ablation mask layer 810 is lithographically patterned withapertures 811 where all of the mirrors will eventually be formed. Toreduce the number of lithographic patterning steps required, additionalmetal shadow masks 820-1, 820-2, 820-3, and 820-4 are used to selectwhich apertures are ablated at a particular cut orientation. The shadowmasks 820 preferably block, or obscure, a fraction of the apertures 811.Preferably, the shadow masks 820 have apertures 821 slightly larger thanthe lithographic apertures 811 which are to be ablated in a particularablation step. A shadow mask 820 may be in direct contact with the wafersurface or placed slightly above the wafer surface.

To form a first bevel cut step, a metal shadow mask 820-1 is placed overthe wafer to protect a desired fraction of the lithographicallypatterned apertures 811 from exposure. Referring to FIG. 91, thesubstrate 20 and laser 830 are oriented with respect to one another sothat one edge of each exposed lithographic aperture 811 is uniformlyshadowed by the ablation mask 810 during exposure of the polymer layerby the excimer laser beam 830 whereas the opposite edge of the apertureis undercut. That is to say, in the aperture of an exposed ablation maska profile of constant illumination intensity as a function of depth inthe trench forms a parallelepiped shaped region wherein the tilt of theparallelepiped relative to the surface normal of the trench is afunction of the tilt angle of the laser. To form mirror surfaces, thesubstrate 20 and laser beam 830 are oriented at angle with respect toone another, including refraction and diffraction effects, to formaperture sidewalls which have an angle of approximately forty-fivedegree (45°) relative to the surface normal of the bottom of thewaveguides (i.e., the top and bottom surface of the waveguides). Thelaser beam is scanned over the surface of shadow mask and substrate,such as by moving the laser beam or the substrate, or by a combinationof moving both. We have called this scanning method “moving neonablation”, or NMA, method, although other types of lasers may be used.The laser exposure forms parallelepiped-shaped trenches 840 innon-shadowed apertures with a forty-five degree side-wall angle on twoof the walls as a consequence of the shadowing effect of lithographicmask layer 811, as shown at 840-1 in FIG. 92 where shadow mask 820-1 hasbeen removed. The process may be repeated by changing the orientationangle between the surface normal of substrate 20 and laser 830, placinga second shadow mask over the surface to expose other apertures and thenappropriately orienting the sample in another direction. (To distinguishthese directions in the figures, we have assigned four directions 1-4 atthe edges of the substrate.) For example, in order to form beveled cutson the other two side walls, the sample may be rotated ninety degreeswhile keeping laser 830 fixed (as shown in FIG. 93, and then exposedagain using a different shadow mask 830-2, as shown in FIG. 94. Theresulting angled trench is shown at 840-2 in FIG. 95. By repeating theprocess, mirror surfaces with an arbitrary cut orientation and positionsmaybe formed. This is shown by FIGS. 96-101, where two additionalablation steps using two additional shadow masks 820-3 and 820-4 areshown with corresponding trenches 840-3 and 840-4.

The same ablation process may be modified to obtain vertical sidewallsas well. Orientating the beam normal to the surface of the ablation maskwill result in no shadowing. Consequently, the laser light will enterthe aperture at a normal angle. This is shown in FIGS. 102-104, whereshadow mask 820-4 has been used to form vertical sidewall cuts ratherthan angled sidewall cuts.

As is known in the field of integrated optics, vertical sidewalls may beused to form reflective surfaces to deflect a waveguide mode intoanother co-planar waveguide formed from the same active layers butoriented along a different direction, as shown in FIGS. 105 and 106,which are top plan and cross-sectional views of a corner turning mirror850. This is useful, for example, in forming corner turning mirrors in awhich a forty-five degree reflective surface is used to horizontallydeflect the waveguide mode by a reflection angle of ninety degrees. Asis well known in the field of integrated optics, the efficiency of acorner-turning mirror is strongly dependent upon how vertical the mirrorsurface is. A mirror surface that deviates even a few degrees from atrue vertical surface has a significantly reduced efficiency. Thus,while RIE may be used to form a corner turning mirror, a laser ablationmethod is a preferred method because of its potentially smoother andmore vertical mirror surfaces.

Referring to FIG. 105, light in a first waveguide section 851 reflectsagainst a forty-five degree mirror surface 850 into a secondperpendicular waveguide 852. The mirror preferably comprises a portionof the waveguide that is etched normal to the wafer surface. The etchedsurface is preferably etched all of the way through the core layer 24and cladding layer 23 in order to achieve substantially completereflection of light from first waveguide section 851 to second waveguidesection 852. However, if less than complete reflection is desired, themirror may only be partially etched through the outer cladding so thatthe effective reflection coefficient is reduced. As shown in FIG. 106,after the polymer cladding and core layers 23 and 24 are ablated, theside walls may also be coated by a reflective metal mirror surface 853,followed by deposition of the overcladding layer. The substrate maylater be removed, if necessary.

A variety of different mask structures may used in a laser ablationprocess. In addition to a metal mask, a reflective multi-layerdielectric mask, may also be used. A multi-layer dielectric mask maycomprise materials with a low optical absorption at excimer laserfrequencies. Additionally, the dielectric constants and layer thicknessof a multi-layer dielectric may be selected so that the mask efficientlyreflects light at the excimer laser frequency. Generally, any mask thatablates at a significantly slower rate than the polymer layer may beused. A multi-layer dielectric lithograph mask is preferable, since itscan be relatively thin, thus improving edge resolution. A laser ablationprocess preferably includes means to translate the beam relative to thesample to expose an large area. Any common technique may be used forthis purpose, such as a movable stage or optics to scan the beam. Whilean excimer laser is a preferred laser, other ultraviolet lasers, such asthe THG-YAG or FHG-YAG laser may also be used. An ablation gas, such asHe, can be used for the carrier.

Many of the same principles may be used in a reactive ion etching (RIE)process. An RE mask may be deposited and patterned on the surface of thesubstrate to form apertures. Additional shadow mask may then be used toprotect some of the apertures from RIE. Directional RIE at obliqueangles has ions impinging upon a substrate. Shadowing of ions will occurin a similar manner from a mask, thereby producing tilted sidewalls.Thus, the above process in FIGS. 90-104 may be repeated using an RIEprocess in place of a laser beam.

FIGS. 107 and 108 are top plan and cross-sectional views of anotherembodiment of a waveguide coupler with forty-five degree waveguidemirrors. A waveguide cladding layer 21, such as Fluorinated polyimide,is first deposited on a removable substrate, such as an Aluminumsubstrate. The core layer 24 is then deposited. The core layer 24 ispatterned into waveguides. An overclad layer 23 is deposited over thepatterned core layer 24. The core layer 24 and clad layers are thenpatterned using RIE or laser ablation to form mirror/coupler surfaces.The surfaces are then metalized, as shown at 853. The substrate is thenremoved. The substrate removal can be done after the film is attached toanother board or film. Other variations, such as forming electricalcontact pads and vias may also be performed before the substrate isremoved. Optional buffer and passivation layers may also be added. Ifdesired, the mirror may also be formed after the core layer 24 is formedprior to deposition of the overcladding layer 23.

Referring now to FIGS. 27-30, as mentioned above, the fabrication ofvertical couplers 156 and 160 shown in FIGS. 20-26 maybe easilyincorporated in the fabrication steps for making optical switch 26previously described above and illustrated in FIGS. 11-18. Theadditional steps are illustrated with respect to FIGS. 27-30. Referringto FIG. 27, at the same time of forming bottom electrode 27 for switchdevice 26, a bottom metal patch 159 is formed for the vertical coupler.Metal patch 159 serves as a barrier layer to a subsequent laserdrilling, laser ablation, or plasma etching process, and is locatedmainly where a laser beam in this subsequent etching step will bit layer121. Next, material layer 157 (the same as layer 626) is formed, andthen a top metal mask layer 161 is formed which has apertures where thebeveled cuts will be made. An angled etch is then performed to form anangled aperture 162 and the beveled edge for the vertical coupler. Theangle etch may be performed by the previously-described steps of laserablation, moving neon ablation (MNA) (previously described in regards toFIGS. 90-104), laser assisted plasma etching with tilted laser, or byplasma etching with tilted substrates or ordinary plasma etching with atapered mask, etc. Layer 161 acts as etch mask for this step byproviding the aperture through which the laser light will pass andstrike layer 626 to form the angled trench. In the case of MNA, thesecond masks are used, and repeated ablation with changing angles may beperformed. If the material is photosensitive, the angle cut may bedefined by exposing the substrate to actinic radiation (whose beamdirection is tilted with respect to the substrate surface), followed bydeveloping the image. A blanket exposure to actinic radiation may bedone since layer 161 acts as a portable conformal mask (PCM). The resultof these steps is shown in FIG. 27.

Referring to FIG. 28, layer 161 is iii en removed, and the combinedetch-stop/polish-stop layer 627 is formed over the surface of thesubstrate, as in the previously described process. Next the mirror metal158 for the vertical coupler is formed over layer 627, and then bothlayers are defined simultaneously by a standard pattern etched stepthrough a patterned photoresist layer. The substrate is then subjectedto a standard plasma etching process, as in the previously describedmethod, which selectively etches polymeric material anisotropically.Such plasma etches are well known to the art. The result of these stepsis shown in FIG. 28. Next, core layer 124 is formed over the substrateand cured, as shown in FIG. 29. Finally, the structure is polished bychemical mechanically polishing, as in the previously described method.The result is shown in FIG. 30. Typically, the top-most portions ofmirror metal 158 are more easily removed than the polish-stop layer 627.The processing of the substrate then resumes with the previouslydescribed steps after the polishing step (FIG. 15). As an optional step,top cladding layer 123 may have an aperture formed above the beveledmirror section and filled with the same material as core layer 124 b. Ingeneral, it is not necessary to etch cladding layer 123 in thoselocations where the light is reflected vertically from the core materialbecause the exiting light strikes the cladding layer at nearly a 90°angle, which is greater than the critical internal reflection angle.However, there is some amount of reflected light, and corresponding lossof efficiency, when there is a portion of cladding layer above themirror, and this amount increases as the difference in indices ofrefraction increases.

It is desirable to have process variations which reduce the waveguidelosses associated with any optical scattering associated with interfaceroughness at the CMP polishing surface. In the core layer coating stepshown in FIG. 29, an optional clad layer can be coated on the core layerin order to improve the interface smoothness proximate to the corelayer. After the core layer is cured (partially or fully), the optionalcladding layer is coated followed by soft and full curing. If the corelayer thickness is a little bit thinner than OE device height, thepolishing plane will lie in the optional cladding layer above the corelayer. This two-layer approach may improve the interface flatnessbetween core and clad layer, since the optional cladding layer may bepolished to a common plane resulting in a potential reduction in opticalscattering losses. Additionally, the polishing plane may lie asignificant distance in the cladding layer (e.g., more than a fewthousand Angstroms) so that the optical intensity at the polishedsurface is reduced, further reducing scattering losses. It may thus bepreferable to select the thickness of the core layer to be close to orless than the OE device/material height excluding the top metal sincethis permits the thickness of the optional cladding layer to bedetermined by the selection of the top metal thickness. Alternately,optical scattering losses may be reduced if the CMP process is appliedafter over cladding layer formation not after core layer formation.Another approach is to not perform CMP processing on either the corelayer or the top cladding layer. This results in a non-planar surface,which can be planarized, if needed, by forming a planarizing layer overthe top cladding layer and then performing CMP processing on theplanarizing layer.

The fabrication process may also be further modified to eliminate CMPpolishing steps which may introduce optical scattering losses at keyinterfaces. When a photo-sensitive material, which is hardened by lightexposure, is used to pattern the waveguides, CMP is not alwaysnecessary. After the step shown in FIG. 29, waveguide patterning can becarried out by light pattern exposure if the core layer is coated in anappropriate thickness of a photo-sensitive material, that is, close toor less than the OE device/material height excluding the top metal.Although the patterned waveguide may traverse a portion of the45-degree-surface of the reflector, this will not significantlyinterfere with its function in reflecting the guided light. Additionalplanarization layers may be applied after the overcladding layer isformed, if necessary.

The step of forming the beveled mirror surface may be performed afterthe top cladding layer is formed over the core layer. In this case,complete reflection is expected since the evanescent wave can bereflected. That is to say, the mirror surface can be etched through theupper cladding and core layers at least through part of theundercladding layer so that the entire optical mode intercepts andreflects from the mirror surface. As is well known in the field ofintegrated optics typically a small percentage of the optical mode powerexists as an evanescent “tail” in the cladding regions. Thus, theefficiency of the mirror in reflecting mode energy is improved,somewhat, if the mirror surface extends through the upper and lowercladding layers.

The interconnection substrates having active layers may also be mountedvertically to a backplane (or motherboard) with optical signals beingtransmitted/received at the edges of the interconnect substrate, andbeing received/transmitted at the surface of the backplane (ormotherboard). An embodiment of this configuration is shown at 200 inFIGS. 31-32, where a plurality of OE-MCM substrates 10″ are mountedvertically to a backplane (motherboard) 210. MCM substrates 10″ arefabricated in the same manner as MCM substrates 10 and 10′ previouslydescribed, except that most of the waveguides which covey incoming andoutgoing signals to the MCM substrate 10″ are routed to the edge of thesubstrate which abuts backplane (motherboard) 210. Backplane(motherboard) 210 comprises a base substrate 212, an active layer 120″,and a plurality of waveguides 224 a-224 g formed in active layer 120″.Waveguides 224 a-224 g are used to covey optical signals between the MCMsubstrates 10″. When optical switch devices (e.g., modulators) are usedto transmit optical signals instead of light-emitting devices, externallight power source are used. To provide external light sources, oneexample is to use an optical power source board 280 which interfaces tobackplane (motherboard) 210 in the same manner as MCM substrate 10″. Inthis case, waveguides 224 a-224 g may also convey sources of light powerwhich are provided by optical power source board 280. Power source boardcomprises a plurality of laser diodes LD whose outputs are routed ontowaveguides of board 280, which in turn are routed to the edge of theboard where it abuts to backplane (motherboard) 210. The outputs of twoor more laser diodes LD may be combined by a Y-combiner to increase thepower level in such a waveguide and/or to add or multiplex light of twoor more wavelengths on the same waveguide. This is shown by the middletwo laser diodes LD on board 280. Multiple wavelengths of light can beseparated from one another by grating filters, which are constructed inthe same way as the grating beam-splitter described above. In somecases, it may be realized by forming dielectric multi-layer filtersinstead of metal reflective layers. Demultiplexing of themultiple-wavelength signals may be performed on the MCM or on thebackplane (motherboard). Board 280 may be constructed in the same way asMCM substrates 10 and 10′.

Vertical couplers, such as coupler 160, are located within active layer120″ of backplane (motherboard) 210 to couple optical signals betweenwaveguides 224 a-224 g of backplane (motherboard) 210 and the waveguidesof OE-MCM substrates 10″ and power source board 280. (Other opticalcouplers maybe used, such as couplers 154 and 156 shown in FIGS. 22-23,or the same type of couplers 44 and 48 in which the mirror is formed onthe end portions of the core and cladding layers). FIG. 32 shows across-section of the system configuration 200 in a region where thefront-most OE-MCM substrate 10″ abuts against backplane (motherboard)210. For visual simplicity, FIGS 31 omitted the details of how thesubstrates 10″ were abutted to backplane (motherboard) 210; FIG. 32shows an example of those details. One will first see that the activelayer 20″ of MCM substrate 10″ has been separated from the basesubstrate 12 along the edge where substrate 10″ abuts backplane(motherboard) 210. This configuration provides several benefits. First,it enables the base substrate 12 of substrate 10″ to be firmly held by areceptacle 225 without damaging the waveguides at the end of substrate10″. Second, it enables electrical traces 30′ on the top surface ofsubstrate 12 to be routed to the edge of the substrate and mechanicallycoupled to a conventional electrical connector 226 in receptacle 225.Thus, there is no need to form vias though substrate 12. (If substrate12 comprises a multi-layer electrical substrate, then vias are usuallypresent.) Each electrical signal on a connector 226 is routed to acorresponding connection pad 232 of backplane (motherboard) 210 by arespective wire 227 and connection pad 228. Connection pads 228 and 232are soldered together, which conveys the electrical signals, ground, andpower, and which also serves to attach receptacle 225 to backplane(motherboard) 210.

As a third benefit, the separation of active layer 20″ from substrate 12enables the waveguides in layer 20″ to be more accurately aligned to thevertical couplers (e.g., 160) in layer 120″ of backplane (motherboard)210. Oftentimes substrate 12 has a few microns of warpage; such warpagecould cause large misalignments between the waveguides and the verticalcoupler. A second receptacle 235 is adhered to the top surface ofbackplane (motherboard) 210, and is more accurately positioned withrespect to the vertical couplers (e.g., 160) in backplane (motherboard)210. When MCM substrate 10″ is inserted into receptacle 225, theflexibility of active layer 20″ enables it to be guided into secondreceptacle 235, and therefore into very accurate alignment in the X-axisdirection with the vertical couplers (see FIG. 31 for the coordinatesystem definition). A standoff bridge 237 is used on MCM substrate 10″to maintain separation of layer 20″ from substrate 12 in theX-direction. To achieve accurate alignment of the waveguides to thevertical coupler in the Y-direction, receptacle 235 may comprise a slot239 (see FIG. 32) whose length is parallel to the Z-direction, and MCMsubstrate 10″ may have a key 238 disposed on the top surface of activelayer 20″ and which fits snugly within slot 239. To achieve good opticalcoupling in the Z-direction, a small amount of optical glue or liquidrefractive material maybe disposed in the bottom of receptacle 235 anddried to a viscous or tacky state, and the end of active layer 20″ maythen contact the layer of optical glue and be adhered thereto. Bydirectly contacting the edge of active layer 20″ to layer 123, opticalglue may no longer be needed to achieve substantially the same degree ofgood optical coupling. If necessary, anti-reflection coatings may beapplied on the edges of active layer 20″ and 123 to improve the opticalcoupling between these surfaces.

It may be appreciated that conventional optical couplers may be used tocouple the waveguides from MCM substrate 10″ to backplane (ormotherboard) 210. This type of connection is convenient because itpermits commercially available connectors to be used. In this case, twomore connections per waveguide are needed, which increases the opticalloss because of the optical insertion loss of the couplers. Referring toFIG. 32, a first waveguide connector could be attached to the edge or atthe surface of active layer 20″ whereas a second surface normalconnector could be attached to the surface of layer 123 proximate tovertical coupler 160. The first and second connector may be coupledtogether. However, there are optical losses associated with thetransitions at each waveguides/connector interface and also at theconnector/connector interface. It may also be appreciated that opticalsignals and optical power sources may also be provided to MCM substrates10″ by optical fibers 102, film waveguides, optical fiber array, orimaging guides, which are coupled to waveguides in the active layers 20″of substrates 10″ by conventional V-groove connections 112 or surfacenormal connectors.

While the active layers 20″ and 120″ have been shown as being directlyconstructed on their respective substrates 12 and 212, it may beappreciated that they can be constructed separately and then bonded torespective substrates or printed circuit boards. The embodiment is shownin FIG. 32-1. This approach enables one to use different technologiesfor constructing the electrical interconnections and the opticalinterconnections. It also make it easy to separate active layer 20″ fromsubstrate 12 at the edge where MCM substrate 10″ abuts to backplane 210.In the case of the FIG. 32 where active layer 20″ is built up onsubstrate 12, a sacrificial patch of material may be disposed onsubstrate 12 alone the edge where layer 20″ is to be separated fromsubstrate 12, and so disposed before active layer 20″ is formed. Afterlayer 20″ is formed, the sacrificial patch is etched away laterally fromthe edge.

Referring now to FIGS. 33-37 for additional embodiments of theinventions based on the active substrate technology, IC chips may beencapsulated in a dielectric film with contact pads formed on the filmsurface for attachment to an active substrate. This enables the stackingof the alternating IC chip layers and active substrate layers to form a3-d multichip module with both electrical and optical interconnects.

FIG. 33 shows a schematic cross-sectional view of a chip layer 350attached to an active substrate 320 to form a module 300. In the exampleshown, two chips 351 and 352 are encapsulated in a dielectric film 354and the active substrate 320 comprises a VCSEL emitter device 336 and aphoto-detector device 328. The chip layer 350 may be laminated to theactive substrate 320 by an anisotropic conductive film 302. Such filmsare well known to the art. The VCSEL emitter device 336 is controlled bychip 351, and transmits an optical signal to a vertical coupler 344 inthe active substrate 320. A waveguide 324 a is coupled to the verticalcoupler 344. Waveguide 324 a conveys the signal to a transmittingvertical coupler 348, which directs the light signal to photo-detectordevice 328. The electrical outputs of the photo-detector device arecoupled to circuitry on second chip 352. Chip layer 350 and activesubstrate 320 also convey electrical signals to one another throughopposing contact pads 332, and may have electrical traces 330 andelectrical vias 333. The contact pads 332 are coupled to one anotherthrough spheres of conductive material that is dispersed in anisotropicconductive film 302. The electrical connection provided by pads 332 isoften called a Z-axis connection because the connection is madevertically, rather than in the plane of the substrate (which would bethe x- and y-axes).

For the sake of visual simplicity, the structure of the active substratehas only been shown schematically with the understanding that the basiclayer structure is the same as that shown in previous embodiments, andthat the active substrate may be constructed with the previouslydescribed construction steps. In addition, the relative sizes of theactive components to the chip and pads are not to scale. The VCSEL andphotodetector (PD) are shown larger than in constructed configurations.An exemplary detailed structure of the IC chip layer and exemplaryconstructions steps are provided below.

Instead of joining IC chip layer 350 to active substrate 320 with alayer of anisotropic conductive material, one may use an adhesivebonding sheet. In order to join the electrical pads 332 of layer 350 tothe pads 332 of substrate 320, holes are made through the bonding sheet(such as by pre-punching) in the locations of the pads, and conductivebonding material is disposed on one set of pads. Substrate 320 and layer350 are then laminated together with heat and mild pressure. One mayalso use the multilayer lamination process described in U.S. patentapplication Ser. No. 09/192,003, filed November 13, 1998, entitled“Multilayer Laminated Substrates with High Density Interconnecis andMethods of Making the Same,” assigned to the assignee of the presentapplication, and invented by Messrs. Hunt Jiang, Toni Massingill, MarkMeCormack, and Michael Lee. In addition, one may also use the gas-lesssolder paste described in U.S. patent application Ser. No. 09/203,126,filed Dec. 1, 1998, entitled “Conductive Composition, ” assigned to theassignee of the present application, and invented by Messrs. MarkMcCotmack, Hunt hang, Solomon Beilin, Albert Chan, and YasuhitoTakahasbi for the conductive bonding material nsed in the holes of thebonding sheet. The Z-axis connection of pads 332 can also be done bysolder joint or by metal diffusion joint. Metal diffusion joints areespecially useful for making fine Z-connections (i.e., smallZ-connections). In addition, the wire-interconnect structures (WITs)disclosed in U.S. Pat. No. 5,334,804, to Love, et al., and assigned tothe assignee of the present application, may also be used, preferablywith an underfill material. Any of the above methods and materials maybe used to join various substrates together in the previously-describedembodiments, and in the embodiments still to be described below in thepresent disclosure. An underfill material can also be used instead of abonding sheet for solder joints, metal diffusion joints, TLB joints, orWIT connections.

Additional IC chip layers 350 and active substrate layers 320 may bestacked upon one another and connected to one another by additionalanisotropic films 302 or bonding sheets or other Z-connection methods,as shown in FIG. 34. The active substrates 320 which are within thestack are preferably separated from the base substrate 12 used toconstruct them, which may be done by any of the above-describedsubstrate separation methods. Some of the vias 333 of the layers 350 andsubstrate layers 320 may be stacked upon one another to convey groundand one or more power supply voltages to all of the layers, and to coveyelectrical signals from one chip layer 350 to another chip layer 350. Anadvantage of using a bonding sheet, or the multilayer lamination processdeveloped by Hunt, et al., or other Z-connection methods except forthose using anisotropic conductive sheets, is that optical signals maybe transmitted vertically between an active substrate 320 and an IC chiplayer 350 without being blocked by the conductive spheres or opaquematerial that is often used in anisotropic conductive films. The opticalZ-connections are not shown in the figure; they can be readily realizedby waveguide couplers, such as couplers 344 and 348.

The waveguides and the other active components of active substrate 320may be fabricated in separate layers, as shown in FIGS. 35-36. In thisexample, the active substrate has been divided into a waveguide layer320 a and active-component layer 320 b. Layers 320 a and 320 b arejoined together by an adhesive bonding sheet 302′ as described above, orby the multilayer lamination process by Hunt, et al., or by solderjointing, metal diffusion bonding, TLB bonding, or WIT connection. Inthe case the solder joints, metal diffusion bonded joints, TLB bondedjoints, or WIT connections are used, one can also use a conventionalunderfill in place of the bonding sheet.

FIGS. 37-1 through 37-4 shows schematic diagrams of various ways lightemitter devices (e.g., VCSELs) and switch devices 3 xx (e.g., lightmodulators) may be incorporated in multiple layers. In FIG. 37-1, twoWaveguides in two separate layers are optically coupled (opticalZ-connection) to one another through a transmitting vertical coupler anda receiving vertical coupled, each of which are attached to ends ofcorresponding waveguides. A light modulator device is placed between inthe optical path between the two vertical couplers, and is encased in aseparate layer. The light modulator device comprises a body of EOmaterial (or electro-absorption (EA) material) and two contacts made torespective surfaces of the body. The body of EO (or EA) material maycomprise an individual chip which is set during manufacturing of thelayer, or the body may be formed in situ, such as was done for the EOmaterial of switch device 26 shown in FIGS. 11-18. FIGS. 37-3 shows thesame configuration except that the bottom waveguide has been replaced byan emitter device (e.g., VCSEL). In both of these examples, the layeesare built upon one another by a build-up fabrication process without theuse of bonding sheets and Z-connection methods. However, if necessary orotherwise desirable, the three layers may be separately manufactured andjoined together with bonding sheets, or underfill and solder joints,metal diffusion joints, TLB joints, or WIT connections. An example ofthis is shown in FIGS. 37-2, which provides the same opticalconnectivity as the layer configuration in FIGS. 37-3. Finally, FIGS.37-4 shows an emitter device on one layer which couples into a waveguideon a second layer without an intervening light modulator device. In theabove examples, contacts to the opto-electronic devices may be routed tothe bottom surface of the layer using vias. Conversely, in the examplesof FIGS. 33-36, at least part of these layers can be built upon oneanother by a build-up fabrication process. Generally, any of the stackedstructures of the present invention may be fabricated by a build-upprocess.

In embodiments where layers are separately manufactured and thenassembled, as an option, one may use photo-refractive underfillmaterials or photo-refractive bonding sheets between the individuallayers. With such an under fill, one is then able to form verticalwaveguides through several stacked layers of components and underfill byusing the SOLNET waveguide formation process described in Europeanpatent application publication No. EP-689,067-A, which is incorporatedherein by reference, and which is assigned to the assignee of thepresent application, and which has Japanese priority patent applicationsJP 94-140502, JP 94-200974, JP 94-204922, JP 95-59240, and JP 95-61092.In this process, a light beam is focused on the location where thevertical waveguide is to be formed, and the photo-refractive materialincreases its index of refraction in response to the beam.

In FIGS. 33-37, only one light emitting device (VCSEL) and only onephoto-detector device or light-modulator (switch) device have been shownfor visual simplicity. Typical applications of the present inventionwill have several or a number of such opto-electronic devices. Insteadof VCSELs, photodetectors, and optical switches, one can usedriver-integrated VCSELS, driver-integrated switches (modulators), andamplifier-integrated photodetectors, respectively. In such cases,additional pads for power supplies and ground may be needed, aspreviously described. Chips 351 and 352 can be VCSEL driver and/oramplifier. IC chip layers can be stacked on each other. For example afirst IC chip layer for processor chips stacked upon a second IC chiplayer for drivers and amplifiers, which is then stacked upon and activesubstrate provides a structure where outputs and inputs of the fistchips layer are provided to drivers and amplifiers in the second IC chiplayer, which are in turn coupled to OE devices in the active substrate.In this case, the connection pads of the drivers and amplifiers can bemade to face the pads of the first IC chip layer. It may be possible tomake vias through driver/amplifier thin film chip. Or the chip may bedivided into small pieces corresponding to VCSEL and photodetectorsfanning vias in surrounding polymer layer. It may also be possible touse ordinary die chip (not film) for the processor. In this case astructure such as a processor die/driver amplifier IC layer/and activesubstrate is constructed. In FIGS. 110 and 111 shown below, the samesituation is possible. The driver/amplifier chip described above maycomprise circuits such as driver circuits, amplifier circuits, biascircuits, temperature stabilizing circuits, (clock) skew compensationcircuits, timing circuits, and other applicable circuits. It is alsopossible that chips (including driver/amplifier chips and orprocessor/memory chips) and OE-devices (such as VCSEL, photodetectors,and others) can co-exist in the same layer in FIGS. 33-37 and 110 and111.

The chips in the chip layer can be thin film driver/amplifier chip withvias or divided thin film driver/amplifier chip. The structures shown inFIGS. 33-37 and 110-111 can be applied to all the embodiments describedin this application, including FOLM and OE-MCM.

In addition, while non-branched waveguides have been shown in thesefigures for visual simplicity, typical applications will have branchedwaveguides, as previously illustrated in prior figures. The waveguidescan be multiple-layer structures if the connection density is high.Generally, in all of the embodiments of the present application,multiple-layer waveguides may be used, as required, if the connectiondensity is high.

The multiple-layer structure can be fabricated by a building-up processor by a z-connection process. In some applications, the waveguide fromswitch devices (e.g., modulators) and/or light emitting devices (e.g.,VCSELs) may be connected to external optical fibers, or to fiber arrays,or fiber imaging guides, or external thin films which carry a pluralityof waveguides. We call the latter three external components “filmwaveguide arrays” or simply “waveguide arrays”. These optical fibers andwaveguide arrays convey light signals away from the systems created bythe laminated components shown in FIGS. 33-37. In a similar manner,these external optical fibers, fiber arrays, fiber imaging guides, andwaveguide arrays can convey optical signals to photo-detector devices inthe active layers. In each case, the optical fiber, fiber array, fiberimaging guides or waveguide array is attached to a system layer at aplace where it is optically coupled directly to an internal waveguide orto a vertical coupler or beam splitter. A waveguide array may be coupledto one of layers 320, 320 a, 320 b, or 350 by forming this layer to havea tab portion at one of its sides which extends past the dimensions ofthe laminated stack, and this attaching the external waveguide array tothe extended tab. Surface normal connections can be used for the bottomand top layers. An additional benefit of this structure is thatunoccupied gaps between the layers 320, 320 a, 320 b, 350 may also beused as channels for a coolant gas or liquid to flow through thestructure.

An exemplary method for constructing IC chip layer 350 is illustrated inFIGS. 38-45. Referring to FIG. 38, the vias through IC chip layer 350are first formed by taking a temporary substrate 412, and forming viaposts over its top surface. Any of the previously described methods ofattaching and removing temporary substrates may be used (see U.S. Pat.No. 5,258,236 to Arjavalingam et al.). The via posts may be formed byelectroplating or by sputtering, or by other methods. In theelectroplating formation method, a temporary seed layer is sputteredover the surface of substrate 412, a thick photoresist layer is thenformed over the substrate surface and patterned by lithographic patternexposure and pattern development, as is well known to the art. Viaapertures are thereby formed, and conductive material is then platedinto the via apertures by any conventional electroplating method. Coppermaterial is currently preferred, but other metals may be used. Onepreferably plates the conductive material to a greater thickness (orheight) than needed in the final structure. In a sputtering method, athick layer of conductive material is sputtered over the entire surfaceof the substrate. A photoresist is then formed over the sputtered layer,and then patterned exposed and developed to leave portions ofphotoresist over those locations were the vias will be formed. Theremaining exposed portions of the photoresist layer are then etchedaway. After the etch, the remaining photoresist is removed.

As the next step in each of the via formation processes, the photoresistlayer is removed, and the plating seed layer may be removed. As avariation to the basic method of forming IC chip layer 350, the seedlayer may be retained and used in a later processing step to form theelectrical traces on the bottom surface of layer 350. The seed layer mayalso be patterned at this general stage of the method to define theelectrical traces 330 and interconnection pads 332 at the bottom surfaceof the IC chip layer 350. In this latter case, the seed layer is made tobe relatively thick, such as by depositing additional conductivematerial by a blanket electroplating step. After the via posts have beenformed in the photoresist layer, the photoresist layer may be patternexposed and developed a second time (for a positive photoresist) todefine the traces and pads to be formed at the bottom surface. Thispattern step removes the positive photoresist in those locations wheretraces, pads, and vias are not to be formed. This second patterning stepexposes the unwanted seed layer, which is then etched away by a suitablechemical etchant. The remaining photoresist is then removed. Thedefinition steps of the thick seed layer may be delayed to a final step,as described below. As is well known in the art, a photoresist layer issometimes exposed to a soft-bake step after being patterned exposed inorder to improve the image. As a cautionary note, such post-exposurebaking operations can reduce the amount of photo-initiator in a positivephotoresist if the temperature exceeds an amount specified by themanufacturer. Thus, in order to have an effective second exposure, thecritical temperature of the photoresist should not be exceeded in anysoft-bake step after the first pattern exposure. In the case that thisis not possible, and also in the case that a negative photoresist havebeen used, one may pattern the photoresist layer by anisotropic plasmaetching through an etch mask.

Referring to FIG. 39, the next step in the process is to attach the ICchips 351 and 352 to the surface of the temporary substrate 412. To dothis, a thin polymeric adhesion layer 414 may be formed over the surfaceof substrate 412 by spin coating. Chips 351 and 352 (or activecomponents) are then set in place and adhered to layer 414. Layer 414may be soft-baked to increase its tackiness, and to reduce the amount ofsolvent evolution in a subsequent cure step if the material of layer 414requires curing and contains solvent. This chip attachment step is thesame step used in the previously-described method for forming activesubstrate 20 (FIGS. 11-18), and the reader may refer there for furtherdetails. If the seed layer in the previous step has been retained,either in whole or in patterned form, then it is preferable that a thinchromium adhesion layer be formed over the seed layer before layer 414is formed. Such an adhesion layer is also preferred if material 414 hasan unacceptably poor adhesion to the particular material of substrate412. As another approach for attaching chips 351 and 352, a metal padmay be formed on the seed layer, and the back surfaces of the chips arecoated with metal. The chips may then be attached by the previouslydescribed metal bonding and TLB methods, as well as by conventionalsoldering. By the time layer 350 is completed, the metal pads at theback surfaces of the chips should be electrically isolated from signallines on the bottom surface of layer 350 (but a coupling to a fixedground or bias potential may be used if required by the electricalcircuit).

Since a subsequent polishing process is going to be used, chips 351 and352 preferably have electrodes 27 which have the multilayer metalstructure 27 x, 27 y, 27 z described above (FIG. 11), with sub-layer 27y comprising a polish-stop metal like tungsten (W). This multilayerstructure is best formed while the IC chips are still in wafer form(i.e., not diced). If the chip has large areas of its surface in whichthere are no electrodes, then it is preferable to deposed an isolatedpatch of polish-stop material in these areas in order to prevent dishingin the subsequent polishing process. Such a polish-stop layer ispreferably formed over the chip's top passivation layer. Chips 351 and352 may typically be manufactured with the above-described epitaxiallift-off process, which enables one to make very thin chip components(in the range of a few microns to a few tens of microns). If the chipsare manufactured with thick-wafer technology, then it is preferred thatthe chips be pre-polished at their back surfaces to reduce theirthicknesses. This may be done while the chips are still in wafer form,and such pre-polishing methods are well known to the art. Since highlyuniform polishing methods are well known in the art, and continue toimprove, it may also be possible to obtain thin-film chips by polishingwithout ELO. In this regard, a chip thickness of 5 μm to 50 μm isacceptable.

While FIG. 39 shows that the IC chips 351 and 352 are placed in the faceup position, it may be appreciated that the chip may be placed in theface down position. If the pads and electrical traces for the bottomsurface of layer 350 have been formed in the previous steps, it is thenpossible to not use adhesion layer 414 and to then directly contact thepads of the chips to the traces of the bottom surface by metal diffusionbonding, TLB bonding, solder bonding, WIT connection, etc. Once thechips have been so joined, a high-temperature underfill material may bedispensed under the chips to prevent air pockets. If the pads andelectrical traces for the bottom surface of layer 350 have not yet beenformed, then the top surface of the IC chips 351 and 352 can be adheredto layer 414. To prevent air pockets, layer 414 may be left in a plasticflowable state at the time chips are placed and the chips may be pressedinto the layer under a vacuum. Instead of this, an underfill materialmay be used. Placing the chips face down onto the substrate has thefollowing advantage when using the above described epitaxial lift-offprocess for GaAs chips: that is the AlAs etch step (or AlGaAs etch step)used to removed the chips from the GaAs wafer may be delayed until thechips are placed faced down on temporary substrate 412. After placementon substrate 412, the AlAs (or AsGaAs) etch step is performed toseparate the bulk GaAs substrate from the epitaxial layer which containsthe circuits of the chip. Thus, one does not need a polymer film, glasssubstrate, or other substrate to support the IC chips during theplacement steps since the GaAs bulk substrate provides this function. Itmay be appreciated that a whole GaAs wafer may be placed face down onsubstrate 412, or that the GaAs substrate may be first diced to separatethe individual chips from one another. In the case that the whole waferis placed, the placement is performed before via posts 333 are formed.Another advantage of attaching the device wafer to substrate 412 is thatthe back surface of the device wafer can have its back surface lapped toreduce the thickness of the chips; this is especially useful for chipswhich are difficult or impossible to be removed by the epitaxiallift-off step.

Referring to FIG. 40, the next step in the process is to form apolymeric layer 416 over the via posts 333, chips 351 and 352, and theexposed portions of adhesion layer 414. Layer 416 will encase thesecomponents in a single polymeric film. A number of polymeric materialsmay be used, including core materials, cladding materials, polyimides,and photo-refractive materials. Although not necessary, photo-refractivematerials should be used if one wishes to form vertical waveguides inthe stacked layers with the SOLNET waveguide formation process. Thepolymeric layer 416 is preferably formed by spin coating the material.After the layer is formed, it is cured if the material requires curing,which is usually the case. If the thickness of chips 351 and 352 isgreater than about 15 μm, two or more separate coating and curing stepsmay be required for some polymeric materials, particularly thosematerials that undergo significant shrinkage during curing.

Referring to FIG. 41, the substrate is then polished to expose theelectrodes (e.g., pads) of chips 351 and 352 and the tops of via posts333, and to provide a more planar surface. Conventional polishing andchemical-mechanical polishing processes may be used, and such polishingtechniques are well known to the art.

Referring to FIG. 42, a set of electrical traces 330 and connection pads332 are formed over the top surface. This may be done by anyconventional conductive layer formation method, many of which have beenpreviously described and illustrated in FIGS. 11-18. For example,blanket sputtering of conductive material followed by a patternedsubtractive etch process may be used.

At this point, the processing may take different directions. If theelectrical traces 330 and connections pads 332 have been previouslyformed by patterning a thick seed layer, as described above, then theformation of IC chip layer 350 is complete and it may be removed fromthe temporary substrate 412. However, before removing the temporarysubstrate 412, the top surface of the layer 350 may be laminated toanother component layer in a Z-connection assembly step since substrate412 can provide layer 350 with very good dimensional integrity. If thebottom traces and pads have not been formed, then the next step in theprocess is to attach a second temporary substrate 418 to the top surfaceof IC chip layer 350 using a dissolvable adhesion layer 419. Once thisis done, the first temporary substrate 412 is removed. The results ofthese steps is shown in FIG. 43. Many dissolvable epoxy and adhesionmaterials are well known to the art, and are compatible with thepreviously-described methods for first temporary substrate 412. Nofurther curing steps are required in the processing after this point,which significantly increases the selection of dissolvable epoxy andadhesion materials. Instead of using a dissolvable adhesion layer, onemay use an ordinary adhesion layer in the substrate release techniquetaught in U.S. Pat. No 5,258,236, or may use a transparent substrate 418and an adhesion layer 419 which loses it adhesion capacity when exposedto ultraviolet light. In the latter case, the substrate is released byexposing the adhesion layer to U.V. light transmitted through thetransparent substrate, and then pealed off or exposed to a solvent.Other substrate release techniques described above may also be used.

Next, an optional polishing or etching step is performed to remove thepolymeric adhesion layer 414, and to optionally reduce the thicknessesof chips 351 and 352. The result of this step is shown in FIG. 44.

Next, the bottom electrical traces 330 and connection pads 332 areformed, which may be done by any of the steps used for making the tracesand pads at the top surface. The results of this step is shown in FIG.45. The completed IC chip layer 350 is then usually attached to anothercomponent layer at its top surface in a Z-connection assembly step whilethe temporary substrate is still in place. This provides gooddimensional integrity for layer 350 in the lamination process for theZ-connection assembly. The second temporary substrate 418 may then bereleased from layer 350 by the appropriate removal step (e.g., such asby dissolving the adhesion layer 419 if it is dissolvable, by performingthe removal steps in U.S. Pat. No. 5,258,236 if that technique has beenused, or by illuminating the adhesion layer 419 to U.V. light).

FIGS. 38-45 describe process steps that maybe used in a variety of waysin combination with other processing steps described in the presentapplication. For example, in addition to fanning traces and pads, thebottom side processing mentioned above may also include steps forconstructing other functional parts, such as 45° mirrors and opticalgratings for beam splitting described above. The process of FIGS. 38-45may also be further modified so that the via posts are fanned after thechips 351, 352 are set down. This has the advantage that the chips351,352 maybe set down more smoothly upon the substrate. Additionally,the process steps of FIGS. 38-45 may be repeated with different devicetypes other than chips 351, 352 (i.e., opto-electric films) and/or thedevice embedded on waveguide layers to fabricate a variety of singlesubstrate or multiple substrate stacked structures.

This method of FIGS. 38-45 may be equally applied to constructingactive-component layer 320 b by replacing the IC chips withopto-electronic components or materials. Waveguide layer 320 a may beconstructed with the same steps shown in FIGS. 38-45 by adding any ofthe process step sequences described in this application to form apatterned waveguide core embedded in an overcladding layer and/ordeleting the device-setting process. For example, via-post formation maybe followed by the steps of clad-layer formation, core patternformation, over-clad layer formation, CMP, and top metallization (ormetallization prior to underclad layer formation). Waveguide layer 320 amay also be formed from a subset of construction steps previouslydescribed and illustrated, such as for example, the fabrication steps ofFIGS. 11-18, with the unused steps being related to the incorporation ofthe active components.

In all of the embodiments described in present application, andparticularly those embodiments which have fine (i.e., very small)patterns and features, the polymer layers may be formed by CVD (chemicalvapor deposition), evaporative polymerization, and/or MLD (molecularlayer deposition) as described in U.S. Pat. No. 5,444,811, which isassigned by the assignee of the present application, and/or thecombination of these and other conventional coating methods. Inaddition, in all of the embodiments described herein, the top and bottomsurfaces of the component layers may have anti-reflective layers formedon them to reduce reflection noise.

Having described several exemplary methods of forming IC chip layers350, we provide methods of forming polymer waveguide layers 320 a inaddition to those described above. Referring now to FIGS 46-58, there isseen in FIG. 46, a cladding layer 21 is formed over a temporarysubstrate 450 and cured in any of the above described ways. Thetemporary substrate 450 may comprise aluminum, quartz, glass, or any ofthe above temporary substrate configurations. Before forming claddinglayer 21, an adhesion layer and a seed layer may be formed over thesurface of substrate 450, with the seed layer being used to electroplateform via posts for conductive vias through layer 320 a. Referring toFIG. 47, a core layer 24 is then formed over cladding layer 21 andcured, which maybe done in any of the previously described ways. Iflayer 320 a is to have beam splitters or wavelength filters, then corelayer 24 may be etched or photo-exposed at this point to form thegratings of these components, and the gratings may then be filled withmaterial having a different index of refraction.

Referring to FIG. 48, laser cuts are used to define the sides of theoptical waveguides 454. FIGS. 48 and 49 are end views of three paralleloptical waveguides. The cladding layer 21 may be around 10 μm thick, thecore layer 24 may be around 10 μm thick, the waveguides may be between10 μm to 50 μm wide, and the waveguides may be spaced apart from oneanother by a pitch of around 250 μm. The laser cuts need only be as deepas the core layer 24, but in practice sometimes are as deep as thecombined thickness of the cladding and core layers 21 and 24. The widthof the laser cuts may be around 20 μm to 75 μm. A cleaning operation ispreferably performed to remove debris from the laser culling step. Thiscleaning may be performed by a plasma etching step, which tends to etchdebris at a faster rate than cladding and core layers 21 and 24. Toreduce the amount of debris that needs to be removed, one may form alayer of photoresist, or other uncured polymeric material, over the corelayer 24 before the laser cutting operation is performed. Dining thecutting operation, a major portion of the debris will be left on top ofthe photoresist layer, and may then be easily removed by removing thephotoresist layer by exposure to a solvent or developer solution. Abrief plasma etch may then be done to ensure that the laser etchedtrenches are clean.

Referring to FIG. 49, a top cladding layer 23 is formed over thepatterned core layer 24 and then cured by any of the previouslydescribed ways of forming cladding layers. At this point, via posts maybe formed by laser drilling apertures to the seed layer, cleaning, andthen plating. Also, the electric traces and pads at the top surface ofcladding layer 23 may be made.

Referring to FIG. 50, which shows a side view of the parallelwaveguides, laser cuts, such as those formed by laser ablation, are madeat the ends of the waveguides to form the bevel edges for the mirrorelements of the vertical couplers. The angle of these cuts may beinward, as is shown in view A at 455, or they may be outward, as isshown in view B at 456. A waveguide may also have an inward cut at oneend, and an outward cut at the other end. If necessary, patches of metalmay be formed at each laser cut site in order to provide more accuratelaser cuts, as previously described above (see FIG. 27, layer 161).After this step, the beveled edges may be cleaned by a brief plasma etchstep, and a layer 458 of reflective metal or reflective material isdeposited over the beveled edges left by the outward laser cuts 456. Ifelectrical traces and pads have been previously formed on the topsurface of cladding layer 23, and if one forms the mirrors with ablanket deposition of reflective metal, then it is preferable that onefirst forms a photoresist lift-off layer over these traces and padsbefore the laser cut operation and the blanket deposition steps areperformed.

To form the mirror elements on the bevels of the inward cuts, a secondtemporary substrate 452 is attached to the top of layer 320 a by any ofthe previously described methods, and the first temporary substrate 450is removed, as shown in FIG. 51. In the embodiment shown in FIG. 51-1,an adhesive layer 453 is shown between second temporary substrate 452and layer 320 a. The bevels are cleaned with a brief plasma etch, andthen coated with a layer 457 of reflective metal or a reflectivematerial. Electrical traces and pads may then be formed on the bottomsurface of layer 320 a. Layer 320 a is thus completed, and may them beassembled to an IC chip layer 350 or an active component layer 320 b,after which the second temporary substrate 452 may be removed. Asanother approach to forming the mirror elements on the bevels of theinward cuts, one may deposit reflective metal on the inner surface bydirect electroplating, electroless plating, direct plating, orhigh-pressure CVD (10 milli-torr to 100 milli-torr) before the secondtemporary substrate is attached. In the case of direct electroplating,the seed layer must be present. In the case of electroless plating, oneexposes the surfaces of the polymeric material to appropriate activationand catalytic treatments.

In a modification of the process shown by FIGS. 46-51, the waveguidesare defined by plasma etching of core layer 24 rather than by lasercutting. After the core layer has been formed and cured (FIG. 47), anadhesion layer, such as one comprising chromium, is formed over layer24. A thick photoresist layer is formed over the adhesion layer and thenpatterned to define the locations where the waveguides 454 are to beformed. The exposed portions of the chromium adhesion layer are etchedaway by a quick chemical etchant for chromium, and the resultingstructure is plasma etched to remove the exposed portions of layer 24,as shown in FIG. 52. A little over etching into bottom cladding layer 21is preferably performed to ensure that no waveguide will have anyleakage of light After the plasma etch, the remaining photoresist andadhesion layers are removed, and cladding layer 23 is formed and cured(FIG. 53). The remaining processing steps illustrated by FIGS. 50 and 51are then performed.

As previously discussed, in an alternate process, the core may comprisea photo-sensitive material, which is hardened by light exposure. Forthis case, the core patterning may be done by a patterned exposureprocess instead of by an RIE process. In this case, in addition to lasercutting or an RIE technique, a tilted lithographic exposure technique,such as that disclosed in Japanese Patent Application JP 96262265, canbe used for making beveled edges. Direct exposure through a photomask ispreferable for process simplicity. However, if the surface is stableenough after soft curing, a metal mask may be formed on the surface toact as a photomask. If further planarization is desired, CMP can beapplied after over cladding layer is formed.

Generally, it is simpler to fabricate the outward cut mirror of FIG.50-2 rather than the inward cut mirror of FIGS. 50-1, although it isdesirable to be able to economically fabricate both types of mirrorstructures, Referring again to FIGS. 50-1 and 50-2, inward cut andoutward cut mirrors both define trapezoidal shapes that are the mirrorimages of each other. If the top surface of the trapezoidal surface ofFIGS. 50-2 is attached to an OE substrate, it will perform as an inwardcut mirror on the GE substrate to which it is attached. Consequently, amirror fabricated as an outward cut minor, as shown in FIGS. 50-2, maybe attached to another GE surface to that it functions as the inward cutmirror of FIG. 51-2. This method facilitates a high-yield process forfabricating a multiple-layer OE substrate having inward cut mirrors.

FIGS. 54-58 illustrate an exemplary method of adding an active componentlayer to the waveguide layer. The waveguide layer and via posts of FIGS.54-58 maybe formed by the previous methods, such as the methodsillustrated with FIGS. 38-45 and FIGS. 46-53. Starting with thewaveguide layer 320 a shown in FIG. 51, the voids created by cuts 455and 456 are filled with material (usually polymeric material), and thesurface is planarized. Electrical traces and interconnection pads areformed over the exposed surface of cladding layer 21, and via posts areformed by electroplating by via formation steps previously described.The result of these steps is shown in FIG. 54. Next, referring to FIG.55, a VCSEL emitting device 36 is placed face down on the substrate, andhas its electrodes joined by metal-diffusion bonding to correspondingpads 332 and/or traces 330 that are formed over cladding layer 21. Ahigh temperature underfill is then preferably dispensed under theemitting device 36. Other devices, such as photo-detecting devices) aresimilarly attached and processed, but are not shown in the figures forvisual simplicity. Each of the devices so placed in FIG. 55 has theactive area overlying a mirror structure 458 at an end of a waveguide,or at a branch of a vertical beam splitter.

Referring to FIG. 56, a polymeric layer 25 is then formed over thesurface to encase device 36 and vias 333 in film of polymer material.Any type of material may be used, including cladding material, corematerial, polyimides, and photo-refractive material (which would beuseful for making vertical waveguides by the SOLNET process). Layer 25is cured, if needed, and then polished to expose the tops of vias 333,to make layer 25 more planar, and to optionally expose the surfaces ofthe devices embedded in layer 23, if necessary (such as to makeadditional electrical contacts to the components). The result of thesesteps is shown in FIG. 57. Next, as shown in FIG. 58, electrical tracesand pads are formed on the top surface of polished layer 25. The tracesmay be formed by any of the previously described pad/trace formationsteps. An active substrate 320 is thereby formed, which may be assembledto an IC chip layer 350 (or any other active layer, including awaveguide layer, or chip) using temporary substrate 452 for dimensionalcontrol. The assembly may be done by any of the previously describedmethods. After assembly, temporary substrate 452 maybe removed by any ofthe previously described substrate-release methods.

Alternately, it may also be possible to stack waveguide layers on theactive device layer in a similar manner to that shown in FIGS. 54-58.For this case, the VCSEL should be placed in a face-up position.Additionally, various combinations of layers, such as waveguide layers,active devices layers, and chip layers can be built-up using anycombination of steps shown in FIGS. 38-58.

As indicated above, when one uses switch devices or laterallight-emitting devices which are pie-built on chips which have highindices of refraction compared with the index of the waveguide material,in seine cases it is advisable to narrow the width of the device withrespect to the width of the waveguide in order to provide good opticalcoupling between the waveguide and the chip device. A high couplingcoefficient between a waveguide and chip device is desirable because itincreases the efficiency of a variety of electro-optic processes. Forexample, a high coupling coefficient permits lower voltage switches andmodulators to be used, because the optical mode interacts strongly withthe switch/modulator. Narrow device widths of the active devices enablehigher speed operation by decreasing device capacitance. By the samereasoning, it is also advisable to reduce the height of the chipcomponent with respect to height of the waveguide, and to center thechip in the middle of the waveguide. Decreasing the thickness of theactive devices enables lower power (voltage) operation by increasing theelectric fields in the devices. Steps for performing the centering ofchips with reduced height axe described below, and these steps may beincorporated into the construction methods previously described. FIGS.67 and 68 show the desired result, where FIG. 67 is a top plan view andFIG. 68 is a cross-sectional view. Four switch devices 26 a-26 d in chipform, and having a high index of refraction, are coupled in line withfour respective waveguides 24 a-24 d having greater widths andthicknesses. To reduce reflections at the interface between thewaveguides 24 a-24 d and the devices 26 a-26 d, the ends of the devices26 a-26 d are tapered. The amount of tapering, and the amount of widthreduction between each device 26 and its waveguide 24, for optimalcoupling is dependent upon the difference in indices of refraction. Thevalues needed for optimal coupling are best computed through opticalsimulations. FIG. 68 is a cross-sectional view showing how the chip ofswitch device 26 b has a lower height than the height of waveguide 24 b,and how the chip is centered in the middle of the waveguide. Thecentering is achieved by a pedestal of cladding material 21 b, which inturn is formed on a bottom cladding layer 21 a.

Referring back to FIG. 59, we now describe exemplary steps forconstructing the structure shown in FIGS. 67-68. Starting with a basesubstrate 12, a first cladding layer 21 a is formed over the surface ofbase substrate 12, and cured. Cladding layer 21 a may comprise any ofthe cladding materials previously described. Next, a second cladding 21b is formed over cladding layer 21 a. This cladding layer can be any ofthe previously described cladding materials, including photosensitivecladding materials. Before cladding layer 21 b is cured, a device chip26 is adhered to it, such as was done in the previous constructionmethods. Layer 21 b is then soft-baked to remove the solvent used tofluidize the polymeric cladding material. The results of these steps areshown in FIG. 60, which shows a cross-sectional view, and in FIG. 61,which shows a top plan view. If cladding layer 21 b is not aphotosensitive material, it is preferably cured at this point. (Duringthese steps, appropriate electrode structures may be formed in thelayers, as describe above; these steps are omitted here for the sake ofbrevity, but it will be apparent to one of ordinary skill in the art howthese steps are incorporated given the previously-described constructionmethods).

At this stage of the process, chip 26 is a large piece of material whichis now patterned to define the individual devices 26 a-26 d. This may bedone by forming a photoresist layer over the top of cladding layer 21 band chip 26, pattern exposing and developing the photoresist layer 14 toleave patches of the photoresist over chip 26 where the individualdevices 26 a-26 d are to be formed. The exposed portions of chip 26 arethen etched away by a suitable etchant to define the individual devices.The results of these steps are shown in a cross-sectional view of FIG.62 and in a top plan view of FIG. 63. This patterning and etching stepalso provides the tapers of the chip devices. If chip 26 is amulitilayer structure, several etch exposure steps, using differentetchants, may be needed.

If cladding layer 21 b comprises a photosensitive material, then thepattern exposure of the photoresist layer could also pattern all of theportions of cladding layer 21 b which are not under the whole chip 26,if a sufficiently long exposure is used. In this case, portions ofcladding layer 21 b would be removed in the development step of thephotoresist layer. However, this is of no detrimental consequence. Ifone wishes, one can adjust the energy of the exposure step such that thephotoresist layer is fully exposed but the cladding layer 21 b is notfully exposed. One may also use portable conformal masking structures toavoid exposure of cladding layer 21 b at this point.

As the next step, all portions of cladding layer 21 b which are notunderneath the patterned devices 26 a-26 d are removed. If layer 21 b isphotosensitive, this may be accomplished by performing a blanketexposure to actinic radiation) using the individual chips 26 a-26 d toblock the radiation from hitting the locations where cladding layer 21 bis to be retained. The cladding layer 21 b may then be developed andthen cured. This provides a self-aligned patterning of layer 21 b, andthe results of these steps are shown in the cross-sectional view of FIG.64. Any photoresist material left on top of the individual chips 26 a−26 d in the previous patterning step will be exposed in this blanketexposure, and thus can be removed by a developer solution, sometimes bythe developer used in the development step for cladding layer 21 b. Ifthe photoresist layer and the cladding layer 21 have incompatiblechemistry, or if the solvent of the photoresist would dissolve claddinglayer 21, then a barrier layer may be formed between these two layers.The layer is preferably opaque, and is removed after the photoresistlayer has been used to pattern the devices 26 a-26 d. Cladding layer 21b may then be defined by a blanket exposure, as before. A chromium ortungsten layer may be used as the barrier layer.

If cladding layer 21 b does not comprise a photosensitive material, theunwanted portions of cladding layer 21 b may be removed by plasmaetching, using the individual chip as an etch mask, along with thephotoresist patch above it, if so desired. In this case, any excessphotoresist may be stripped away after the etch step. While the etchtime can be controlled to only etch layer 21 b, one can form aplasma-etch stop layer over layer 21 a before layer 21 b is formed, andcan remove the plasma-etch stop layer after layer 21 b has been definedby the plasma etch step. A chromium layer may be used for this purpose.

The next step in the process is to form a core layer 24 over theresulting structure, as is shown in FIG. 65. The core material is thenpatterned to define the waveguides, as is shown in the top plan view ofFIG. 67 and the cross-sectional view of FIG. 66. Any of the previouslydescribed patterning methods, including the use of a photosensitive orphoto-refractive material and photo-exposure, may be used. The ends ofthe waveguides preferably abut the taper sides of devices 26 a-26 d, orpenetrate part way into the taper sides, As the next step, a layer ofcladding material 23 is formed over the structure and cured, as shown inFIG. 68. Additional processing steps to form traces, pads, mirrorelements, beam-splitter elements, and other features previouslydescribed may be undertaken at this point.

When metal electrodes are formed on or in the second cladding layer 21b, mini chips can be placed on these metal electrodes and coupledthereto by the previously described metal diffusion, metal bondingtechniques, TLB, and solder bonding. Additionally, if metal electrodesare formed on the top surface of a mini chip, one or more of the chip'selectrodes may be bonded to metal pads formed on the top surface ofcladding layer 23. This provides both electrical connection and physicalattachment. Additionally, if a signal to the mini chip comes from atrace on the opposite surface, the via between surfaces may be locatedunder the connection pad to provide for a more compact connectionarrangement. This provides for efficient use of surface area for makingthe electrical connections to the mini chips.

In the core layer coaling step shown in FIG. 65, an optional claddinglayer can be coated on the core layer. After the core layer is cured,the optional cladding layer is coated followed by soft and fall curing.If the core layer thickness is a little bit thinner than OE deviceheight, the polished surface can be in the cladding layer. Thistwo-layer approach may improve the interface flatness between core andclad layer, thereby reducing optical scattering losses. Alternately,optical scattering losses may be reduced if the CM process is appliedafter the over cladding layer formation.

In some process variations, one or more CMP steps may be eliminated toreduce the optical scattering losses associated with the optical modescattering from the CMP planarization surface. When a photo-sensitivewaveguide material is used, such as one that is hardened by lightexposure, CMP planarization proximate to the core layer is notnecessary. After the step shown in FIG. 65, waveguide patterning can becarried out by patterned light exposure. A planarization step may beapplied after the overcladding layer is formed, if necessary.

As another variation on the core patterning process, the minichips mayinclude core and cladding structures prior to attachment of the minichipto the cladding layer 21 b in FIG. 60. For this case 26, 26 a, 26 b, 26c, and 26 d are replaced by elements 26′, 26 a′, 26 b′, 26 c′26 d′asshown in FIGS. 67-2 and 68-2. This has several advantages. Therefractive index profile can be controlled towards the edges of themini-chip. In particular, the refractive index of the chip core and chipcladding can be very close to each other (small refractive index step)which facilitates increasing the beam spot size at both edges of theminichip for efficient optical coupling to waveguides.

The embodiments shown in FIGS. 11-20, 59-68, 74-81, and 82-89 areexemplary. One of ordinary skill in the art may combine aspects of oneor more of these and other embodiments herein together according to therequirements of a particular application.

The method shown in FIGS. 59-68 may be utilized with a variety ofnon-epitaxial films as well. For example a large refractive index films,such as a TiO2, W03, SiNx, or Si film can be embedded in The same ways.These films can be obtained as lifted-off film using a substrate thatcan be selectively removed, such as a Si, metals, or polymer substrate.A high refractive index waveguide may be used as an optical delay line.If a rare-metal-doped glass film is embedded, then it may be used as anoptical amplifier. Other optical films, such as luminescent films,photo-refractive films, and nonlinear optical films may similarly beincorporated as optical waveguides using the method shown in FIGS.59-68. When the refractive index of the embedded film is larger than thecore material, the core materials can be used for layer 21 b. In thiscase, the etching of the core layer on the embedded film (FIG. 66) isnot necessary and the overclad layer can be coated after the step shownin FIG. 65.

The previously described fabrication processes may also be used tofabricate films with active CE devices but no waveguide layer. FIGS.147-153 show an exemplaiy process to fabricate an OB film with embeddeddevices. Electrical pads, electrical lines, and electrodes are formed ona substrate (FIG. 147). Thin film devices are then placed on the metalpads/lines on the substrate (FIG. 148). The thin film devices may be anythin film device such as those fabricated with an ELO process. A polymerfilm is then used to coat the substrate, embedding the thin film devicesin the polymer (FIG. 149). The polymer is then planarized to the levelof the thin film devices by polishing (FIG. 150). Surface contact padsand vias are then formed on the planarized polymer (FIG. 152). Thesubstrate of the OE film may then be removed, either before (FIG. 152)or after (FIG. 153) the OB device film is attached to another layer,such as a waveguide layer. Alternately, via posts may by fabricatedafter the thin film device placement step, followed by the embedding,planarization, and contact pad formation steps. Still yet another optionis to insert a buffer polymer layer between the substrate and pads,electrical lines, and electrodes, regardless of how the vias are formed.

Additional multichip module interconnection configurations are nowdescribed by referencing FIGS. 69-72. These modules may be constructedby the above described construction methods. A free-space opticalinterconnection system is shown in FIG. 69 where optical signals areconveyed through free space between two laminated boards 501 and 502.Each laminated board 501-502 has a plurality of optical switches 506which transmit light to opposing photo-detectors 508 through a sectionof air, or free space. Each optical switch is feed with optical power bya waveguide 503, which may have grating beam-splitters 504 to convey thepower vertically to one surface of the switch 506. The light entersperpendicular to the surface of the optical device (e.g., a mini-chip ofEA or EO material), and exits perpendicular to the opposite surface ofthe optical device. Before the light exits each board 501 and 502, ispasses through a micro-lens 511 formed in a material layer 510. Thelight also passes through another such micro-lens before it enters aphoto-detector device 508. The micro-lens is a section of material whichhas a higher index of refracting than the bulk material of layer 510,and it serves to focus the light as it is emitted and as it iscollected. While the micro-lens may be used by itself, other opticalelements may also be inserted between boards 501, 502 to adjust theoptical focus of the micro-lens, if required.

The mirco-lens is preferably made by the SOLNET process by using a sheetof photo-refractive material (e.g., polyguide from DuPont), and exposingit by writing beams to form the micro-lenses. The cross section of eachmicro-lens, as looking from the top surface of layer 510, is circular orsquare. The surfaces of layers 510 may be coated with anti-reflectivematerials to improve optical coupling. In addition, optical materialshaving an index of refraction close to that of the micro-lenses may bedisposed between boards 501 and 502 to improve optical coupling.

The layers of boards 501 and 502 have been separately constructed landthen laminated together, according to the processes above. Between eachlayer, a bonding sheet or underfill maybe used to improve opticalcoupling between the devices and the micro-lenses, and between the powerwaveguide 503 and the optical switches 506. These layers, of course, maybe integrally formed, which is shown in FIG. 70 by boards 501′ and 502′.

The primary difference between the embodiment of FIGS. 69-70 and that ofFIGS. 35-37 is the use of vertical optical switches (or lightmodulators) instead of VCSELs for the transmitters. However, micro-lensarray may be used in conjunction with any of the techniques to couplelight to the optical switches 506 mentioned in this application. Forexample, instead of using a grating for coupling optical power supply toa switches 506, forty-five degree mirrors could be used. Alternately,branched waveguides in the manner of FIG. 37 could be used to coupledlight to optical switches 506. The vertical optical switches 506 mayalso include a variety of switch structures, such as EA modulators.

This concept may be extended to form vertical optical connections instacks of active layers 320 and IC chip layers 350, as is schematicallyillustrated in FIG. 71. In FIG. 71, active components, such as VCSELs,photodetectors, and modulators are omitted for the sake of clarity, butmay be included in a substrate with vertical couplers. As shown in FIG.71, the layers are made from a photo-refractive material The SOLNETprocess may be used to fabricate the vertical micro-lenses which, whenstacked upon one another, form a vertical waveguide, or so calledoptical Z-connection. Bonding sheets made of photorefractive materialmay be used to laminate the active layers 320 b, waveguide layers 320 aand IC chip layers 350 together. For the fabrication of the opticalz-connection in each layer, other methods can be applied in addition toSOLNET.

The vertical optical connections may be organized in separate units 710which are coupled to two sides of a set of active substrates 705 as isshown in FIG. 72. The active substrate 705 may take the form shown inFIG. 35. Units 710 have a plurality of vertical waveguides formedthrough their Z direction, which optically connect to waveguides at theedges of substrates 705. Units 710 may be constructed using the sequenceof fabrication steps shown in FIG. 73. Staring with a plurality ofsheets of refractive material (eg., polyguide), short sections ofbonding sheets are attached to the left edges of the sheets. The sheetsare then bonded together, and then the SOLNET process is applied to theright edges of the photo-refractive sheets (use of writing beams) toform the vertical waveguides. The sheets are then cured, and are thenassembled to the substrates 705.

FIGS. 109-111 show alternate OE-3D stack configurations. Chips may beembedded in a variety of different OE-film substrate structurescomprising active and passive device films to form opticalinterconnections.

FIG. 112 shows how in the present invention a plurality of OE films maybe stacked using an optical Z-connection to construct multiple-layer OEsubstrates. As shown in FIGS. 113-116, a stack may comprise a variety ofdifferent film types. As shown in FIG. 113, the OE film may comprise apassive polymer waveguide, with additional electrical lines, pads, vias,electrical voltage planes, and ground planes. As shown in FIG. 114, thepolymer film may comprise OE devices embedded in the polymer film withadditional metalization. The active OE devices may include any of thepreviously mentioned devices, such as VCSEL, light modulators, opticalswitches, optical amplifiers, wavelength filter, tunable filter,wavelength converter, photodetectors, driver chips, amplifier chips,transceiver chips, system LSI's, LSI chips, optical components, andresistors, capacitors, and other electrical components. Mini-chips, inwhich a plurality of components are integrated, can also be embedded. Inthe embodiment shown in FIG. 115, both passive waveguides and active OEdevices may be integrated into one film, along with additional via andcontact metallization. FIG 115 shows a first embodiment having bothwaveguides, VCSELs, and photodetectors whereas FIG. 116 shows lightmodulators and photodetectors coupled to waveguides. More complexmulti-layer waveguides may also be included in the embodiments of FIGS.113, 115, and 116.

The ability to stack different OE film types using electrical andoptical Z connections permits a variety of package structures. FIGS117-120 show side views of film optical link modules (FOLM). The FOLMstructure permits optical signals to be conveniently extracted from achip, CSP, or MCM to be linked to other boards and/or other systemelements, giving the system engineer the flexibility to optically linkmodules of chips in a wide variety of ways. As indicated in FIG. 117, anOE film (OE-film-DW) with waveguides, VCSELs and photodetectors may beused for E/O and O/E conversion. VCSEL with an integrated driver, and aphotodetector with an integrated amplifier may also be used. A fiberarray, image guide, or waveguide array is connected with a connector tothe waveguides at the edge of the OE film, thus forming an optical linkto other elements. The VCSELs, in response to outputs of a chip, emitoptical signals which are transmitted through the optical link (fiberarray, waveguide array, or image array) to a board or unit which isconnected to the OE-film. The fiber array, image guide, or waveguidearray is preferably connected to other boards or units to enable opticalinterconnections between boards and/or units. Conversely, opticalsignals coupled to the waveguides via the optical link from outside ofthe OE-film are received by the photodetectors in the OE-film. Theoptical signals are converted into electrical signals, which are inputto the chip.

As shown in FIG. 118, the same function may also be achieved by stackinga passive waveguide substrate (OE-film-W) with another substrate havingonly active OE devices (OE-film-D), in the manlier of an interposer. TheVCSEL performs an E/O conversion function in response to the chip outputwhereas a photodetector performs an O/E conversion function in responseto a received optical signal. FIG. 119 shows a FOLM embodiment in whichan OE substrate with waveguides, VSCELR and photodetectors (OE-film-DW)under a MCM upon which chips are mounted. FIG. 120, shows a FOLMembodiment similar to FIG. 119 except with a passive waveguide film(OE-film-W) and active OE device film (OE-film-D).

The structure of FIG. 119, the OE film is stacked on the substratewithout its left edge extending beyond the edge of the substrate. Thehorizontal optical connector used in FIGS. 117-118 is replaced by avertical two-dimensional optical connector to the OE film. This verticalconnector couples the waveguides in the OE film to the end of atwo-dimensional (2D) fiber array (or fiber image guide). In location ofthe vertical connector, vertical couples (e.g., mirrors) are formed inthe OE film to turn the optical signals in the OE film towards the 2Dfiber array. In turn, the ends of several waveguide cores in the 2Dfiber array terminate at the connecting face of the vertical connector,with each waveguide end being positioned over a corresponding verticalconnector in the OE film. This type of surface normal coupling iseffective for massive parallel interconnections, and is preferred forsuch types of applications. This surface normal coupling may be usedwith any of the embodiments of the present application where an OE filmis optically coupled to 2D fiber arrays (or fiber image guides).

As we previously stated, the stacked structures shown in FIGS. 33-37 and110-111 may be used in constructing FOLM structures. For example, inFIGS. 117 and 119, the driver/amplifier chip layer can be stacked on anOE-Film-DW to act as a interface between OE devices (e.g., VCSEL,photodiode, modulators, etc.) and the input/output terminals of chips orMCM modules. For FIGS. 118 and 120, the driver/amplifier chip layer canbe stacked on an OE-Film-D. In both cases, OE-film and driver/amplifierchip layer can be stacked by a Z-connection (lamination) process or by abuild-up process. Of course, the driver/amplifier chip layer may includeany auxiliary circuits, such for example driver circuits, amplifiercircuits, bias circuits, temperature stabilizing circuits, skewcompensation circuits, timing circuits, and other appropriate circuits.It is also possible that the chips and OE devices may co-exist in thesame layer (OE-film).

In comparison, the distances between electrical input/output terminals,and between E/O and O/E conversion parts are smaller than thosedistances in conventional optical link modules. This improvesinterconnection performance. Furthermore, in conventional optical linkmodules, extra space is needed. Small or no extra space is needed in theFOLM structures of the present application.

FIG. 121 is a top view of a FOLM structure in which a portion of the OEfilm preferably has sufficient room so that the waveguides may be curvedin order to adjust, if required, the optical path lengths to mitigatesignal skew. More generally, it is desirable to adjust the waveguideroutes, or path lengths, so that signals have the same transit time fromthe output to the input of various chips/regions, boards, units, ormodules. Other techniques to adjust transit time, such as varying otherwaveguide parameters (e.g., refractive index) may also be utilized soprevent skew.

As shown in FIGS. 122 (top view) and 123 (side view), the connectorpreferably includes a connector buffer to perform optical adjustmentfunctions which facilitate communicating signals to a connector. Forexample, a connector buffer may adjust spot size, and change thewaveguide pitch (i.e., waveguide separation). For example, the connectorbuffer may have curved waveguide paths so that one or more planar,one-dimensional arrays of polymer waveguides are coupled to atwo-dimensional array of waveguides. As indicated in FIG. 121, anextended portion of a flexible substrate region may be patterned intoribbons, each containing a plurality of waveguides. A plurality ofribbons may each be twisted so that the end of the ribbons forms atwo-dimensional waveguide array. For a ribbon length of fivecentimeters, an individual ribbon may be twisted by ninety degrees withrelatively low stress. A polymer film thickness in the range of about10-to-250 microns is preferred. Each ribbon may, for example, contain 12waveguides with a pitch in the range of about 30-to-250 microns. Theedges of a plurality of ribbon may then be stacked into aframe-connector and polished to form a 2-D waveguide connector. Theouter surface of the connector buffer is also preferably shaped (e.g.,polished, sliced, or otherwise shaped to form a coupling surface with aplanar surface) to facilitate coupling to external optical connectors.This permits the waveguides of the FOLM to be coupled to a variety ofoptical couplers, such as two-dimensional fiber arrays and image guides.FIG. 124 shows how optical signals in the connector buffer may be routedto a two dimensional waveguide array connector comprising a plurality ofwaveguide cores arranged in an array. The connector buffer preferablyperforms an optical adjustment function so that a plurality ofwaveguides of an OE film are optically coupled to a commerciallyavailable optical connector, such as a two dimensional opticalconnector. The MT connector, available from Furukawa Electric, Co.,Ltd., Tokyo, Japan, is an example of a preferred multi-fiber connector.The connector buffer can also include wavelength-division multiplexing(WDM) functions, such as wavelength multiplexers (MUXs) and wavelengthdemultiplexers (DEMUXs), etc. to add WDM capability to the FOLMstructures according to the present invention. In the case of surfacenormal 2D connectors shown in FIG. 119, the same functions andcomponents described above may be used.

FIG. 125 shows a high speed FOLM embodiment. High speed opticalmodulators are driven by the outputs of a chip to generate opticalsignals from externally input light. The light modulator can operatewith low current and low power dissipation compared with VCSELs. Ahigh-speed and low heat-generation opto-electronic amplifier/driverlesssubstrate (OE-ADLES) is preferably used at high optical signal levels.In OE-ADLES, the light modulator may be directly driven by chip outputsbecause it has voltage-drive characteristics that are compatible withthe outputs of a chip. Consequently, an additional driver is notnecessary to drive a modulator from a chip. Additionally, by increasingthe input optical power, the optical signal at the photodetector issufficiently strong so that a photodetector amplifier may be eliminated.An OE-ADLES apparatus and method is described in the paper of Yoshimura,et al., “Optoelectronic Amplifier/Driver-Less Substrate, OE-ADLES. ForPolymer-Waveguide-Based Board Level Interconnection-Calculation Of DelayAnd Power Dissipation,” submitted at the 8^(th) Iketani Conference,4^(th) International Conference On Organic Nonlinear Optics (ICONO'4),Oct. 12-15, 1998, Chitose, Japan, the teachings of which are herebyincorporated by reference. OE-ADLES is preferred because it permits theelimination of drivers and amplifiers that increase the cost andcomplexity of the OE substrate as well as decreasing signal delays dueto drivers and amplifiers.

A FOLM may comprise a variety of OE film substrate stacked structures.FIGS. 126-129 show details of preferred embodiments of a FOLM structure.FIG. 126 shows a side view of a FOLM structure. FIG. 127 shows a topview of the entire FOLM structure with spot size converters to couplethe FOLM waveguides to commercially available MT connectors. As can beseen in FIG. 127, each of 16 MT connector outputs 12 waveguides of theFOLM, so that there are 196 channels for the communication of opticalsignals in the FOLM. Since the core of a commercially available MTconnector has a core that is 62.5 microns ×62.5 microns, a 5 centimeterlength of the FOLM serves as a connector buffer to gradually increasethe spot size of the OE waveguides (core dimensions of fifteen micronsby fifteen microns) and translate the waveguides to efficiently coupleto the MT connector.

FIGS. 128 and 129 show a detailed view of a portion of FOLM structureillustrating how the preferred fabrication method results in VCSELs thatare electrically and optically coupled to waveguides by metallizedforty-five degree mirrors. As can be seen in FIGS. 128 and 129, aportion of the Au contact layer of the VCSEL is electrically connectedto the mirror metalization, facilitating a convenient electricalconnection to the VCSEL. The optical emitting window of the VCSEL, whichhas an area on the order of about ten microns by ten microns, isorientated so that it impinges upon the metallized mirror and isreflected into the waveguide.

An exemplary fabrication process for a FOLM structure includes the stepsof forming a first polyimide film, preferably on an Aluminum substrate,glass, quartz, or other suitable substrate which can later bepreferentially removed. After the first polymer layer is formed, contactpads and electrodes are deposited on the surface of the polymer layer.The pads are patterned for mounting VCSELSs. ELO VCSELs andphotodetectors are placed onto the contact pad. Preferably a Au/Sn/Aumetal diffusion is used to bond the VCSEL to the contact pad. A secondpolyimide layer or other suitable polymer layer is then coated over theVCSELs. The surface is then planarized with CMP. A waveguide cladfluorinated polyimide layer is then formed over the planarized wafer. Acore layer is then deposited, patterned, and embedded in an over-cladcoating in the manner described in regards to previous embodiments.Forty-five degree mirrors are formed in any of the previously describedfabrication processes, such as by RIE and laser ablation. The mirrorsurfaces are then metalized. The same metalization is preferably used tocontact the electrodes of the VCSELs and/or pads and/or vias for theVCSELs. A polyimide layer is coated over the substrate and planarized byCMP, if necessary. The Al substrate is then removed and the firstpolyimide layer is removed or etched to make electrical contacts and/orpads and vias to the OE film. Alternately, removal of the Al substratecan be performed after the OE film is attached to another substrate.

As shown in FIGS. 130-137, a plurality of chips/CSP/MCM can be mountedand electrically and optically coupled using an opto-electronicinterposer (OE-IP) or OE-film MCM fabricated from the previouslydescribed fabrication processes. An OE-IP is inserted between a chip,CSP or MCM and a single or multiple OE layers, and preferably providesan optical connection to at least one other element. Multiple OE layerscan also be built up by the same method described earlier. The OE layerscan be stacked by solder bonding, TLB, WIT, metal diffusion, and themethod disclosed in U.S. Pat. No. 5,334,804, conducting paste or otherbuilding-up processes. One preferred paste lamination is the MAJIC pastelamination process, which is disclosed in MAJIC paste lamination, whichis disclosed in U.S. patent application Ser. No. 09/192,003, and whichis assigned to the Assignee of the present invention, the teachings ofwhich are hereby incorporated by reference.

The OE-IP of the present invention may comprise a variety of lightsources and/or photodetectors or other components and/or integratedcomponents disposed in the OE-IP in a variety of ways. In the embodimentof an OE-IP of FIG. 130, VCSEL and photodetectors are embedded in thepolymer film of the OE-IP. FIG. 133 shows an OE-IP using lightmodulators coupled to a light source instead of VCSELs as the opticaltransmitters. The light source may be supplied fl-am light sources onthe OE layer or OE-IP. The light source may also be supplied from anexternal source via an optical fiber, optical fiber array, imagingguide, or flex waveguide array, as shown in FIG. 134. Suitable lightmodulators include electro-optic devices such as Mach-Zebndermodulators, internal total reflection switches, digital switches,directional coupler switches, or electro-absorption (EA) modulators.

FIG. 138 shows a case that OE-IP optical interconnections are on theopposite side of the chip/CSP/MCM-mounted surface compared to FIGS. 130and 131. The VCSELs and photodiodes are embedded into the OE layer nearthe bottom surface. FIG. 135 shows an example of an OE-IP with opticalinterconnections to chips/MCMs mounted to both sides of the OE-IP. TheOE-IPs can be merged in OE layer. This means VCSELs and photodiodes areembedded into the OE layer near the bottom and top surfaces.

The OE-IP of the present invention may also be used in a variety of wayswith other OE layers. FIG. 139 and FIG. 130 are examples of OE-IP. FIG.131 and FIG. 140 illustrate OE-film-MCM. FIGS. 136-137 show an OE-IPwith external or flexible interconnections. The flexible interconnectionenables the OE-film-MCM to be used as a parallel optical link module. Asshown in FIGS. 136-137, the flexible optical connector can be attachedat least to the edge of the OE-film-MCM. The flexible interconnection isuseful for a variety of purposes, such as coupling a source of lightpower for optical signals and to provide a means of coupling to anotherOE-IP or OE layer. However, a flexible interconnection is also usefulfor forming a film optical link module (FOLM) or optical jumper.

The present invention may also be used to fabricate so-called “smartpixels”. This is shown in FIGS. 141-142. Conventional smart pixelsintegrate an array of VCSELs and photodetectors onto a chip in order tofacilitate OE communication of a chip to other elements. However,conventional smart pixels are expensive to manufacture and have a lowyield. As shown in FIG. 141, a polymer film (OE-film-D) with an array ofVCSELs and photodetectors embedded in it may be used to achieve the samefunction as a smart pixel. Additional electrical pad connections to thechip may be made with vias. As shown in FIG. 142, a smart pixel may alsobe fabricated using an active OE film with integrated waveguides,(OE-film-DW). A “smart pixel” may be fabricated by embedding an array ofphotodetectors and VCSELs in a polymer film which may then beelectrically coupled to a chip. The smart pixel of the present inventionis substantially easier to fabricate than conventional smart pixels. AnOE-film-D plays the same role as VCSEL/Photodetector array in aconventional chip-type smart pixel chip. The OE-film-has the advantagethat comparatively expensive semiconductor devices are only placed wherethey are necessary in the OE-film-D. This may result in potential costsavings. Additionally, the polymer film facilitates the processing ofvias, pads, and electrical lines.

FIG. 135 shows an illustration of an embodiment in which there isboth-side packaging. As shown in the cut-out side view of FIG. 135, afirst passive waveguide substrate communicates optical signals to an OEbackplane layer and hence to a second passive waveguide substrate. OEfilm substrates with active layers may be connected to both sides of thefirst and second passive waveguide substrates. This permits chips orMCMs to be coupled to both sides of each passive waveguide. As shown inthe perspective view of FIG. 135, this facilitates a three-dimensionalmodule. Preferably additional support members (not shown in FIG. 135)are used, as required, to provide the requisite mechanical strength tothe three dimensional module.

The present invention may be extended to include OE printed circuitboards or mother boards. As shown in FIG. 143, an OE printed circuitboard is preferably optically coupled to an OE MCM using forty-fivedegree mirror optical couplers, although other optical couplers couldalso be used. Electrical outputs in each chip control the VCSELs in eachOE MCM. The emitted light of some of the VCSELs may be coupled to otherchips (intra MCMs). However, the light from other VCSELs may be coupledto the OE PCB from the backside to the OE-film, permitting opticalcommunication to other elements, such as other OE MCMs.

FIG. 144 shows a stacked OE film structure used for both intra-MCM andinter MCM optical connection. A first OE/film with optical emitters anddetectors is used for intra-MCM optical interconnections. As shown inFIG. 144, the first film may, for example, optically interconnect fourchips. The first OE/film is also coupled to a second OE-film. The secondOE-film has passive waveguides that may be used for inter-MCM (e.g.,inter-board) optical interconnections. As shown in FIG. 144, the secondfilm may, for example, couple four four-chip MCMs on a board. Separateoptimization of the waveguide dimensions of the first OE-film and thesecond (passive) OE film is possible. As shown in FIG. 144, thewaveguides and couplers in the second passive film may, for example,have larger apertures corresponding to a large beam spot size.Preferably, the photodetector apertures are also correspondinglyenlarges in accordance with the beam spot size of the waveguide coupler.Appropriate electrical connections are made by vias to electricalboards.

FIGS. 145 and 146 shows alternate embodiments of a stacked OE filmstructure used for both intra-MCM and inter-MCM (e.g., intra-boardinterconnections). As shown in FIGS. 145-146, the function of an activefilm incorporating waveguides, detectors, and optical emitters, may beimplemented with a combination of passive waveguide films and activedevice films. This may, potentially, lead to a higher yield than theembodiment of FIG. 144.

In summary, the method of the present invention enables electronicdevices and components and a wide variety of active and passiveelectro-optic devices to be embedded in a film in a manner consistentwith the efficient optical transmission of signals to otherelectro-optic devices in an interposer, multi-chip module, orinter-multi-chip package. The method of the present invention may begeneralized to fabricate a variety of passive waveguide film structures;films with embedded electro-optic and electrical devices; and filmshaving both passive waveguides and active electro-optic devices. Theability to maintain the planarity of a single film and to extend viasand conventional Z connections through a signal film enables complexthree-dimensional stacks of films to be fabricated. This flexibility isextremely useful in designing a high-yield, low cost, high-speedmulti-chip module, substrate, optical link module, etc., to couplesignals between a plurality of chips, CSPs, MCMs, or boards.

FIG. 154 show an additional embodiment 900 of the Z-direction opticalcoupling and Z-direction optical bus structures previously describedwith respect to FIGS. 71-73 and 109. Three-dimensional optical module900 comprises a plurality of opto-electronic layers 905A-905E disposedover and above one another in a stacked arrangement, a plurality ofZ-connector arrays 920A-920E disposed between layers 905, a holding unit910 which holds the Z-connector arrays 920, and a plurality of verticalcoupling elements 931-933. Each opto-electronic layer 905 has one ormore edges, one or more optical waveguides 907-909, and usually one ormore opto-electronic devices 904A-904C. In preferred embodiments, thelayers 905 have the same shape, and have at least one of their edgesaligned to one another. Unit 910 comprises a central body 911, and aplurality of sheet portions 912 extending from the central body andseparated from one another by a plurality of gaps 914. Selected ends ofthe opto-electronic layers 905 are inserted into gaps 914, such as shownby the bottom layer 905E. Each Z-connector array 920 comprises aplurality of Z-connector segments 922 held by a respective sheet portion912. The Z-connector arrays 920 are preferably disposed such that thearrangements of Z-connector segments are aligned to one another toprovide a plurality of Z-direction waveguides. Each such Z-directionwaveguide traverses through the layers 905 and the extended sheetportions 912, and comprises a Z-connector segment 922 from each of theZ-connector arrays 920A-920E. The Z-connector arrays are preferablypositioned adjacent to the edges of the layers, nearer thereto than tothe center of the layers.

Selected waveguides 907-909 of layers 905 have portions or ends whichare located near the aligned edges of the layers and disposed so thateach portion or end lies above a Z-connector segment 922 and/or liesbelow a Z-connector segment, and therefore lies within the optical pathof a Z-direction waveguide. A vertical optical coupler may be placed ata point where such a waveguide portion or waveguide end intersects witha Z-direction waveguide in order to route a light beam from the layerwaveguide to the Z-direction waveguide, or vice versa. For example,vertical coupler 931 directs light from a Z-connector segment 922 intoan X-direction waveguide 907 on layer 905A. This light from thisZ-connector segment may original from a layer disposed above layer 905A,or from a light-emitter or fiber disposed at the upper end of unit 910(shown in FIG. 158). As another example, vertical coupler 932 directslight from X-direction waveguide 908 on layer 905A into a Z-connectorsegment 922. As yet another example, vertical coupler 933 directs alight beam in one Z-direction waveguide into a Y-direction waveguide909, and another vertical coupler 934 directs the light beam fromY-direction waveguide 909 into a different Z-direction waveguide, asshown in the figure. In this way, a light beam may be directed from oneZ-direction waveguide to another. In the above examples, verticalcouplers 931-934 comprise mirrors, but may comprise diffraction gratingsand other types of reflecting devices.

In general, the vertical optical couplers may comprisetotally-reflecting mirrors, semi-transparent mirrors (e.g., beamsplitters), grating structures, wavelength filters, optical pass-throughholes (e.g., a Z-connector segment), and opaque light blockers. Thevertical optical couplers can be configured to provide a variety ofsignal routing configurations, such as:

1:1 coupling of light from the Z-direction waveguide to the layer (X-Y)waveguide;

1:1 coupling of light from the layer (X-Y) waveguide to the Z-directionwaveguide;

1:N coupling of light from one Z-direction waveguide to a plurality of Nlayer waveguides distributed on N layers;

1:N coupling of light from one layer waveguide to a plurality of NZ-direction waveguides distributed on N layer;

N:1 coupling of light from a plurality of Z-direction waveguides to onelayer waveguide;

N:1 coupling of light from a plurality of N layer waveguides distributedon N layers to one Z-direction waveguide; and

wavelength division multiplexing and demultiplexing.

FIGS. 155, 156-1, and 156-2 are schematic cross-sectional views ofmodule 900 showing examples of the above signal routing configurationswith different layers 905F-905Q. In each of layers 905F-905Q, thecladding layers are shown with a stipple fill pattern, while the innercore layer is shown with a clear fill pattern. In FIG. 155, a light beam941 within a waveguide 942 on a layer 905F is directed by a mirror 944onto a Z-direction waveguide 943 of a Z-direction waveguide and downwardthrough layers 905G and 905H to layer 9051, where it is directed by asemi-transparent mirror 948 into a layer waveguide 947. This exampleshows 1:1 coupling of light between a layer waveguide and a Z-directionwaveguide, in both directions. The light beam passes through thecladding layers of layers 905G and 905H with a small amount ofattenuation, rather than being reflected, because the beam is directedperpendicular to the cladding layers. The semi-transparent mirror 948also causes attenuation due to partial transmission of the incidentlight through mirror 948. If desired, an optical pass-through hole, suchas shown at 953 in the figure, can be used to convey the beam throughlayers 905G and 905H. The pass-through hole replaces the portions of thecladding layer traversed by the light beam with core material.

Also in FIG. 155, a light beam 951 on a Z-direction waveguide 959 issplit and distributed to three waveguides 945-947 on three differentlayers 905G-9051. Beam 951 passes through layer 905F through an opticalpass-through hole 953 to an optical grating 954 in layer 905G. Grating954 divides a fraction of light beam 951 and directs it into waveguide945. The remaining fraction progresses through a Z-connector segment toa second optical grating 955 in layer 905H. Grating 955 divides afraction of light beam 951 and directs it into waveguide 946. Theremaining fraction progresses through a Z-connector segment to anoptical mirror 956 in layer 9051. From there, the remaining fraction isdirected into waveguide 947. This example shows 1:N coupling of lightfrom one Z-direction waveguide to a plurality of N layer waveguidesdistributed on N layers. The directions of the light beams may bereversed to show N:1 coupling of light from a plurality of N layerwaveguides one Z-direction waveguide. In this case, attenuation arisesat mirrors 954 and 955 due to their semi-transparent (implying partiallyreflecting) characteristics. In either example, gratings 954 and 955 canbe replaced by half-mirrors, or semi-transparent mirrors.

FIG. 155 also shows the combination of light beams 941 and 951 from twoZ-direction waveguides 949 and 959, respectively, onto a singlewaveguide 947 of layer 905I by mirrors 948 and 956. The direction of thelight beams may be reversed to show light from waveguide 947 being splitinto two Z-direction waveguides 949 and 959.

FIG. 156-1 shows how two or more light beams having differentwavelengths may be combined onto, or multiplexed onto, a singleZ-direction waveguide. A source of light 961 has two light beams atwavelengths λ₁ and λ₂, respectively, and is present on a Z-directionwaveguide 969. The waveguide 969 conveys light 961 to a wavelengthfilter 964 (e.g., a diffraction grating, or a multi-layer dielectricfilter) in layer 905J, which separates out a portion of the beam havingwavelength λ₁ and directs it to a layer waveguide in layer 905J, asshown in the figure. The gratings in filter 964 are spaced according tothe wavelength λ₁ in order to filter out the light beam at thatwavelength. The remainder of light 961 is conveyed down to a secondwavelength filter 965 in layer 905K, which separates out a portion ofthe beam having wavelength λ₂ and directs it to a layer waveguide inlayer 905K. The gratings in filter 965 are spaced according to thewavelength λ₂ in order to filter out the light beam at that wavelength.The remainder of light 961, which contains light beams at bothfrequencies, is conveyed down to a light blocking device 966 in layer905L, which prevents the light beams from propagating into layers 905Land 906M. In this way, light beams having different wavelengths may beseparated from a common Z-direction waveguide (i.e., de-multiplexed) anddirected to separate layers 905. Instead of blocking the light byblocking device 966, it is also possible to release the light out of thesystem by conveying it perpendicular to layers 905L and 905M.

FIG. 156-1 also shows a structure where two light beams having differentwavelengths λ₁ and λ₂, and originating in different waveguides ondifferent layers 905L and 905M, are combined (multiplexed) together ontoa single Z-direction waveguide 979. The light beam on layer 905L haswavelength λ₁ and is combined onto Z-direction waveguide 979 by halfmirror 975. The light beam on layer 905M has wavelength λ₂ and iscombined onto Z-direction waveguide 979 by half mirror 976. The combinedbeams pass through optical pass-through holes 973 and 974. Opticalgratings, or multi-layer dielectric filters, tuned to the specificwavelengths may be used instead of half-mirrors, and additional lightbeams may be multiplexed onto Z-direction waveguide 979 by usingadditional half-mirrors, gratings, or multi-layer dielectric filters.The optical routing structures shown in FIG. 156-1 show how severaldifferent wavelengths of light may be combined on a single Z-directionwaveguide to increase the optical density and effective size of thevertical optical device without increasing the physical size of the busIn this regard, it is pointed out that wavelength filters requiresapproximately the same amount of space as standard mirrors.

FIG. 156-2 also shows how two or more light beams 961′ and 971′ havingdifferent wavelengths λ₁ and λ₂ and present on two different Z-directionwaveguides 969′ and 979′, respectively, may be combined onto, ormultiplexed onto, a single waveguide of a layer 905N. The combinationmay be accomplished by the placement of a wavelength filter 964, tunedto λ₁ as previously described, at the intersection of Z-directionwaveguide 969′ and the waveguide of layer 905N, and by the placement ofa wavelength filter 965, tuned to λ₂ as previously described, at theintersection of Z-direction waveguide 979′ and the waveguide of layer905N. The same may be accomplished by using semi-transparent mirrors 975and 976 instead, as illustrated for a layer 9050. FIG. 156-2 also showshow a light beam on a layer 905Q and having different wavelengths λ₁ andλ₂ may be separated onto, or de-multiplexed onto, two differentZ-direction waveguide segments by use of wavelength filters 964′ and965′.

The structure structures shown in FIGS. 154 through 156-2 enable one toroute light signals freely by just designing the distribution ofphotonic Z-connection devices on the layers that are inserted betweenthe arrays of Z-direction waveguides. The same photonic Z-connectiondevices can be used for any routing as a common platform, and the arrayof Z-waveguides can provide a common platform for implementing a varietyof different opto-electronic systems.

FIG. 157 shows several examples of the routing of optical signals withinmodule 900. Two holding units 910A and 910B are shown. The number ofholding units 910 may be increased to the number of sides in each layer905. A mirror, semi-transparent mirror, grating, or wavelength filtermay be formed at each cross point where the direction of the light beamis changed.

FIG. 158 shows how light emitting devices 981, and optic fibers 982 maybe coupled to the end surfaces of holding unit 910. Each fiber 982 maybe attached to the surface of holding unit 910 by an MT-type mountingdevice 983. Each fiber 982 and light emitting device 981 is mounted overa respective segment 922 of a Z-direction waveguide and directs lightdown into the Z-direction waveguide.

Holding unit 910 may be constructed in a number of ways. In one way, asshown in FIG. 159, a cladding layer is formed on a support substrate908, and the following steps are then repeated until a desired height ofholding unit 910 is obtained:

1. Forming a core layer over the last-formed cladding layer;

2. Patterning the core layer to leave segments 922 of core material;

3. Forming a cladding layer over the patterned core layer; and

4. Polishing the resulting surface, such as by chemical-mechanicalpolishing, to make it more planar.

Thereafter, gaps 914 are formed, such as by laser cutting or dicing sawcutting.

In another method, as shown in FIG. 160, a block of photo-refractivematerial is formed, then exposed to actinic radiation 990 through a mask991, as shown in FIG. 160. Mask 991 has a plurality of apertures 992corresponding to the locations where the Z-direction waveguides andcorresponding Z-connector segments 922 are to be formed. Thephotorefractive material may comprise, for example, DuPont's hologrammaterial. By exposing light of a wavelength specified by the material'smanufacturer, the index of refraction of the material along the lightdirection defined by the mask apertures 992 can be altered to convertthe material from cladding material to core material. The conversionprocess begins first with the material closest to the mask aperture 992,and progresses downward. The initial conversion of the material closestto the aperture focuses the light 990 to the desired path of theZ-direction waveguide, and because of this, the process is called theSelf-Organized Lightwave NETwork (SOLNET) process. Mask 991 may be madefrom any opaque material, such as metal. After exposure to actinicradiation 990, gaps 914 may be formed, such as by laser cutting ordicing saw cutting. The above methods enable the Z-direction waveguidesand gaps to be easily formed and mass produced.

FIG. 161 show an additional embodiment 900 of the Z-direction opticalcoupling and bus structures previously described with respect to FIGS.71 and 109-111. Three-dimensional optical module 1000 comprises aplurality opto-electronic (OE) waveguide layers 1005 interleaved with aplurality of opto-electronic/chip layers 1012. The OE waveguide layers1005 comprise waveguides 1007 (core material, shown in clear fill inFIG. 161) embedded in cladding material, which is shown in astipple-pattern fill in the figure. The OE waveguide layers 1005 alsocomprise vertical optical couplers, such as mirrors 1008 and gratings1009 (or multi-layer dielectric filters and other wavelength filters),as required by the desired routing of optical signals. In FIGS. 161-169,only waveguides are shown in OE waveguide layers 1005 for visualsimplicity, but is should be understood that layers 1005 may compriseopto-electronic devices, such as VCSELs, Photo-diodes, optical switches,etc., in addition to waveguides. Each opto-electric/chip layer 1012comprises one or more chips and/or opto-electronic devices 1010A-1010Dembedded in a cladding material. Both types of layers 1005 and 1012comprises respective electrical connection pads 1015 which serve toconvey electrical signals between these layers and to adhere the layersto one another. Both layers may also comprise electrical vias. Lightbeams 1001 external to module 1000 and from adjacent OE waveguide layers1005 are directed vertically through portions of the cladding materialof respective opto-electronic/chip layers 1012, as shown in FIG. 161.These vertically directed beams are located within one or morethree-dimensional volumes 1002, which are preferably located near sidesof module 1000, near to the edges of the layers 1005,1012 than thecenter of the layers. Module 1000 can provide the same ability to routeoptical signals as module 900 shown in FIGS. 154-156.

FIG. 162 shows modified embodiment 1000′ of embodiment 1000 of FIG. 161where the distal ends of opto-electronic/chip layers 1012 have beenshorted so that the vertical coupling of light beams between OEwaveguide layers 1005 occurs within air or other material filled withinthe gaps. All other components of module 1000′ are the same as in module1000.

FIG. 163 shows modified embodiment 1000″ of embodiment 1000 of FIG. 161where blank through-holes 1020 have been formed in opto-electric/chiplayers 1012 at the locations where vertical light beams pass throughlayers 1012. All other components of module 1000″ are the same as inmodule 1000.

FIG. 164 shows modified embodiment 1000′″ of embodiment 1000 of FIG. 161where Z-waveguide segments 1030 or optical lenses 1040 have been placedin opto-electric/chip layers 1012 at the locations where vertical lightbeams pass through layers 1012. All other components of module 1000″ arethe same as in module 1000.

The embodiments of FIGS. 161-164 provide simple photonic Z-connectionsand efficient coupling of vertically coupled light beams.

FIG. 165 shows a modified module 1050 of module 1000 of FIG. 161. Module1050 is identical to module 1000 with the exception that the gapsbetween layers 1005 and 1012 are filled with photo-refractive material1052 (a photo-refractive bonding sheet may be used for this purpose, aspreviously described above with reference to FIG. 72). Photo-refractivematerial 1052 is exposed to patterned actinic radiation to formZ-waveguide segments 1054 in photo-refractive material 1052 at thelocations where vertical light beams are located. The SOLNET process ispreferably used to define the segments 1054. (The photo-refractivematerials shown in FIGS. 165-169 is shown by a cross-hatch fillpattern.)

FIG. 166 shows a modified module 1050′ of module 1000′ of FIG. 162.Module 1050′ is identical to module 1000′ with the exception that thegaps between layers 1005 and 1012′ are filled with photo-refractivematerial 1052. Photo-refractive material 1052 is exposed to patternedactinic radiation to form Z-waveguide segments 1054′ in photo-refractivematerial 1052 at the locations where vertical light beams are located.The SOLNET process is preferably used to define the segments 1054′.

FIG. 167 shows a modified module 1050″ of module 1000″ of FIG. 163.Module 1050″ is identical to module 1000″ with the exception that thegaps between layers 1005 and 1012 are filled with photo-refractivematerial 1052, and that the blank through-holes 1020 are filled withphoto-refractive material 1052. Photo-refractive material 1052 isexposed to patterned actinic radiation to form Z-waveguide segments1054″ in photo-refractive material 1052 at the locations where verticallight beams are located. Segments 1054″ pass through the filledthrough-holes 1020. The SOLNET process is preferably used to define thesegments 1054″.

FIG. 168 shows a modified module 1050′″ of module 1000′″ of FIG. 164.Module 1050′″ is identical to module 1000′″ with the exception that thegaps between layers 1005 and 1012 are filled with photo-refractivematerial 1052. Photo-refractive material 1052 is exposed to patternedactinic radiation to form Z-waveguide segments 1054′ in photo-refractivematerial 1052 at the locations where vertical light beams are located.Segments 1054′ abut next to Z-waveguide segments 1030 and lenses 1040 toform composite Z-waveguide segments between layers 1005. The SOLNETprocess is preferably used to define the segments 1054′.

The embodiments of FIGS. 165-168 provide simple photonic Z-connectionsthat are self-aligned and formed in one step, and provide an efficientcoupling of vertically coupled light beams.

FIG. 169 shows a modified module 1060 of module 1000 of FIG. 161. Module1060 is identical to module 1000 with the exception that the gapsbetween layers 1005 and 1012 are filled with photo-refractive material1052, and in that layers 1012 are replaced by layers 1012′ whichcomprise photo-refractive material 1052 in the three-dimensional volumes1002. Photo-refractive material 1052 in the gaps and in layers 1012′ isexposed to patterned actinic radiation to form Z-waveguide segments1054′″ in photo-refractive material 1052 at the locations where verticallight beams are located. Each segment 1054′″ extends through a layer1012′ and one or two gaps one either side. The SOLNET process ispreferably used to define the segments 1054′″. This structure and methodof making provide a module with very high-efficiency Z-directioncoupling with Z-direction waveguides that are self-aligned and formed inone step.

The process previously described with respect to FIGS. 38-41 may beaugmented to include the placement of Z-waveguide segments, lenses,holographic optical elements (HOEs), and diffractive optical elements(DOEs). An example thereof is described with reference to FIGS. 170-176where an exemplary opto-electronic/chip layers 1012′ with an integralZ-waveguide segment, optical lens, electrical via, and twochip/opto-electronic devices.

Referring to FIG. 170, a plurality of electrical traces and pads 331 areformed at the surface of a temporary support substrate 412′. Any of thepreviously described methods of attaching and removing temporarysubstrates may be used (see U.S. Pat. No. 5,258,236 to Arjavalingam etal.). The traces may be formed by any of the wellknown metal formationmethods, and may be formed onto of the surface of substrate 412′, may beembedded within a top material layer of the substrate 412′, or may beembedded into preformed trenches in the top surface of substrate 412′.The latter of which is shown in FIG. 170. Vias posts 333′ are thereafterformed on top of surface 412′, each preferably on top of a pad 331. Thevia posts may be formed by any of the methods previously described forthe formation of via post 333 in FIGS. 38-45.

Referring to FIG. 171, the next step in the process is to attachZ-waveguide segment 1030, optical lens 1040, and twochip/opto-electronic devices 904A and 904B to the top surface oftemporary substrate 412′ (chip/devices 904A and 904B may have anyelectrical and/or optical functions). To do this, a thin polymericadhesive buffer layer 414 may be formed over the surface of substrate412′ by spin coating. Preformed waveguide segment(s) 1030, preformedlens(es) 1040, and chip/optical devices 904A and 904B (and activecomponents) are then set in place and adhered to layer 414. Layer 414may be soft-baked to increase its tackiness, and to reduce the amount ofsolvent evolution in a subsequent cure step if the material of layer 414requires curing and contains solvent. This chip attachment step is thesame step used in the previously-described methods for forming activesubstrate 20 (FIGS. 11-18) and chip layers 350 (FIGS. 38-45), and thereader may refer there for further details. If a seed layer waspreviously used to form pads 331 and via post 333′, then it ispreferable that a thin chromium adhesion layer be formed over the seedlayer before layer 414 is formed. Such an adhesion layer is alsopreferred if material 414 has an unacceptably poor adhesion to theparticular material of substrate 412′. Instead of an optical lens,device 1040 may comprise a holographic optical element, and adiffractive optical element.

As previously describe with respect to FIGS. 11-18 and 38-45, theepitaxial liftoff process may be used to make and set chip/devices 904Aand 905B, and the reader is referred to those sections of theSpecification for further details. An analogous method may be used tomake and set the Z-waveguide segments 1030 and optical lenses 1040.These optical components may be formed onto of a temporary layer whichcan be later dissolved without disturbing the optical components. Thistemporary layer may be set upon a rigid substrate, if desired. In thecase at hand, a silicon wafer with a thick silicon oxide layer as thetemporary layer may be used. The optical components are formed on top ofthe temporary layer, and separated from one another by etching orpatterning. A top supporting substrate, such as a polymer film like asMylar, is then laminated to the top surfaces of the optical components(e.g., 1030 and 1040), and the entire substrate is then exposed to aetchant which etches glass but not the optical components (e.g.,hydrofluoric acid when the optical devices are made from common polymeroptical materials). The etching results in the release of the opticalcomponents from the temporary layer while still being attached to thetop supporting substrate (e.g., polymer film). The components may thenbe cut from the polymer film, or they may be held by the film untilused. In the latter case, layer 414 is soft-baked to a point where ithas more tacky adhesion force than the laminated top supportingsubstrate. When the component is pressed in the tacky layer 414, it isretained on layer 414 when the top supporting substrate is pulled away,and it is separated from the top supporting substrate.

Instead of using layer 414 to attach chip/devices 904A and 905B,Z-waveguide segments 1030 and optical lenses 1040 to substrate 412′,metal may be deposited on the back surfaces of these components and thetop surface of substrate 412′, and the components may be adhered bysoldering, metal diffusion bonding, transient liquid alloy bonding, AuSnbonding, AuInSn bonding, AuIn bonding, Pd bonding, or other similarbonding processes. Once layer 1012′ is completed, the metal attached tothe bottom surfaces of Z-waveguide segments 1030 and optical lenses 1040is removed, such as by etching in an selective etchant. Also by the timelayer 1012′ is completed, the metal pads at the back surfaces of thechips/devices 904 should be electrically isolated from signal lines onthe bottom surface of layer 1012′ (but a coupling to a fixed ground orbias potential may be used if required by the electrical circuit).

Since a subsequent polishing process is going to be used, chips/devices904 preferably have electrodes 27 which have the multilayer metalstructure 27 x, 27 y, 27 z described above (FIG. 11), with sub-layer 27y comprising a polish-stop metal like tungsten (W). This multilayerstructure is best formed while the IC chips are still in wafer form(i.e., not diced). If the chip has large areas of its surface in whichthere are no electrodes, then it is preferable to deposed an isolatedpatch of polish-stop material in these areas in order to prevent dishingin the subsequent polishing process. Such a polish-stop layer ispreferably formed over the chip's top passivation layer.

While FIG. 171 shows that chips/devices 904 are placed in the face upposition, it may be appreciated that they may be placed in the face downposition. If the pads and electrical traces for the bottom surface oflayer 350 have been formed in the previous steps, it is then possible tonot use adhesion layer 414 and to then directly contact the pads of thechips to the traces of the bottom surface by metal diffusion bonding,solder bonding, WIT connection, transient liquid alloy bonding, etc.Once the chips have been so joined, a high-temperature underfillmaterial may be dispensed under the chips to prevent air pockets.

Referring to FIG. 172, the next step in the process is to form apolymeric cladding layer 416′ over the via posts 333′, chips/devices904, Z-waveguide segments 1030, and optical lenses 1040 and the exposedportions of adhesion layer 414. Layer 416′ will encase these componentsin a single polymeric film. The polymeric layer 416′ is preferablyformed by spin coating the material. After the layer is formed, it iscured if the material requires curing, which is usually the case. If thethickness of the components 904, 1030, and 1040 is greater than about 15μm, two or more separate coating and curing steps may be required forsome polymeric materials, particularly those materials that undergosignificant shrinkage during curing. Cladding layer 416′ has an index ofrefraction which is less than the index of refraction of the core regionof devices 1030 and 1040.

The next step in the process is to expose the tops of via 333′,Z-waveguide segment 1030, lens 1040, and contact pads 27. One approachfor this is to pattern-etch cladding layer 416′ in a controlled mannerto remove those portions of layer 416′ which overlay these tops. Thismay be done by plasma etching with a patterned metal mask disposed onthe top of the substrate. The result of this step is shown in FIG. 173.Another method is to polish the top of the substrate to expose the topsand to provide a more planar surface. Conventional polishing andchemical-mechanical polishing processes may be used, and such polishingtechniques are well known to the art. The result of the polishing stepis shown in FIG. 174. Also shown in FIG. 174, pads 332′ and optionallyelectrical traces 332′ have been formed onto the exposed tops of via333′ and pads 27. At this point, layer 1012′ is fully formed.

At this point, an OE waveguide layer 1005 may be attached to the topsurface of opto-electronic/chip layers 1012′ and secured by contact pads332′, as shown in FIG. 175. Finally, temporary substrate 412′ can beremoved by any of the previously described methods, the result of whichis shown in FIG. 176.

It may be appreciated that the above methods enable one to easilyintegrate preformed optical lenses, holographic optical elements,diffractive optical elements, and Z-direction waveguides intochip/opto-electric layers. These preformed components may be coated withprotective coatings that guard against scratching, and may haveanti-reflective coatings, such as on their side surface to reducereflections and noise in the layer 1012′.

In the preceding fabrication method, the Z-direction waveguides andother components were pre-fabricated, then set in place and encased bycladding layer 416′. It may be appreciated that cladding layer 416′ maybe replaced by a layer of photo-refractive material and then exposed topatterned actinic radiation to define the Z-direction waveguides. Thisapproach is illustrated by FIGS. 177-180. Starting from the constructionshown in FIG. 170, components 904A, 904B, 333′, and 1040 are placed onthe surface of the substrate, as previously described above with respectto FIG. 171. The result of this step is shown in FIG. 177, where aphoto-refractive material layer 414′ has been used in place of bufferlayer 414. Next, a layer 416′ of photo-refractive material is formedover the surface of the substrate in the same manner as layer 416 inFIG. 172 was formed. The resulting structure is shown in FIG. 178. Next,the photo-refractive layer 416′ is selectively exposed to actinicradiation 990 through a mask 991 which has apertures 992 whereZ-waveguide segments 1030 are to be formed. The exposure creates aZ-waveguide segment 1030 which passes through layers 416′ and 414′. Thesubstrate may be finished as previously described to expose the tops ofvia 333′, pads 27, and optical lens 1040, and to attach an OE waveguidelayer 1005.

It may be further appreciated that the above method can be expanded toform lenses, holographic optical elements and diffractive opticalelements in situ within layer 416′. As is known to the art, theseadditional devices can be formed by various methods, such as surfaceetching of layer 416′, film deposition with thickness modulation,modulation of the refractive index of several layers, and selectiveexposure of a photo-refractive material to actinic radiation.

It may be appreciated that the above methods enable one to easilyintegrate optical lenses, holographic optical elements, diffractiveoptical elements, and Z-direction waveguides into chip/opto-electriclayers.

Referring in detail now to FIGS. 181-316 for descriptions of variousadditional preferred embodiments of the inventions, there is seen inFIGS. 181-200 illustrations for supporting an exemplary method of afabrication process of optical interconnect substrates. In FIGS. 181-182electrodes 1200 are formed on a base of substrate 1400 by conventionaldeposition and photo-lithographic steps that are well known to the art.In addition to forming electrodes 1200, alignment marks for furtherprocessing steps may be formed, or these alignment marks may be etchedin the surface of base substrate 1400 prior to forming electrodes 1200.Subsequently, a cladding layer 1600 is formed on base substrate 1400,such as by spin-coating a fluidized polymer, and covers the electrodes1200. Preferably, cladding layer 1600 is manufactured from a materialwhich possesses adhesive capabilities, such as previously mentionedHitachi's fluorinated polyimide OPI-N1005, or a solvent-free(non-gaseous) epoxy materials. The thickness for cladding layer 1600 maybe any suitable thickness, such as from about 1 μm to about 20 μm,preferably from about 5 μm to about 15 μm, after any shrinkage from asubsequent curing step.

Referring now to FIGS. 185-186, a waveguide layer 1800 of optical corematerial is disposed on the cladding layer 1600 by any suitable method,such as by spin coating where the optical core material comprises apolymer material which has been fluidized (i.e., made into a viscousfluid) with a solvent. The fluidized core material may thereforecomprise, for example, Hitachi's fluorinated polymide F-PI-N3405(Hitachi Chemical Co.). Waveguide layer 1800 is then exposed to asoftbaking step to remove the fluidizing solvent, and then to a curingstep which is appropriate for its material composition, such as byexposure to heat, radiation, time, or a combination thereof. Guidelinesfor the softbaking and curing of core material, cladding materials, andelectro-optical materials are provided by the manufacturers. Thethickness of waveguide layer 1800 is preferably less than about 30 μm,and more preferably from about 15 μm to about 25 μm.

After the waveguide layer 1800 has been disposed on the cladding layer1600, optical waveguides 2000 are then defined in waveguide layer 1800by patterning with a conventional dry etch process that employs apatterned etch mask disposed over portions of the waveguide layer 1800which are to be retained. Wet etching may also be employed. In FIGS. 187and 188 waveguide layer portions 1800 a are the sections of thewaveguide layer 1800 which are to be etched or otherwise removed toproduce the layered structures of FIGS. 189 and 190, respectively.

A layer 2400 of cladding material is subsequently formed over theexposed regions of cladding layer 1600 and optical waveguides 2000, asbest shown in FIGS. 191 and 192. This results in the tops and sides ofthe optical waveguide 2000 being covered with cladding material.Subsequently via apertures 2800 may be formed in layers 2400 and 1600 byany number of conventional ways. Such methods includes laser drillingand wet or dry etching using a photo-lithographical defined etch mask.In FIG. 194 one of the via apertures 2800 has a slanted wall 2800s. Oncethe via apertures 2800 are formed, via apertures 2800 may be filled withconductive material 3200 by any conventional filling method, such as bya patterned resist mask 3600 in combinations with chemical vapordeposition (CVD), plating, etc. Metals are preferred for the conductivematerials, with copper or copper mixed with another metal (e.g., achromium and copper mixture, or a nickel and chromium and coppermixture) being one of the more preferred metals.

In FIG. 196, a reflective surface 3200 s (e.g. a mirror, such as mirror639) has been disposed on slanted wall 2800 s. After the deposition ofthe metal, the resist masks 3600 is removed or stripped, such as byetching, to produce the structures illustrated in FIGS. 197 and 198; andthen substrate 1400 is removed by any suitable conventional method toproduce the structures of FIGS. 199 and 200 which may be coupled by anywell known procedure (e.g. solder joining) to a printed circuit board,generally illustrated as 4000 in FIGS. 201 and 202.

Referring now to FIGS. 203-232 there is seen another embodiment ofpresent invention wherein, as best illustrated in FIGS. 205 and 206,after electrodes 1200 are formed, an electro-optic device 1230 (e.g. aVCSEL) is disposed on substrate 1400. Subsequently cladding layer 1600is disposed such as to cover the exposed portions of the substrate 1400and to cover electrodes 1200 and electro optic device 1230 (see FIGS.209 and 210). Any cladding material extending above the electrodes 1200is removed, such as by chemical mechanical polishing (CMP), as bestshown in FIGS. 209 and 210 where cladding layer 1600 has been leveledsuch that the tops of the electrodes 1200 collimate with the polishedcladding layer 1600. In FIG. 212 and opening (or via) 1602 is formed inthe cladding layer 1600 for receiving conductive material 1200 b.Subsequently electrodes 1200 a are disposed on the polished claddinglayer 1600 such as to be in contact with electrodes 1200. In FIG. 212one of the electrodes 1200 a has been placed in conductive contact withconductive material 1200 b. Electrodes 1200 b and exposed portions ofthe polished cladding layer 1600 are then covered as shown in FIGS. 213and 214 with an undercladding layer 1700 which may be formed or producedby spin-coating a fluidized polymer, such as previously indicatedHitachi's fluorinated polyimide. The remaining steps illustrated inFIGS. 215-232 for manufacturing an embodiment of the opticalinterconnect substrates are essentially similar to the steps illustratedin FIGS. 185-202 (i.e., the depositing of the waveguide layer 1800, theformation of the optical waveguides 2000, the depositing of the layer2400, producing via apertures 2800, filling with conductive material3200, and coupling to a printed circuit board 4000). In the embodimentof the invention illustrated in FIGS. 233-258, the substrate 1400 isremoved after coupling to printed circuit board 4000, instead of beforecoupling as illustrated in FIGS. 199-202 and FIGS. 229-232.

Referring now to FIGS. 259-316 for another embodiment of the presentinvention, cladding layer 1600 is disposed on substrate 1400 as shown inFIGS. 259 and 283. This step is followed by depositing waveguide layer1800 to subsequently produce the optical waveguides 2000 afterpatterning with a conventional etch process (i.e. either a dry or a wetetch process) which employs a patterned etch mask disposed overselective portions of the waveguide layer 1800. After formations ofoptical waveguides 2000, the layer 2400 of cladding material issubsequently formed over the exposed regions of cladding layer 1600 andthe formed optical waveguides 2000, as best shown in FIGS. 265, 266, andFIGS. 289 and 290. For the embodiment of the invention illustrated inFIGS. 267-282, after deposition of the layer 2400 of cladding material,via apertures 2800 are formed, followed by depositions of conductivematerial 3200 with the assistance of patterned resist masks 3600 whichis subsequently removed so that substrate 1440 (see FIGS. 273-274) maybe coupled to one exposed side of the deposited conductive material3200. After substrate 1400 (see FIGS. 275-276) is removed to exposeanother side of the deposited conductive material 3200, electrodes 1200are deposited or otherwise formed on the exposed other side of theconductive material 3200 (see FIGS. 277-278). Electrodes 1200 may thenbe coupled to the printed circuit board 4000 as shown in FIGS. 279-280,followed by removal of substrate 1440 (see FIGS. 281-282).

In the embodiment of the invention in FIGS. 291-312, after depositinglayer 2400, electrodes 1200 are then formed on layer 2400 along withdisposing on layer 2400 electro-optic device 1230. Intermediate claddingmaterial 1660 is then disposed as shown in FIGS. 297-298. A polishingstep (e.g. CMP) may then be employed to polish or trim down the topportions of electrodes 1230 such that there is registry among the top ofthe electro-optic device 1230, the tops of the electrodes 1230, andpolished intermediate cladding material 1660 (see FIGS. 299 and 300).Subsequently electrodes 1200 a are disposed on electrodes 1200. In FIG.302 one of the electrodes 1200 is disposed on the electro-optic device1230. Substrate 1440 is then preferably coupled to electrodes 1200 a(see FIGS. 303 and 304), and substrate 1400 may thereafter be removed.Via apertures 2800 may then be formulated in cladding layer 1600 andlayer 2400 down to electrodes 1200 and electro-optic device 1230. Aspreviously indicated, depositions of conductive material 3200 may thenfollow with the assistance of patterned resist marks 3600 (see FIGS. 398and 310) which may be removed, as shown in FIGS. 311 and 312, to leaveexposed portions of the conductive material 3200 that are then coupledto the printed circuit board 4000. Substrate 1440 may be convenientlyremoved to expose electrodes 1200 a and electro-optic device 1230.

Manufacturable techniques for forming optical waveguide and waveguidedevices were described. In the foregoing description, numerous specificdetails, such as layer thickness, process sequences, film compositions,etc. were set forth in order to provide a more thorough understanding ofthe present invention. It will be obvious, however, to one skilled inthe art that the present invention may be practiced without employingsuch specific details. In other instances, well-known process andprocessing techniques have not been described in detail in order not tounnecessarily obscure the present invention.

While diagrams representing preferred embodiments of the presentinvention were illustrated, these illustrations are not intended tolimit the invention. The specific processes described herein are onlymeant to help clarify an understanding of the present invention and toillustrate preferred embodiments of how the present invention may beimplemented in order to form preferred devices. For the purposes ofdiscussion, a semiconductor substrate is a substrate comprising anymaterial or materials used in the manufacture of a semiconductor device.A substrate is a structure on which or to which a processing step actsupon.

While the present invention has been described herein with reference toparticular embodiments thereof, a latitude of modification, variouschanges and substitutions are intended in the foregoing disclosure, andit will be appreciated that in some instances some features of theinvention will be employed without a corresponding use of other featureswithout departing from the scope and spirit of the invention as setforth. Therefore, many modifications may be made to adapt a particularsituation or material to the teachings of the invention withoutdeparting from the essential scope and spirit of the present invention.It is intended that the invention not be limited to the particularembodiment disclosed as the best mode contemplated for carrying out thisinvention, but that the invention will include all embodiments andequivalents falling within the scope of the appended claims.

What is claimed is:
 1. A method of constructing an electronic circuitassembly comprising the steps of: a) forming at least one electrode on asubstrate; b) forming a layer of undercladding material upon thesubstrate and over the electrode; c) forming a wave guide core layer onsaid layer of cladding material; d) patterning said wave guide layer toproduce at least one optical wave guide and exposed undercladdingmaterial; e) forming a layer of overcladding material upon the exposedundercladding material and over the optical wave guide; f) forming atleast one via aperture through said overcladding material and saidundercladding material; and g) disposing a conductive material in saidvia aperture to produce an electronic circuit assembly.
 2. The method ofclaim 1 wherein said disposing step (g) additionally comprises disposinga partial layer of the conductive material over the overcladdingmaterial.
 3. The method of claim 1 additionally comprising forming apatterned resist on the overcladding material prior to said disposingstep (g).
 4. The method of claim 2 additionally comprising forming apatterned resist on the overcladding material prior to said disposingstep (g).
 5. The method of claim 1 wherein said via aperture terminatesin said electrode.
 6. The method of claim 4 additionally comprisingforming a patterned resist on the overcladding material prior to saiddisposing step (g).
 7. The method of claim 1 wherein said forming step(f) additionally comprises removing a portion of the optical wave guide.8. The method of claim 6 wherein said forming step (f) additionallycomprises removing a portion of the optical wave guide.
 9. The method ofclaim 1 wherein said forming step (f) additionally comprises forming aforty-five degree sidewall in said optical wave guide.
 10. The method ofclaim 8 wherein said forming step (f) additionally comprises forming aforty-five degree sidewall in said optical wave guide.
 11. The method ofclaim 9 wherein said disposing step (g) additionally comprises forming aforty-five degree optical reflective surface on said forty-five degreesidewall.
 12. The method of claim 10 wherein said disposing step (g)additionally comprises forming a forty-five degree optical reflectivesurface on said forty-five degree sidewall.
 13. The method of claim 1wherein said forming step (f) additionally comprises forming the viaaperture to have opposed via walls such that a portion of said opticalwave guide is generally centrically disposed in the via aperture betweenthe via walls.
 14. The method of claim 13 wherein said disposing step(g) additionally comprises disposing conductive material on said opposedvia walls and against said portion of said optical wave guide.
 15. Amethod of constructing an electronic circuit assembly comprising thesteps of: a) forming at least one electrode on a substrate; b) disposingan electro-optic device on the substrate; c) forming a layer ofundercladding material upon the substrate and over the electrode and theelectro-optic device; d) disposing a second electrode on the layer ofundercladding material; e) disposing an intermediate layer of claddingmaterial over exposed portions of the layer of undercladding materialand over the second electrode; f) forming a wave guide core layer onsaid layer of cladding material; g) patterning said wave guide layer toproduce at least one optical wave guide and exposed undercladdingmaterial; h) forming a layer of overcladding material upon the exposedundercladding material and over the optical wave guide; i) forming atleast one via aperture through said overcladding material and saidundercladding material; and j) disposing a conductive material in saidvia aperture to produce an electronic circuit assembly.
 16. The methodof claim 15 additionally comprising polishing the layer of the claddingmaterial prior to the disposing step (d) until a top of the electrode isaligned with the cladding material.
 17. The method of claim 15additionally comprising forming, prior to said disposing step (d), anopening in said layer of undercladding material to expose a portion ofthe electro-optic device; and disposing conductive material in saidopening and in contact with said electro-optic device.
 18. The method ofclaim 16 additionally comprising forming, prior to said disposing step(d), an opening in said layer of undercladding material to expose aportion of the electro-optic device; and disposing conductive materialin said opening and in contact with said electro-optic device.
 19. Themethod of claim 15 wherein said disposing step (j) additionallycomprises disposing a partial layer of the conductive material over theovercladding material.
 20. The method of claim 15 additionallycomprising forming a patterned resist on the overcladding material priorto said disposing step (j).
 21. The method of claim 18 additionallycomprising forming a patterned resist on the overcladding material priorto said disposing step (j).
 22. The method of claim 15 wherein said viaaperture terminates in said electrode.
 23. The method of claim 21additionally comprising forming a patterned resist on the overcladdingmaterial prior to said disposing step (j).
 24. The method of claim 15wherein said forming step (i) additionally comprises removing a portionof the optical wave guide.
 25. The method of claim 23 wherein saidforming step (i) additionally comprises removing a portion of theoptical wave guide.
 26. The method of claim 15 wherein said forming step(i) additionally comprises forming a forty-five degree sidewall in saidoptical wave guide.
 27. The method of claim 25 wherein said forming step(i) additionally comprises forming a forty-five degree sidewall in saidoptical wave guide.
 28. The method of claim 26 wherein said disposingstep (j) additionally comprises forming a forty-five degree opticalreflective surface on said forty-five degree sidewall.
 29. The method ofclaim 27 wherein said disposing step (j) additionally comprises forminga forty-five degree optical reflective surface on said forty-five degreesidewall.
 30. The method of claim 15 wherein said forming step (i)additionally comprises forming the via aperture to have opposed viawalls such that a portion of said optical wave guide is generallycentrically disposed in the via aperture between the via walls.
 31. Themethod of claim 30 wherein said disposing step (j) additionallycomprises disposing conductive material on said opposed via walls andagainst said portion of said optical wave guide.
 32. A method ofconstructing an electronic circuit assembly comprising the steps of: a)forming a layer of undercladding material upon a first substrate; b)forming a wave guide core layer on said layer of cladding material; c)patterning said wave guide layer to produce at least one optical waveguide and exposed undercladding material; d) forming a layer ofovercladding material upon the exposed undercladding material; e)forming at least one via aperture through said overcladding material andsaid undercladding material; f) disposing a conductive material in saidvia aperture leaving a first portion of the conductive material exposed;and g) coupling the first portion of the conductive material to a secondsubstrate to produce an electronic circuit.
 33. The method of claim 32additionally comprising removing the first substrate to expose a secondportion of the conductive material.
 34. The method of claim 33additionally comprising disposing at least one electrode on the exposedsecond portion of the conductive material.
 35. The method of claim 34additionally comprising coupling the disposed electrode to anotherelectronic circuit assembly.
 36. The method of claim 33 additionallycomprising removing the second substrate to expose the first portion ofthe conductive material.
 37. The method of claim 35 additionallycomprising removing the second substrate to expose the first portion ofthe conductive material.
 38. A method of constructing an electroniccircuit assembly comprising the steps of: a) forming a layer ofundercladding material upon a first substrate; b) forming a wave guidecore layer on said layer of cladding material; c) patterning said waveguide layer to produce at least one optical wave guide and exposedundercladding material; d) forming a layer of overcladding material uponthe exposed undercladding material and over the optical wave guide; e)disposing an electrode on the layer of overcladding material; f)disposing an electro-optic device on the layer of overcladding material;g) depositing an intermediate layer of cladding material over exposedovercladding material and over the electrode and the electro-opticdevice; h) removing a portion of the intermediate layer of claddingmaterial and a portion of a top of the electrode until a plane along thetop of the electro-optic device registers with a residual electrodesurface and a residual cladding surface respectively remaining afterremoval of the portion of the top of the electrode and the portion ofthe intermediate layer of cladding material; i) disposing a secondelectrode on the residual electrode surface; j) coupling the secondelectrode to a second substrate; k) removing the first substrate toexpose the undercladding material; l) forming at least one via aperturethrough said overcladding material and said undercladding material; andm) disposing a conductive material in said via aperture to produce anelectronic circuit assembly.